公开(公告)号：US20190037718A1

公开(公告)日：2019-01-31

申请号：US16152508

申请日：2018-10-05

Applicant: International Business Machines Corporation

Inventor： Michael J. Shapiro ,  Brian C. Twichell ,  Brent W. Yardley

IPC: H05K5/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K5/0217 ,  H05K1/11 ,  H05K1/181 ,  H05K7/20727 ,  H05K2201/07 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2201/2027 ,  Y02P70/611

Abstract: An apparatus includes a particle trap coupled to a first surface of an enclosure, wherein the first surface of the enclosure is opposite a top surface of a circuit board. A particle guard coupled to the top surface on a first side of the circuit board located in the enclosure, wherein the enclosure includes one or more apertures on a second surface of the enclosure where the first side of the circuit board is introduced to an external airflow.

公开(公告)号：US20180269610A1

公开(公告)日：2018-09-20

申请号：US15921671

申请日：2018-03-15

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： SHUO-HSIU HSU

IPC: H01R12/79 ,  H05K1/18 ,  H05K1/02 ,  H04B1/40

CPC classification number: H01R12/79 ,  H04B1/3888 ,  H04B1/40 ,  H05K1/0243 ,  H05K1/028 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: A connector assembly having two ends respectively connected to a case and a main circuit board comprises a bracket, a bottom plate assembled on the bottom of the bracket and a flexible circuit board located between the bracket and the bottom plate. The bracket includes a mating surface attached to the case, a mounting surface opposite the mating surface, and a receiving cavity recessed inwardly from the mounting surface. The bracket includes a pair of openings extending through the mating surface thereof and communicating with the receiving cavity. A pair of chip modules are disposed on the flexible circuit board corresponding to the openings. One side of the flexible circuit board, which is farther away from the bracket, includes an electrical connector for mating with the main circuit board.

公开(公告)号：US20180235075A1

公开(公告)日：2018-08-16

申请号：US15434919

申请日：2017-02-16

Applicant: Intel Corporation

Inventor： Taylor Gaines ,  Anna M. Prakash ,  Ziv Belman ,  Baruch Schiffmann ,  Arnon Hirshberg ,  Ron Wittenberg ,  Vladimir Malamud

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/18

CPC classification number: H01L23/552 ,  H05K1/0218 ,  H05K1/0243 ,  H05K2201/0317 ,  H05K2201/0715 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/2018 ,  H05K2203/072 ,  H05K2203/0723

Abstract: Semiconductor packages may include different portions associated one or more electronic components of the semiconductor package where electromagnetic (for example, radio-frequency, RF) shielding at predetermined frequencies ranges may be needed. Accordingly, in an embodiment, compartmental shielding can be used in the areas between the electronic components on the semiconductor package to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package. Further, in another embodiment, conformal coating shielding can be used to provide RF shielding to provide RF shielding to the electronic components on the semiconductor package or to other electronic components in proximity to the electronic components on the semiconductor package.

公开(公告)号：US20180205166A1

公开(公告)日：2018-07-19

申请号：US15859906

申请日：2018-01-02

Applicant: Methode Electronics, Inc.

Inventor： Robert Skepnek ,  Joseph Llorens ,  Alexandros Pirillis

IPC: H01R12/81 ,  H01R12/77 ,  H01R12/82

CPC classification number: H01R12/81 ,  G02B6/4281 ,  G06F1/1632 ,  H01R12/62 ,  H01R12/772 ,  H01R12/82 ,  H01R35/02 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/046 ,  H05K2201/2018

Abstract: A transceiver assembly is provided that includes a transceiver housing having first end, having a connector and an opposite second end having a passage in communication with a printed circuit board mounted in the housing. A peripheral connector having a first end and opposite second end includes a receptacle opening at the second end. A flex circuit is disposed between the first end of the peripheral connector and the second end of the transceiver housing. The peripheral connector is capable of being displaced with respect to the transceiver housing via the flex circuit.

公开(公告)号：US09980381B2

公开(公告)日：2018-05-22

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Seng Huan Chuah ,  Friedrich Josef Bollmann ,  Khai Jin Choo ,  Weng Kong Hor ,  Sih Hau Tan

IPC: H05K1/11 ,  H05K1/14 ,  H04M1/02 ,  H05K5/06 ,  H05K1/02

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

公开(公告)号：US09844151B2

公开(公告)日：2017-12-12

申请号：US14492424

申请日：2014-09-22

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki Ishihara ,  Michimasa Takahashi

IPC: H05K3/36 ,  H05K3/00

CPC classification number: H05K3/368 ,  H05K3/0097 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/0152 ,  H05K2203/1484 ,  Y10T29/49126

Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.

公开(公告)号：US09826640B2

公开(公告)日：2017-11-21

申请号：US15180101

申请日：2016-06-13

Applicant: E Ink Holdings Inc.

Inventor： Chun-Wei Chu

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  H04M1/02

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/028 ,  H05K2201/042 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: An electronic apparatus includes a frame, at least one circuit board, at least one hardware device, and at least one first connector. The frame includes a first frame body and a second frame body. The first frame body includes a first wire therein. The circuit board includes a first edge and a second, and at least a portion of the circuit board is flexible. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The circuit board is electrically connected to the first wire. The hardware device is disposed on the circuit board. The first frame body includes a first inner surface, and the first connector is disposed on the first inner surface and electrically connected to the first wire, and the first edge of the circuit board is plugged in the first connector.

公开(公告)号：US20170311438A1

公开(公告)日：2017-10-26

申请号：US15490012

申请日：2017-04-18

Applicant: Laird Technologies, Inc.

Inventor： Mohammadli Khorrami ,  Paul Francis Dixon ,  George William Rhyne

IPC: H05K1/02 ,  H01L23/64 ,  H01L23/00 ,  H05K1/18 ,  H01L23/31 ,  H01L23/552 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L23/3114 ,  H01L23/552 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/85 ,  H01L2924/141 ,  H01L2924/1615 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0233 ,  H05K1/18 ,  H05K3/30 ,  H05K9/0003 ,  H05K9/0028 ,  H05K2201/0707 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: According to various aspects, exemplary embodiments are disclosed of board level shields with virtual grounding capability. In an exemplary embodiment, a board level shield includes one or more resonators configured to be operable for virtually connecting the board level shield to a ground plane or a shielding surface. Also disclosed are exemplary embodiments of methods relating to making board level shields having virtual grounding capability. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate by using a board level shield having virtual grounding capability. Further exemplary embodiments are disclosed of methods relating to making system in package (SiP) or system on chip (SoC) shielded modules and methods relating to providing shielding for one or more components of SiP or SoC module.

公开(公告)号：US09763328B1

公开(公告)日：2017-09-12

申请号：US15067439

申请日：2016-03-11

Applicant: Continental Automotive Systems, Inc.

Inventor： Donald J. Zito ,  David Wayne Currier ,  Keith A Meny ,  Leobardo Martinez Hernandez ,  Russ Dalbke ,  Peter Lechowicz

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H01G9/008 ,  H05K5/03 ,  H01G9/06 ,  H01G9/08

CPC classification number: H05K1/183 ,  H01G2/06 ,  H01G9/008 ,  H01G9/06 ,  H01G9/08 ,  H05K1/184 ,  H05K3/30 ,  H05K3/301 ,  H05K3/32 ,  H05K3/3421 ,  H05K5/0056 ,  H05K7/1432 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/2018 ,  Y02P70/613

Abstract: A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

公开(公告)号：US20170181263A1

公开(公告)日：2017-06-22

申请号：US14974594

申请日：2015-12-18

Applicant: INTEL CORPORATION

Inventor： Emad Al-Momani ,  Srikanth Mothukuri

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18 ,  G06F1/20 ,  H05K1/09

CPC classification number: H05K1/0203 ,  G06F1/20 ,  H01L23/4006 ,  H05K1/181 ,  H05K3/301 ,  H05K7/2039 ,  H05K7/2049 ,  H05K2201/066 ,  H05K2201/09909 ,  H05K2201/10325 ,  H05K2201/2018

Abstract: The present disclosure provides systems and methods for a package securing system including a top plate, an alignment frame, a gasket, and a back plate. The top plate comprises a thermal conductive member to transfer heat from a central processing unit (CPU) and secure the CPU to a ball grid array (BGA) socket and a printed circuit board (PCB). The alignment frame is configured to align a connection between the BGA socket and the PCB. The gasket is to seal the CPU, the BGA socket, and the alignment frame between the PCB and the top plate. The back plate is configured to couple with the top plate through the PCB.