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    High speed, controlled impedance air dielectric circuit modules for electronic backplane systems
    135.
    发明申请
    High speed, controlled impedance air dielectric circuit modules for electronic backplane systems 审中-公开
    用于电子背板系统的高速，可控阻抗空气介质电路模块

    公开(公告)号：US20030112091A1

    公开(公告)日：2003-06-19

    申请号：US10273410

    申请日：2002-10-17

    Inventor： Timothy A. Lemke ,  Richard A. Elco

    IPC: H01P005/02

    CPC classification number: H05K1/024 ,  H01P3/08 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K2201/044 ,  H05K2201/09318

    Abstract: A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiment are also integrated with conventional printed circuit backplanes or be a stand-alone device.

    Abstract translation: 一种新颖的背板互连系统，适用于超高速背板系统的电信和数据处理行业。 它能够传输10 GHz及以上带宽的数字信号。 本发明以低成本制造提供高性能。 适用于各种系统应用。 本发明的一个实施例包括在传统背板配置中互连子卡的空气电介质和铜导体匹配阻抗传输线系统。 高速传输线结构通过背板 - 子卡和返回路径是连续的。 这种实施例也与常规印刷电路底板集成或者是独立设备。

    Predistortion generator coupled with an RF amplifier
    136.
    发明授权
    Predistortion generator coupled with an RF amplifier 失效
    预失真发生器与RF放大器耦合

    公开(公告)号：US6107877A

    公开(公告)日：2000-08-22

    申请号：US288906

    申请日：1999-04-09

    Applicant: Philip Miguelez ,  Rudolph Menna ,  Shutong Zhou ,  Timothy Cope

    Inventor： Philip Miguelez ,  Rudolph Menna ,  Shutong Zhou ,  Timothy Cope

    IPC: H03F1/32 ,  H03F1/52 ,  H05K1/02 ,  H05K3/00 ,  H03F1/00 ,  H03F1/26

    CPC classification number: H03F1/523 ,  H03F1/3276 ,  H05K1/0253 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/09972 ,  H05K3/0061

    Abstract: An in-line distortion generator is coupled to an RF amplifier on a single PC board for producing an output signal of useful amplitude but with low composite triple beat and cross modulation distortions. The backplane under the section of the PC board upon which the distortion circuit resides is removed and the portion of the heat sink under the removed portion of the backplane is also removed. This eliminates any parasitic capacitances that could degrade the performance of the RF amplifier, thereby making the distortion circuit transparent to the RF amplifier. Furthermore, the layout of the predistortion circuitry has been specifically designed to enhance the performance of the circuitry without inducing any negative operating characteristics on the associated RF amplifier.

    Abstract translation: 在线失真发生器耦合到单个PC板上的RF放大器，用于产生有用幅度的输出信号，但具有低复合三重拍摄和交叉调制失真。 去除了失真电路所在的PC板部分下的背板，并且除去背板拆卸部分下方的散热器部分。 这消除了可能降低RF放大器性能的任何寄生电容，从而使失真电路对RF放大器是透明的。 此外，预失真电路的布局已经被专门设计用于增强电路的性能，而不会在相关RF放大器上引起任何负的工作特性。

    Circuit structure including RF/wideband resonant vias
    137.
    发明授权
    Circuit structure including RF/wideband resonant vias 失效
    电路结构包括RF /宽带谐振通孔

    公开(公告)号：US5886597A

    公开(公告)日：1999-03-23

    申请号：US825382

    申请日：1997-03-28

    Applicant: Sedki M. Riad

    Inventor： Sedki M. Riad

    IPC: H01P3/08 ,  H05K1/02 ,  H05K1/11 ,  H05K1/16 ,  H05K1/00

    CPC classification number: H01P3/088 ,  H05K1/0224 ,  H05K1/0239 ,  H05K1/025 ,  H05K1/162 ,  H05K1/112 ,  H05K1/115 ,  H05K2201/09318

    Abstract: A resonant via-type connection between layers of a multilayer support structure having, at predetermined RF frequencies, a very low, effectively short circuit impedance. The resonant vias utilize the inductance of a via post by forming it into a resonant circuit with a capacitance at the via's distal end coupled to another conductor. A plurality of resonant vias can be formed having respective plurality of resonant frequencies to form a wideband connection. The capacitances at the vias' distal ends coupling to another conductor can be formed to resonate with the total series inductance of the via post and of wire connections to an attached device.

    Abstract translation: 在多层支撑结构的层之间的谐振通孔型连接，其具有预定的RF频率，非常低的，有效的短路阻抗。 谐振通孔通过将通孔的电感形成谐振电路，其中电容在通孔的远端耦合到另一导体。 可以形成多个谐振通孔，其具有相应的多个谐振频率以形成宽带连接。 通孔的远端耦合到另一个导体的电容可以形成为与通孔的总串联电感和与连接的器件的电线连接共振。

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