公开(公告)号：US4604677A

公开(公告)日：1986-08-05

申请号：US525250

申请日：1983-08-16

Applicant: Go Suzuki ,  Kazuo Michisita

Inventor： Go Suzuki ,  Kazuo Michisita

IPC: H01L21/48 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/147 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49861 ,  H01L23/5385 ,  H01L25/105 ,  H01L25/16 ,  H05K1/141 ,  H05K3/0014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/19041 ,  H01L2924/3511 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/183 ,  H05K2201/045 ,  H05K2201/10477 ,  H05K2203/302 ,  H05K3/3442 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A ceramic structural body having electronic components thereon comprises a ceramic package of a ceramic layer having substantially uniform thickness. The package comprises a ceramic element of dish-shaped or box-shaped configuration including a base portion, a sidewall portion extending from the base portion substantially at right angles thereto and a flange portion extending from the free end of the sidewall portion substantially at right angles thereto. The ceramic package is formed by press-forming a ceramic green sheet having substantially uniform thickness. A plurality of metal layers are provided on the surface of desired portions of the ceramic element.

Abstract translation: 其上具有电子部件的陶瓷结构体包括具有基本均匀厚度的陶瓷层的陶瓷封装。 该包装包括一种盘形或箱形结构的陶瓷元件，其包括基部，从基部大致直角延伸的侧壁部分和从侧壁部分的自由端基本直角延伸的凸缘部分 到此。 通过压制形成具有基本均匀厚度的陶瓷生片来形成陶瓷封装。 在陶瓷元件的所需部分的表面上设置多个金属层。

公开(公告)号：US3461552A

公开(公告)日：1969-08-19

申请号：US3461552D

申请日：1966-01-19

Applicant: DIGITRONICS CORP

Inventor： WOLF EDGAR ,  LAU EDWARD H ,  BEREZIN EVELYN

IPC: H01L21/48 ,  H01L25/10 ,  H05K1/00 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K3/32

CPC classification number: H01L21/486 ,  H01L25/105 ,  H01L2225/1005 ,  H01L2924/0002 ,  H05K1/0287 ,  H05K3/222 ,  H05K3/305 ,  H05K3/34 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10689 ,  H05K2201/10962 ,  Y10T29/49004 ,  Y10T29/49153 ,  H01L2924/00

公开(公告)号：US3052823A

公开(公告)日：1962-09-04

申请号：US74168058

申请日：1958-06-12

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/0919 ,  H05K2201/09645 ,  H05K2201/09845 ,  H05K2201/10053 ,  H05K2201/10477 ,  H05K2203/063

公开(公告)号：US2769119A

公开(公告)日：1956-10-30

申请号：US21312551

申请日：1951-02-28

Applicant: STANDARD COIL PROD CO INC

Inventor： LORING MARTIN ROBERT ,  KEITH NELSON EDWIN

IPC: H01G4/28 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01G4/28 ,  H05K1/182 ,  H05K3/301 ,  H05K3/325 ,  H05K3/3442 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/10393 ,  H05K2201/10469 ,  H05K2201/10477 ,  H05K2201/10583 ,  H05K2201/10643 ,  Y02P70/611 ,  Y02P70/613

公开(公告)号：US20180254507A1

公开(公告)日：2018-09-06

申请号：US15972347

申请日：2018-05-07

Applicant: Verily Life Sciences LLC

Inventor： Brian Marc Pepin ,  Hojr Sedaghat Pisheh ,  Dat Phung ,  James Etzkorn

IPC: H01M10/04 ,  H01M2/22 ,  H01M10/052 ,  H05K3/32

CPC classification number: H01M10/0436 ,  H01M2/22 ,  H01M10/052 ,  H01M2220/30 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10037 ,  H05K2201/10477

Abstract: An example device includes a lithium-based battery having conductive battery contacts protruding from a surface of the battery, where a non-conductive potion of the surface of the battery separates the conductive battery contacts. The battery is a type that undergoes an expansion during charging in which the expansion of the lithium-based battery includes an outward bulging of the non-conductive portion of the battery surface. The device includes a substrate having conductive substrate contacts. The conductive battery contacts are electrically connected to the respective conductive substrate contact via a flexible electrically-conductive adhesive that physically separates the conductive battery contacts from the respective conductive substrate contacts and allows for relative movement therebetween caused by the expansion of the lithium-based battery.

公开(公告)号：US09780054B2

公开(公告)日：2017-10-03

申请号：US14529881

申请日：2014-10-31

Applicant: INTEL CORPORATION

Inventor： John S. Guzek ,  Javier Soto Gonzalez ,  Nicholas R. Watts ,  Ravi K Nalla

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/498 ,  H01L23/538 ,  H01L25/03 ,  H01L25/10 ,  H05K1/18 ,  H01L21/768 ,  H01L25/07 ,  H01L23/31 ,  H01L25/11 ,  H05K3/46

CPC classification number: H01L24/11 ,  H01L21/56 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/768 ,  H01L23/315 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/26 ,  H01L24/27 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/03 ,  H01L25/074 ,  H01L25/105 ,  H01L25/117 ,  H01L2221/68345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/11831 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24145 ,  H01L2224/24227 ,  H01L2224/26 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/821 ,  H01L2224/83192 ,  H01L2224/83874 ,  H01L2224/92132 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/40252 ,  H01L2924/40407 ,  H01L2924/40501 ,  H05K1/185 ,  H05K3/4682 ,  H05K2201/10477 ,  H05K2203/0152 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.

公开(公告)号：US09468098B2

公开(公告)日：2016-10-11

申请号：US14220913

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Jonghae Kim ,  Chengjie Zuo ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Robert Paul Mikulka

IPC: H01L23/538 ,  H05K1/11 ,  H05K1/03 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H01L23/48 ,  H01L23/64 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34

CPC classification number: H05K3/303 ,  H01L23/48 ,  H01L23/5385 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/19101 ,  H05K1/0243 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K1/18 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/1003 ,  H05K2201/10477 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1316 ,  Y10T29/4902 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate.

Abstract translation: 系统和方法涉及包括第一衬底或2D无源玻璃（POG）结构的半导体封装，其具有无源部件和形成在玻璃衬底的表面上的一个或多个封装焊盘的第一组。 半导体封装还包括具有第二组一个或多个封装焊盘的第二或层压衬底，其形成在第二层压衬底的表面上。 焊球被落下，被配置为使第一组一个或多个封装焊盘与第二组一个或多个封装焊盘接触，其中第一基板或2D POG结构朝上放置在第二或层压板的表面上 基质。 印刷电路板（PCB）可以耦合到第二或层压基板的底侧。

公开(公告)号：US20150170233A1

公开(公告)日：2015-06-18

申请号：US14635855

申请日：2015-03-02

Applicant: Inspired Net Limited

Inventor： Rafael Lisitsa

IPC: G06Q30/06

CPC classification number: G06Q30/0601 ,  F28D15/0266 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/141 ,  H05K7/1092 ,  H05K7/20309 ,  H05K2201/064 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/00

Abstract: This patent application describes many novel consumer Internet services which are built on common principles of intelligent hosting, direct trade between individuals and small businesses without middlemen, direct matching of individuals, aggregated persistent search for any commodity or service, and safe electronic commerce and personal communications environment provided by Trusted Net services. This patent application also describes the integration of consumer Internet services into a consumer-centric Internet portal.

Abstract translation: 该专利申请描述了许多新颖的消费者互联网服务，其基于智能主机，个人和没有中间商的小企业之间的直接交易，个人直接匹配，对任何商品或服务的持续搜索，安全的电子商务和个人通信的共同原则 可信网络服务提供的环境。 该专利申请还描述了将消费者互联网服务整合到以消费者为中心的互联网门户中。

公开(公告)号：US09027238B2

公开(公告)日：2015-05-12

申请号：US13312093

申请日：2011-12-06

Applicant: Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

Inventor： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC: H05K3/30 ,  H01L23/00 ,  H01L23/538 ,  H05K1/18 ,  H01L25/10 ,  H05K3/00 ,  H05K3/46

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。

公开(公告)号：US20150103495A1

公开(公告)日：2015-04-16

申请号：US14576452

申请日：2014-12-19

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hideo Nakagoshi ,  Yoichi Takagi ,  Nobuaki Ogawa ,  Hidekiyo Takaoka ,  Kosuke Nakono ,  Akihiko Kamada ,  Masaaki Mizushiro

IPC: H05K7/02 ,  H05K1/18

CPC classification number: H05K7/02 ,  H01L23/15 ,  H01L23/49811 ,  H01L23/49822 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/141 ,  H05K1/186 ,  H05K3/284 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2201/10992 ,  H05K2203/047

Abstract: A plating layer of a Cu—M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu—M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu—M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.

Abstract translation: 在暴露侧的连接端子构件的端面上形成Cu-M系合金的镀层（M表示Ni和/或Mn），Cu-M系合金能够产生金属间化合物 所述Sn基低熔点金属包含在形成接合部分并且具有不同于金属间化合物的晶格常数的接合材料中的50％以上。 在回流工序中，即使接合材料通过再熔化即将流出，由于接合材料与Cu-M系镀层接触，所以金属间化合物的高熔点合金 形成为阻挡连接端子构件和树脂层之间的界面。