公开(公告)号：US20230309233A1

公开(公告)日：2023-09-28

申请号：US17842709

申请日：2022-06-16

Applicant: Kioxia Corporation

Inventor： Satoru FUKUCHI

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/16 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L23/49827 ,  H01L25/16 ,  H01L25/162 ,  H01L23/49838 ,  H05K1/113 ,  H05K2201/10378 ,  H05K2201/10174 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/09518 ,  H05K2201/09481 ,  H05K2201/10734

Abstract: An electronic device according to an embodiment includes first and second substrates, first and second conductors, and an electronic component. The first substrate includes a first connector portion, first pad portions, and a first transmission line. The first pad portions include a second pad portion, the first transmission line coupling the second pad portion and the first connector portion. The second substrate includes third pad portions. The third pad portions include a fourth pad portion and a fifth pad portion. The first conductor is coupled to the fourth pad portion and to the second pad portion. The second conductor is coupled to the fifth pad portion. The first electronic component has one end coupled to the first conductor and other end coupled to the second conductor.

公开(公告)号：US11765833B2

公开(公告)日：2023-09-19

申请号：US17681093

申请日：2022-02-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Myeong Hui Jung ,  Seung Eun Lee ,  Yong Hoon Kim

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H05K2201/096 ,  H05K2201/09481 ,  H05K2201/09827

Abstract: A substrate having an electronic component embedded therein includes first and second insulating layers including first and second cavities, respectively, first and second electronic components disposed within the first and second cavities, respectively, a first adhesive layer disposed between the first and second insulating layers, and a connection member penetrating through at least a portion of the first adhesive layer. One end and the other end of the connection member are connected to the first and second electronic components, respectively.

公开(公告)号：US09835684B2

公开(公告)日：2017-12-05

申请号：US14175392

申请日：2014-02-07

Applicant: NVIDIA Corporation

Inventor： Jinchai (Ivy) Qin ,  Bing Al

IPC: G01R31/3177 ,  G01R31/28 ,  H05K1/02 ,  G01R31/3185 ,  H05K3/42

CPC classification number: G01R31/3177 ,  G01R31/2818 ,  H05K1/0268 ,  H05K3/429 ,  H05K2201/09481

Abstract: A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.

公开(公告)号：US09736946B2

公开(公告)日：2017-08-15

申请号：US14506251

申请日：2014-10-03

Applicant: Metrospec Technology, L.L.C.

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: B23K31/02 ,  H05K3/36 ,  H01R4/02 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H01R12/61 ,  B23K1/00 ,  B23K37/04 ,  H05K1/18 ,  F21Y115/10 ,  F21Y107/30

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

公开(公告)号：US09629246B2

公开(公告)日：2017-04-18

申请号：US14811325

申请日：2015-07-28

Applicant: Infineon Technologies AG

Inventor： Qianli Mu ,  Cristian Gozzi ,  Michael Simcoe ,  Guillaume Bigny

IPC: H05K7/00 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01L23/14

CPC classification number: H05K1/181 ,  H01L23/142 ,  H01L23/64 ,  H01L2224/49175 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/144 ,  H05K1/182 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2203/049

Abstract: A semiconductor package includes a metal baseplate, a semiconductor die having a reference terminal attached to the baseplate and an RF terminal facing away from the baseplate, and a multilayer circuit board having a first side attached to the baseplate and a second side facing away from the baseplate. The multilayer circuit board includes a plurality of interleaved signal and ground layers. One of the signal layers is at the second side of the multilayer circuit board and electrically connected to the RF terminal of the semiconductor die. One of the ground layers is at the first side of the multilayer circuit board and attached to the metal baseplate. Power distribution structures are formed in the signal layer at the second side of the multilayer circuit board. RF matching structures are formed in a different one of the signal layers than the power distribution structures.

公开(公告)号：US09544993B2

公开(公告)日：2017-01-10

申请号：US14265077

申请日：2014-04-29

Applicant: Samsung Display Co., Ltd.

Inventor： Chung-Seok Lee ,  Bong-Hyun You ,  Seong-Heon Cho

IPC: H05K7/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K3/28 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K1/028 ,  H05K1/0268 ,  H05K1/0281 ,  H05K1/117 ,  H05K1/148 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09481 ,  H05K2201/09827 ,  H05K2201/10128

Abstract: Provided is a foldable display apparatus that is foldable along a folding line. The foldable display apparatus includes a first display panel for displaying a first image, a second display panel for displaying a second image, wherein the second display panel is spaced apart from the first display panel, and a flexible electric connection unit disposed between the first and second display panels and electrically connecting the first and second display panels, the flexible electric connection unit comprising a groove overlapping with the folding line.

Abstract translation: 提供一种可折叠显示装置，其可以沿折叠线折叠。 可折叠显示装置包括用于显示第一图像的第一显示面板，用于显示第二图像的第二显示面板，其中第二显示面板与第一显示面板间隔开，柔性电连接单元设置在第一和第二显示面板之间， 第二显示面板和电连接第一和第二显示面板，柔性电连接单元包括与折叠线重叠的凹槽。

公开(公告)号：US20160246156A1

公开(公告)日：2016-08-25

申请号：US14984517

申请日：2015-12-30

Applicant: Fujitsu Optical Components Limited

Inventor： Masaki Sugiyama ,  Akira Ishii ,  Norihisa Naganuma ,  Eiichi Kodera

IPC: G02F1/225 ,  H05K1/11

CPC classification number: G02F1/2255 ,  G02F1/035 ,  H05K1/0219 ,  H05K1/118 ,  H05K3/363 ,  H05K3/366 ,  H05K2201/09172 ,  H05K2201/094 ,  H05K2201/09481 ,  H05K2201/09618 ,  H05K2201/0969

Abstract: A first circuit board has an electrode pattern, a ground pattern, a first through hole, and a second through hole. The first through hole penetrates through the electrode pattern. The second through hole penetrates through the ground pattern. A second circuit board has a signal line, an electrode terminal, and a ground terminal. The electrode terminal is extended from the signal line, and is electrically connected to the electrode pattern with the electrode terminal being inserted into the first through hole. The ground terminal is electrically connected to the ground pattern with the ground terminal being inserted into the second through hole, and has a width, a length, or an area or any combination thereof larger than a width, a length, or an area or any combination thereof of the electrode terminal.

Abstract translation: 第一电路板具有电极图案，接地图案，第一通孔和第二通孔。 第一通孔穿过电极图案。 第二个通孔穿过地面图案。 第二电路板具有信号线，电极端子和接地端子。 电极端子从信号线延伸，并且电连接到电极图案，电极端子被插入到第一通孔中。 接地端子与接地图形电连接，接地端子被插入到第二通孔中，并且具有宽度，长度或面积或其大于宽度，长度或面积的任何组合，或任何 电极端子的组合。

公开(公告)号：US09412677B2

公开(公告)日：2016-08-09

申请号：US11841351

申请日：2007-08-20

Applicant: Teck Kheng Lee

Inventor： Teck Kheng Lee

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L23/31 ,  H01L25/065 ,  H01L25/16 ,  H05K1/02

CPC classification number: H01L23/13 ,  G06F1/18 ,  G06F1/183 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.

Abstract translation: 公开了用于安装半导体管芯的插入件的各种实施例以及用于形成插入件的方法。 插入器包括由插入器的芯材料形成的柔性焊盘元件，使得插入器可以吸收热诱导的应力并且符合​​翘曲或不平坦的表面。 还公开了包括安装到内插器并且电连接到插入器的半导体管芯的电子器件封装的实施例以及用于形成电子器件封装的方法。 在一个电子器件封装中，半导体管芯通过连接到插入器的布线层上的引线电连接到插入器。 在另一个电子器件封装中，半导体管芯通过以倒装芯片配置将半导体管芯连接到插入器的柔性焊盘元件而电连接到插入器。 还公开了一种结合根据本发明的具有插入器的电子器件封装的计算机系统。

公开(公告)号：US09386692B2

公开(公告)日：2016-07-05

申请号：US14704196

申请日：2015-05-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/36 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/0394 ,  H05K2201/041 ,  H05K2201/055 ,  H05K2201/09481

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。

公开(公告)号：US20150359083A1

公开(公告)日：2015-12-10

申请号：US14704196

申请日：2015-05-05

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： KUO-FU SU ,  CHIH-HENG CHUO ,  GWUN-JIN LIN

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/028 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/0394 ,  H05K2201/041 ,  H05K2201/055 ,  H05K2201/09481

Abstract: A power supply path structure is provided for a flexible circuit board and includes a first flexible circuit board that includes at least one first connection pad and a first opposite connection pad and a first power supply path connected between the first connection pad and the first opposite connection pad and a second flexible circuit board that includes at least one second connection pad and a second opposite connection pad and a second power supply path connected between the second connection pad and the second opposite connection pad. The first flexible circuit board is stacked, in a vertical direction, on the second flexible circuit board in such a way that the first power supply path and the second power supply path form a parallel-connected power supply path that serves as a power path or a grounding path for the first flexible circuit board.

Abstract translation: 提供了一种用于柔性电路板的电源路径结构，并且包括第一柔性电路板，其包括至少一个第一连接焊盘和第一相对连接焊盘以及连接在第一连接焊盘和第一相对连接之间的第一电源路径 垫和第二柔性电路板，其包括连接在第二连接焊盘和第二相对连接焊盘之间的至少一个第二连接焊盘和第二相对连接焊盘和第二电源路径。 第一柔性电路板在垂直方向上堆叠在第二柔性电路板上，使得第一电源路径和第二电源路径形成用作电源路径的并联连接的电源路径，或者 第一柔性电路板的接地路径。