Printed substrate and shield sheet metal fixing method

    公开(公告)号:US09681544B2

    公开(公告)日:2017-06-13

    申请号:US15070659

    申请日:2016-03-15

    Abstract: A printed substrate includes: a substrate; a copper layer formed on the substrate; and a resin formed on the substrate to cover a part of the copper layer, wherein the copper layer includes a first region covered by the resin and a second region in which a shield sheet metal is installed, the shield sheet metal surrounding a predetermined region of the substrate, and wherein an angle formed between an outer edge portion of the copper layer covered by the resin and an outer edge portion of the resin which covers the copper layer at a location at which the outer edge portion of the copper layer and the outer edge portion of the resin intersect each other as viewed in plan is an obtuse angle.

    Printed circuit board
    148.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号:US09538634B2

    公开(公告)日:2017-01-03

    申请号:US13960469

    申请日:2013-08-06

    Abstract: A printed circuit board (e.g., 103) includes capacitor elements (e.g., 121 and 122). The capacitor element (e.g., 121) returns a common mode current included in a signal output from a signal output terminal (e.g., 111) of a semiconductor element (e.g., 102), to a ground terminal (e.g., 113) of the semiconductor element (e.g., 102). The capacitor element (e.g., 122) returns a common mode current included in a signal output from a signal output terminal (e.g., 112) of the semiconductor element (e.g., 102), to the ground terminal (e.g., 113) of the semiconductor element (e.g., 102). The capacitor elements (e.g., 121 and 122) are arranged such that the mutual inductance between a parasitic inductance of the capacitor element (e.g., 121) and a parasitic inductance of the capacitor element (e.g., 122) for the common mode currents is a negative value. Accordingly, the effective inductances of the first and second capacitor elements for the common mode currents are reduced, which suppresses radiation noise.

    Abstract translation: 印刷电路板(例如,103)包括电容元件(例如121和122)。 电容器元件(例如,121)将从半导体元件(例如,102)的信号输出端子(例如,111)输出的信号中包含的共模电流返回到半导体的接地端子(例如,113) 元素(例如,102)。 电容器元件(例如,122)将包括在从半导体元件(例如,102)的信号输出端子(例如,112)输出的信号中的共模电流返回到半导体的接地端子(例如,113) 元素(例如,102)。 电容器元件(例如,121和122)被布置成使得电容器元件(例如,121)的寄生电感与用于共模电流的电容器元件(例如,122)的寄生电感之间的互感是 负值。 因此,减小了用于共模电流的第一和第二电容器元件的有效电感,这抑制了辐射噪声。

    Electrostatic protection device
    149.
    发明授权
    Electrostatic protection device 有权
    静电保护装置

    公开(公告)号:US09497837B2

    公开(公告)日:2016-11-15

    申请号:US14351682

    申请日:2012-09-13

    Abstract: An electrostatic protection device with an improved durability with repeated use and an excellent discharging property is provided. The electrostatic protection device 100 comprising an insulating laminate 11, a pair of discharge electrodes 12 and 13 inside the insulating laminate 11 and a discharge triggered part 14 disposed between these discharge electrodes and at the periphery of the end portion of the discharge electrode is configured by disposing glass-containing insulating layers 15 and 16 on the surfaces of the discharge electrodes. The flow of conductive inorganic materials in the discharge electrodes towards the discharge triggered part caused by the discharging process can be inhibited by arranging the insulating layer containing glass on the surfaces of the discharge electrodes.

    Abstract translation: 提供一种具有反复使用的改善的耐久性和优异的放电性的静电保护装置。 包括绝缘层压体11,绝缘叠层11内的一对放电电极12和13以及设置在这些放电电极之间的放电触发部分14和放电电极的端部周边的静电保护装置100由 在放电电极的表面上设置含玻璃的绝缘层15和16。 通过在放电电极的表面上布置含有玻璃的绝缘层,能够抑制放电电极中的导电性无机材料向放电触发部的放电过程的流动。

    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE
    150.
    发明申请
    HIGH-FREQUENCY SIGNAL TRANSMISSION LINE AND ELECTRONIC DEVICE 审中-公开
    高频信号传输线和电子设备

    公开(公告)号:US20160156087A1

    公开(公告)日:2016-06-02

    申请号:US15017812

    申请日:2016-02-08

    Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section.

    Abstract translation: 高频信号传输线包括元件,设置在元件处并包括第一端和第二端的线性信号线,以及设置在元件处并沿信号线延伸的至少一个接地导体。 元件包括堆叠的绝缘层。 接地导体与信号线相对设置,绝缘层位于它们之间。 接地导体是连续导体。 信号线,接地导体和元件产生特性阻抗。 信号线包括第一部分和第二部分。 第一部分是不间断部分,其在第一端产生大于或等于第一特征阻抗的特征阻抗并且包括第一端。 第二部分产生小于第一特征阻抗的特性阻抗,并且与第一部分相邻。 第二部分比第一部分长。 信号线在第二部分比第一部分宽。

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