公开(公告)号：US20020136873A1

公开(公告)日：2002-09-26

申请号：US09812449

申请日：2001-03-20

Inventor： Delin Li ,  Richard Keith McMillan

IPC: H05K001/11 ,  B32B003/00 ,  H05K003/10 ,  B32B015/00

CPC classification number: H05K3/429 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.

Abstract translation: 一种用于制造具有金属化孔38,40,130,132的多层电路板的方法10,110，其可以选择性地和电接地并且具有至少一个形成的空气桥92,178。

公开(公告)号：US20020130756A1

公开(公告)日：2002-09-19

申请号：US10094502

申请日：2002-03-08

Inventor： Waldemar Brinkis ,  Erich Mattmann

IPC: G01L001/22

CPC classification number: H05K3/44 ,  G01L1/2287 ,  H05K1/053 ,  H05K1/092 ,  H05K1/167 ,  H05K3/4061 ,  H05K2201/0195 ,  H05K2201/09554 ,  H05K2201/10151 ,  H05K2203/0315

Abstract: An electrical circuit having at least one electrical component, in particular a strain-sensitive resistor and conductor tracks which are applied to a metallic carrier with the intermediate positioning of at least one insulating layer, at least one further conductor track, which is connected to at least one conductor track of the circuit, is applied to the surface of the metallic carrier. The invention also relates to methods for manufacturing the electrical circuit.

Abstract translation: 具有至少一个电气部件的电路，特别是应变敏感电阻器和导体轨道，其被施加到具有至少一个绝缘层的中间定位的金属载体上，至少一个另外的导体轨道连接到 电路的至少一个导体轨迹被施加到金属载体的表面。 本发明还涉及制造电路的方法。

公开(公告)号：US06412168B1

公开(公告)日：2002-07-02

申请号：US09655750

申请日：2000-09-06

Applicant: Andrew Z. Glovatsky ,  Jay D. Baker

Inventor： Andrew Z. Glovatsky ,  Jay D. Baker

IPC: H01K310

CPC classification number: H05K3/4038 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26.

Abstract translation: 具有选择性地形成的孔或腔26的多层电子电路板设计10

公开(公告)号：US06323439B1

公开(公告)日：2001-11-27

申请号：US09386334

申请日：1999-08-31

Applicant: Rokuro Kambe ,  Toru Matsuura

Inventor： Rokuro Kambe ,  Toru Matsuura

IPC: H01R909

CPC classification number: H05K3/429 ,  H05K3/0038 ,  H05K3/44 ,  H05K3/4608 ,  H05K2201/09454 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/09736 ,  H05K2201/09745 ,  Y10T29/49165

Abstract: A multilayer resin wiring board includes a metal core substrate having a first main surface and a second main surface; a plurality of wiring layers located on the first and second main surfaces of the metal core substrate; a plurality of insulating resin layers, each intervening between the metal core substrate and the wiring layers and between the metal core substrate and the wiring layers and between the wiring layers; and a via formed on the wall of a through hole for connection to the metal core substrate extending through the insulating resin layers and the metal core substrate so as to establish electrical conductivity to the metal core substrate. The metal core substrate has a thin portion which is thinner than the remaining portion of the metal core substrate. The through hole for connection to the metal core substrate is formed through the thin portion by laser machining.

Abstract translation: 多层树脂配线板包括具有第一主表面和第二主表面的金属芯基板; 位于金属芯基板的第一和第二主表面上的多个布线层; 多个绝缘树脂层，各自介于金属芯基板和布线层之间，金属芯基板和布线层之间以及布线层之间; 以及形成在通孔的壁上的通孔，用于连接到延伸穿过绝缘树脂层和金属芯基板的金属芯基板，以便建立对金属芯基板的导电性。 金属芯基板具有比金属芯基板的剩余部分薄的薄部。 用于连接到金属芯基板的通孔通过激光加工形成在薄部分上。

公开(公告)号：US20010011605A1

公开(公告)日：2001-08-09

申请号：US09779117

申请日：2001-02-08

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H05K003/36 ,  C09J001/00 ,  B65H029/00 ,  B32B031/00

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

Abstract translation: 用于微电子电路板之间的互连的插入件在其表面具有接触。 每个接触件从中心导体延伸，并且具有适于从中心导体径向向内收缩的外围部分，以响应由在所接合的电路板上限定中心孔的接触垫施加的力。 因此，当电路板被内插件压缩时，触头径向向内收缩并且擦拭穿过焊盘。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

公开(公告)号：US5786986A

公开(公告)日：1998-07-28

申请号：US283922

申请日：1994-08-01

Applicant: Mark Fielding Bregman ,  Stephen Leslie Buchwalter ,  Karl Hermann ,  Caroline Ann Kovac ,  Paige Adams Poore ,  Alfred Viehbeck

Inventor： Mark Fielding Bregman ,  Stephen Leslie Buchwalter ,  Karl Hermann ,  Caroline Ann Kovac ,  Paige Adams Poore ,  Alfred Viehbeck

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K7/20

CPC classification number: H05K3/462 ,  H01L23/5385 ,  H01L24/00 ,  H05K1/144 ,  H05K3/445 ,  H01L2924/14 ,  H05K1/0272 ,  H05K1/056 ,  H05K2201/0154 ,  H05K2201/0314 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0323 ,  H05K2203/041 ,  H05K2203/1184 ,  H05K2203/1438 ,  H05K3/321 ,  H05K3/325 ,  H05K3/429

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates each having a thermally and/or electrically conductive core surrounded by a dielectric material. The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

Abstract translation: 用于在其上安装电子设备的结构。 该结构由多个基板制成，每个基板具有由电介质材料包围的热和/或导电芯体。 基板可以与提供接地和电源平面的导电芯贴附放置在一起，或者基板可以安装在一起，连接器将相邻的基板电连接并将相邻的基板间隔开，从而提供流体可以流动的空间，以提取由 安装在其上的电子设备。 导电芯为结构提供电源和接地平面以及用于热耗散所产生的热量的装置。

公开(公告)号：US5416278A

公开(公告)日：1995-05-16

申请号：US024046

申请日：1993-03-01

Applicant: Fred E. Ostrem ,  Alfred G. Ocken

Inventor： Fred E. Ostrem ,  Alfred G. Ocken

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K3/44

CPC classification number: H05K3/44 ,  H05K3/363 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/111 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/10666 ,  H05K2201/10977 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/4038

Abstract: A method for constructing a feedthrough via connection and a corresponding apparatus includes a metallic plate (101), or rigidizer, preferably composed of an aluminum material. A solderable contact area (103), is located on the plate (101). This contact area (103) is preferable comprised of a copper material selectively disposed by a plasma spraying process. Next, an electrically insulating adhesive layer (105) is disposed onto the plate (101). This adhesive layer (105) has a feedthrough via (106) disposed therethrough aligned with the contact area (103). Then, a substrate (109), preferably composed of a flexible composite polyimide material, is disposed onto the adhesive layer (105). This flexible substrate (109) has a via (110) disposed therethrough with a solderable area (111) disposed thereon. Then, a quantity of solder (113) is disposed onto the solderable area (111), and the assembly (100) is heated so that the solder (113) flows into the vias (106) and (110), thereby providing an electrical connection including the solderable area (111) of the via (110), the solder (113), and the contact area (103). During this reflow step, the structure of the adhesive layer (105) acts as a soldermask preventing the solder (113) from flowing outside of an area defined by the via (106).

Abstract translation: 通过连接构造馈通方法和相应的装置包括优选由铝材料组成的金属板（101）或刚性机构。 可焊接接触区域（103）位于板（101）上。 该接触区域（103）优选由通过等离子体喷涂工艺选择性地设置的铜材料构成。 接下来，将电绝缘性粘合剂层（105）设置在板（101）上。 该粘合剂层（105）具有穿过通孔（106），其穿过与接触区域（103）对齐。 然后，将优选由柔性复合聚酰亚胺材料构成的基板（109）设置在粘合剂层（105）上。 该柔性基板（109）具有穿过其中设置有可焊接区域（111）的通孔（110）。 然后，将一定量的焊料（113）设置在可焊接区域（111）上，并且组装（100）被加热，使得焊料（113）流入通孔（106）和（110），从而提供电气 包括通孔（110）的可焊接区域（111），焊料（113）和接触区域（103）的连接。 在该回流步骤期间，粘合剂层（105）的结构用作焊接掩模，防止焊料（113）流过由通孔（106）限定的区域的外部。

公开(公告)号：US5038252A

公开(公告)日：1991-08-06

申请号：US302008

申请日：1989-01-26

Applicant: Lennart B. Johnson

Inventor： Lennart B. Johnson

IPC: H01R43/00 ,  H01R12/04 ,  H01R12/32 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/30 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K1/0263 ,  H05K3/4641 ,  H05K1/056 ,  H05K2201/09472 ,  H05K2201/09554 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K3/0061 ,  H05K3/308 ,  H05K3/429

Abstract: Printed circuit board with internal laterally extending electrically conductive element and perpendicularly thereto extending conductive element larger at a pin-receiving level than at the laterally extending conductive element level.

Abstract translation: 具有内部横向延伸的导电元件并且垂直于其的导电元件的印刷电路板以比在横向延伸的导电元件水平处的销接收水平更大的导电元件。

公开(公告)号：US20240008178A1

公开(公告)日：2024-01-04

申请号：US18253892

申请日：2021-10-29

Applicant: NITTO DENKO CORPORATION

Inventor： Shusaku SHIBATA ,  Takahiro IKEDA ,  Teppei NIINO

IPC: H05K1/11 ,  H05K3/44

CPC classification number: H05K1/113 ,  H05K3/44 ,  H05K2201/09481 ,  H05K2201/09554 ,  H05K2201/09618 ,  H05K2201/09609 ,  H05K2201/0979 ,  H05K1/056

Abstract: A wiring circuit board includes a metal supporting board; an insulating layer; and a conductive layer in this order in a thickness direction. The conductive layer includes a terminal portion, and a tail line portion extending from the terminal portion. The terminal portion has a via portion that penetrates the insulating layer in the thickness direction and is connected to the metal supporting board. The tail line portion has a base end portion that has a width different from a width of the terminal portion in a direction orthogonal to the extending direction of the tail line portion and that is connected with the terminal portion; and a second via portion that penetrates the insulating layer in the thickness direction and that is connected to the metal supporting board.

公开(公告)号：US20170365556A1

公开(公告)日：2017-12-21

申请号：US15486403

申请日：2017-04-13

Applicant: MIYOSHI ELECTRONICS CORPORATION

Inventor： Kazuhito MORI

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H01L25/07 ,  H01L23/367

CPC classification number: H01L23/5386 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/32 ,  H01L25/072 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/181 ,  H05K3/4053 ,  H05K2201/09554 ,  H05K2203/049

Abstract: There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus includes a dielectric substrate, an electronic component, a heat spreader, and a conductive via. The conductive via electrically and thermally connects the electronic component and the heat spreader. The conductive via extends from the first surface to at least an interior of the heat spreader and is in surface-contact with the heat spreader.