公开(公告)号：US09980407B2

公开(公告)日：2018-05-22

申请号：US15507364

申请日：2015-09-17

Applicant: DENSO CORPORATION

Inventor： Takashi Yoshimizu ,  Yuuki Sanada

IPC: H05K7/20 ,  H05K7/14 ,  H01L23/498 ,  H01L23/31 ,  H01L23/053 ,  H05K1/18 ,  H01L23/10 ,  H01G2/06 ,  H01G2/10 ,  H05K1/11 ,  H01L23/367 ,  H01G2/08 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K7/1427 ,  H01G2/065 ,  H01G2/08 ,  H01G2/103 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09609 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2201/1059 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.

公开(公告)号：US20180027655A1

公开(公告)日：2018-01-25

申请号：US15215412

申请日：2016-07-20

Applicant: Infineon Technologies AG

Inventor： Philip Georg Brockerhoff ,  Tilo Weide

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/182 ,  H05K3/325 ,  H05K2201/09709 ,  H05K2201/10545 ,  H05K2201/1059

Abstract: A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.

公开(公告)号：US20180013251A1

公开(公告)日：2018-01-11

申请号：US15545703

申请日：2015-03-20

Applicant: Unid Co., Ltd.

Inventor： Yeong Uk SEO ,  Yeong Joo MOON ,  Chong Kwang YOON ,  Young Soo KIM

IPC: H01R43/00 ,  H01R12/58 ,  H01R12/59 ,  H01R13/24

CPC classification number: H01R43/007 ,  H01L23/498 ,  H01L23/49811 ,  H01L24/00 ,  H01R12/58 ,  H01R12/59 ,  H01R12/73 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/1059 ,  H05K2203/308

Abstract: Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

公开(公告)号：US20170365945A1

公开(公告)日：2017-12-21

申请号：US15533314

申请日：2015-11-16

Applicant: OSRAM SYLVANIA Inc.

Inventor： Richard Speer ,  Kenneth Grossman

IPC: H01R12/77 ,  F21V19/00 ,  H01R12/70 ,  F21V23/06 ,  F21Y2105/10 ,  F21Y2107/70

CPC classification number: H01R12/772 ,  F21S8/04 ,  F21V19/003 ,  F21V23/06 ,  F21Y2105/10 ,  F21Y2107/70 ,  H01R12/7011 ,  H01R12/714 ,  H01R12/777 ,  H01R12/79 ,  H05K3/365 ,  H05K2201/10106 ,  H05K2201/1059 ,  H05K2201/10606

Abstract: There is described an edge assembly for attaching to flexible substrates. An example assembly may comprise at least a first edge component and a compression retainer component. The first edge component may include at least one conductor to mate with one or more conductors on a surface of a flexible substrate after the first edge component is affixed to an edge of the flexible substrate by the compression retainer component. The edge assembly may also comprise a second edge component, wherein the flexible substrate may be compressed between the first and second edge components and held in place by the compression retainer component. The first edge component may further comprise an extension, including the at least one conductor, that may be used to convey power from a power source to the flexible substrate. The extension is accessible from outside the flexible substrate via a port in the compression retainer component.

公开(公告)号：US20170263527A1

公开(公告)日：2017-09-14

申请号：US15453123

申请日：2017-03-08

Applicant: ABB Schweiz AG ,  Audi AG

Inventor： Fabian Mohn ,  Jürgen Schuderer

IPC: H01L23/367 ,  H01L23/31 ,  H01L25/10 ,  H01L23/373 ,  H01L23/00 ,  H01L23/498 ,  H01L23/04

CPC classification number: H01L23/3675 ,  H01L23/04 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L25/105 ,  H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2225/1094 ,  H01L2924/0665 ,  H01L2924/1203 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/186 ,  H05K1/0263 ,  H05K1/115 ,  H05K3/325 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1316 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor module comprises a semiconductor device; a substrate, on which the semiconductor device is attached; a molded encasing, into which the semiconductor device and the substrate are molded; at least one power terminal partially molded into the encasing and protruding from the encasing, which power terminal is electrically connected with the semiconductor device; and an encased circuit board at least partially molded into the encasing and protruding over the substrate in an extension direction of the substrate, wherein the encased circuit board comprises at least one receptacle for a pin, the receptacle being electrically connected via the encased circuit board with a control input of the semiconductor device.

公开(公告)号：US09723718B2

公开(公告)日：2017-08-01

申请号：US14452785

申请日：2014-08-06

Applicant: Mitsubishi Electric Corporation

Inventor： Taichi Obara ,  Rei Yoneyama ,  Takami Otsuki ,  Eiju Shitama

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/15 ,  H05K3/34 ,  H05K7/12 ,  H05K7/00 ,  H01L23/13 ,  H01L23/373 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L2224/32225 ,  H01L2924/19105 ,  H05K1/11 ,  H05K1/111 ,  H05K1/186 ,  H05K1/188 ,  H05K3/3442 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10 ,  H05K2201/10174 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

公开(公告)号：US09696023B2

公开(公告)日：2017-07-04

申请号：US14653945

申请日：2013-12-16

Applicant: LEELEDS LIGHTING (XIAMEN) CO., LTD.

Inventor： Linhua Wang ,  Xiaolei Zhu ,  Lin Zhou ,  Han Zhao

IPC: F21V23/06 ,  H01R33/18 ,  H01R33/22 ,  F21V23/00 ,  H05K3/36 ,  F21K9/23 ,  F21K9/238 ,  H05K3/30 ,  F21K9/232 ,  F21Y115/10

CPC classification number: F21V23/06 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V23/00 ,  F21V23/006 ,  F21Y2115/10 ,  H01R33/18 ,  H01R33/225 ,  H05K3/308 ,  H05K3/366 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.

公开(公告)号：US09560741B2

公开(公告)日：2017-01-31

申请号：US14511397

申请日：2014-10-10

Applicant: Curtiss-Wright Controls, Inc.

Inventor： Michael Rose ,  Robert Sullivan

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0251 ,  H05K1/0216 ,  H05K1/024 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4038 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09636 ,  H05K2201/09718 ,  H05K2201/1059

Abstract: A circuit board comprises a plurality of layers, first and second reference conductive vias extending in a vertical direction through at least a portion of the plurality of layers, first and second signal conductive vias extending in the vertical direction between and spaced apart in a horizontal direction from the first and second reference conductive vias through at least a portion of the plurality of layers, and a dielectric region extending in the vertical direction between the first and second signal conductive vias. An air via extends in the vertical direction through the dielectric region between the first and second signal conductive vias. An anti-pad extends in the horizontal direction between the first and second reference conductive vias and surrounding in the horizontal direction the first and second signal conductive vias, the air via, and the dielectric region.

Abstract translation: 电路板包括多个层，第一和第二参考导电通孔在垂直方向上延伸穿过多个层的至少一部分，第一和第二信号导电通孔在垂直方向上延伸并且在水平方向间隔开 从所述第一和第二参考导电通孔穿过所述多个层的至少一部分，以及在所述第一和第二信号导电通孔之间沿垂直方向延伸的电介质区域。 空气通道在垂直方向上延伸穿过第一和第二信号导电通孔之间的电介质区域。 反焊盘在第一和第二参考导电通孔之间沿水平方向延伸，并且在水平方向上包围第一和第二信号导电通孔，空气通孔和电介质区域。

公开(公告)号：US20160196939A1

公开(公告)日：2016-07-07

申请号：US15072131

申请日：2016-03-16

Applicant: TE Connectivity Germany GmbH

Inventor： Wilfried Biehl ,  Titus Ziegler ,  Harry Koch ,  Thomas Haehnel

IPC: H01H45/14

CPC classification number: H01H45/14 ,  H01H50/14 ,  H01R12/585 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10878

Abstract: An active electrical component is disclosed. The active electrical component comprises a contact extending away from an outer side of the component in an insertion direction, and a force transmission structure extending to the contact in a continuous manner from a side of the component opposite the contact.

Abstract translation: 公开了一种有源电气部件。 有源电气部件包括沿插入方向远离部件的外侧延伸的接触件，以及从与接触件相对的部件的侧面以连续方式延伸到接触件的力传递结构。

公开(公告)号：US20150355031A1

公开(公告)日：2015-12-10

申请号：US14725494

申请日：2015-05-29

Applicant: JTEKT CORPORATION

Inventor： Naoki MATSUMOTO ,  Jun MATSUMOTO ,  Kouya YOSHIDA ,  Ryotaro SEO

IPC: G01J5/08 ,  B23K1/005

CPC classification number: G01J5/0896 ,  B23K1/0056 ,  G01J5/0806 ,  G01R31/046 ,  G01R31/309 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/162

Abstract: An optical non-destructive inspection method includes: heating including setting a measurement spot on a surface of a workpiece and irradiating the measurement spot with heating laser light using a heating laser light source, heat ray detectors, and a controller; acquiring a temperature rise property that is a temperature rise state of the measurement spot according to a heating time by detecting a heat ray radiated from the measurement spot to determine a temperature at the measurement spot; and determining whether or not a pressure contact state at pressure contact portions, which include a contact area and a contact pressure, is appropriate based on the temperature rise property.

Abstract translation: 光学非破坏性检查方法包括：加热，包括在工件的表面上设置测量点，并使用加热激光光源，热射线检测器和控制器用加热激光照射测量点; 通过检测从测量点辐射的热射线来获取作为加热时间的测量点的升温状态的温度升高特性，以确定测量点处的温度; 以及基于所述升温特性确定包括接触面积和接触压力在内的压力接触部分处的压力接触状态是否合适。