公开(公告)号：US20150195913A1

公开(公告)日：2015-07-09

申请号：US14321068

申请日：2014-07-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Gi CHO

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/144 ,  H05K3/28 ,  H05K2201/09436 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/1327

Abstract: There is provided an electronic component module capable of increasing the degree of integration by mounting electronic components on both surfaces of a substrate. The electronic component module according to an exemplary embodiment of the present disclosure includes a first substrate having one surface on which at least one electronic component is mounted; and a second substrate bonded to one surface of the first substrate and including at least one component accommodating part in which the at least one electronic component is accommodated, wherein the second substrate includes a core layer, and metal wiring layers formed on both surfaces of the core layer and having a plurality of electrode pads.

Abstract translation: 提供了一种能够通过将电子部件安装在基板的两个表面上而增加集成度的电子部件模块。 根据本公开的示例性实施例的电子部件模块包括具有一个表面的第一基板，至少一个电子元件安装在该表面上; 以及第二基板，其接合到所述第一基板的一个表面并且包括容纳所述至少一个电子部件的至少一个部件容纳部，其中所述第二基板包括芯层，以及形成在所述第二基板的两个表面上的金属布线层 并具有多个电极焊盘。

公开(公告)号：US20150173214A1

公开(公告)日：2015-06-18

申请号：US14407557

申请日：2013-09-26

Applicant: KYOCERA Corporation

Inventor： Yoshiki Kawazu

IPC: H05K5/00 ,  H05K1/18 ,  H05K5/02 ,  H01L23/055

CPC classification number: H05K5/0091 ,  H01L23/055 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/093 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a stacked body consisting of dielectric layers and ground layers which are alternately laminated, to extend through an inside of the stacked body, and a lead terminal connected to the wiring conductor. A non-formation region is provided in the ground layers around the wiring conductor, which passes through the inside of the input-output terminal in a vertical direction of the stacked body. The non-formation region has, in order from an upper side toward a lower side, a first non-formation section, a second non-formation section having an area smaller than that of the first non-formation section, and a third non-formation section having an area larger than that of the second non-formation section.

Abstract translation: 元件外壳包装件包括基板，框体和输入 - 输出端子。 输入输出端子具有形成在层叠体中的布线导体，该堆叠体由交替层叠的电介质层和接地层构成，以延伸穿过层叠体的内部，以及引线端子与布线导体连接。 在布线导体周围的接地层中设置非形成区域，该布线导体在层叠体的垂直方向上穿过输入输出端子的内部。 非形成区域具有从上侧朝向下侧的顺序，具有第一非形成部，具有比第一非成形部的面积小的面积的第二非成形部， 形成部具有比第二非成形部的面积大的面积。

公开(公告)号：US20150078818A1

公开(公告)日：2015-03-19

申请号：US14394430

申请日：2013-02-14

Applicant: DENSO CORPORATION

Inventor： Hiroki Chitaka ,  Masaru Yokota

IPC: F16B5/06

CPC classification number: F16B5/0642 ,  H05K1/141 ,  H05K1/144 ,  H05K7/14 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2201/2036 ,  H05K2203/167 ,  Y10T403/7062

Abstract: A structure for fixing a first substrate and a second substrate, which are connected by an inter-substrate connector and fixed and overlapped each other with a space, comprises, a spacer member that is disposed between the first substrate and the second substrate, and maintains a space between the first substrate and the second substrate at a predetermined distance; a pressing portion that presses the second substrate toward the first substrate; and a locking member that is fixed in the first substrate.

Abstract translation: 用于固定通过基板间连接器彼此固定并且彼此重叠的空间的第一基板和第二基板的结构包括：间隔件，其设置在第一基板和第二基板之间，并且保持 在第一基板和第二基板之间的预定距离处的空间; 将第二基板朝向第一基板按压的按压部; 以及固定在第一基板中的锁定构件。

公开(公告)号：US08952511B2

公开(公告)日：2015-02-10

申请号：US11959331

申请日：2007-12-18

Applicant: Ajit V. Sathe ,  Mat J. Manusharow ,  Tong Wa Chao

Inventor： Ajit V. Sathe ,  Mat J. Manusharow ,  Tong Wa Chao

IPC: H01L23/02 ,  H05K3/30 ,  H01L23/50

CPC classification number: H05K3/303 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2201/2036 ,  Y02P70/613

Abstract: Embodiments of a bottom-side stiffening element are disclosed. The stiffening element may be disposed between an integrated circuit package and an underlying circuit board. In some embodiments, the stiffening element is attached to the underlying circuit board. Other embodiments are described and claimed.

Abstract translation: 公开了底侧加强元件的实施例。 加强元件可以设置在集成电路封装和底层电路板之间。 在一些实施例中，加强元件附接到下面的电路板。 描述和要求保护其他实施例。

公开(公告)号：US08866270B2

公开(公告)日：2014-10-21

申请号：US14203912

申请日：2014-03-11

Applicant: Fujitsu Limited

Inventor： Manabu Watanabe ,  Masateru Koide ,  Kenji Fukuzono ,  Takashi Kanda

IPC: H01L21/00 ,  H01L21/50

CPC classification number: H01L21/50 ,  H01L21/82 ,  H01L29/06 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/2018

Abstract: A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Abstract translation: 半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

公开(公告)号：US20140301048A1

公开(公告)日：2014-10-09

申请号：US14351979

申请日：2012-10-25

Applicant: Hella KGaA Hueck & Co.

Inventor： Gunnar Lindner

IPC: H05K5/00

CPC classification number: H05K5/0026 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/2018 ,  H05K2203/0495

Abstract: An electronic circuit, comprising at least three circuit boards (2.1, 2.2, 2.3) fastened at a frame (1) and electrically connected via contact pins (7) arranged therein, and an electric connection (11), connected to a third of the circuit boards (2.1). The circuit shall show a low structural space and here be cost-effective in its production and assembly. The circuit boards (2.1, 2.2, 2.3) are arranged in levels parallel in reference to each other and are fastened at a predetermined mutual distance at the frame (1), with bases (4, 5, 6) being embodied at the faces of the frame (1), with the ends being parallel to the faces of at least two of the bases (4, 5, 6) in one level, arranged in groups, and with the embodiment of the frame (1) and the circuit boards (2.1, 2.2, 2.3) being adjusted to each other.

Abstract translation: 一种电子电路，包括紧固在框架（1）处并通过布置在其中的接触销（7）电连接的至少三个电路板（2.1,2.2,2.3）和电连接（11），电连接 电路板（2.1）。 该电路应具有较低的结构空间，并且在生产和组装中具有成本效益。 电路板（2.1,2.2,2.3）以相对于彼此平行的水平布置，并且在框架（1）处以预定的相互距离紧固，其中基座（4,5,6）被体现在 所述框架（1）的端部平行于一组中的至少两个所述基座（4,5,6）的面，所述两个基座（4,5,6）分成一组，并且与所述框架（1）和所述电路板 （2.1,2.2,2.3）相互调整。

公开(公告)号：US20140204543A1

公开(公告)日：2014-07-24

申请号：US13745040

申请日：2013-01-18

Applicant: XAC AUTOMATION CORP.

Inventor： YENG MING CHANG ,  CARL WESLEY ROBINSON ,  LI DE CHEN

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K1/0275 ,  G06F21/86 ,  G06F2221/2101 ,  H05K1/144 ,  H05K1/147 ,  H05K5/0208 ,  H05K2201/09263 ,  H05K2201/2018

Abstract: A data transaction apparatus includes a housing, a system circuit board comprising a tamper detection circuit disposed in the housing, and a tamper protection device configured to seal the system circuit board within the housing in a detachable manner. The tamper protection device includes a tamper resistant board and a resin layer covering the tamper resistant board, wherein the tamper resistant board includes a flexible substrate and a plurality of fence-like lead wires disposed on the flexible substrate. In one embodiment of the present disclosure, the tamper detection circuit is triggered to generate a secure response when a tamper event is detected.

Abstract translation: 数据交易装置包括壳体，包括设置在壳体中的篡改检测电路的系统电路板以及被配置为以可拆卸的方式将系统电路板密封在壳体内的篡改保护装置。 防篡改装置包括防篡改板和覆盖防篡改板的树脂层，其中防篡改板包括柔性基板和设置在柔性基板上的多个栅栏状引线。 在本公开的一个实施例中，当检测到篡改事件时，篡改检测电路被触发以产生安全响应。

公开(公告)号：US20140168908A1

公开(公告)日：2014-06-19

申请号：US13714424

申请日：2012-12-14

Applicant: HTC CORPORATION

Inventor： I-Cheng Chuang ,  Chien-Hung Chen ,  Chih-Hung Li ,  Cheng-Te Chen

IPC: H05K7/06

CPC classification number: G06F1/1658 ,  G06F1/16 ,  H04M1/00 ,  H04M1/0274 ,  H05K1/0218 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0723 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y02P70/611

Abstract: An electronic module includes a first circuit board having a first surface, a second circuit board having a second surface, first electronic components on the first surface, second electronic components on the second surface, a first conductive fence, and a second conductive fence. The first conductive fence encloses the first electronic components and has a first opening exposing the first electronic components. The second conductive fence encloses the second electronic components and has a second opening exposing the second electronic components. The first opening of the first conductive fence joints the second opening of the second conductive fence, such that the first electronic components and the second electronic components are surrounded by the first circuit board, the second circuit board, the first conductive fence, and the second conductive fence. At least one of the first electronic components is higher than the first conductive fence.

Abstract translation: 电子模块包括具有第一表面的第一电路板，具有第二表面的第二电路板，第一表面上的第一电子部件，第二表面上的第二电子部件，第一导电栅栏和第二导电栅栏。 第一导电围栏包围第一电子部件，并具有暴露第一电子部件的第一开口。 第二导电围栏包围第二电子部件，并具有暴露第二电子部件的第二开口。 第一导电栅栏的第一开口接合第二导电栅栏的第二开口，使得第一电子元件和第二电子元件被第一电路板，第二电路板，第一导电栅栏和第二导电栅栏围绕 导电栅栏 第一电子部件中的至少一个比第一导电栅栏高。

公开(公告)号：US08749980B2

公开(公告)日：2014-06-10

申请号：US13016908

申请日：2011-01-28

Applicant: Dongsu Won ,  Seunghwan Jang ,  Yongsang Cho

Inventor： Dongsu Won ,  Seunghwan Jang ,  Yongsang Cho

IPC: H05K7/20

CPC classification number: H05K5/0278 ,  G06F1/20 ,  H01L23/3675 ,  H01L2924/0002 ,  H04B1/036 ,  H05K1/0203 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A mobile terminal is provided. The mobile terminal comprises at least one element, a connector selectively connected to another device to provide a data exchange path between the at least one element and the other device, and a thermal conduction frame having one side coming into contact with the at least one element and the other side coming into contact with the connector to transfer heat generated from the at least one element to the connector. The connector is connected to the element included in the mobile terminal and the other device through the thermal conduction frame to effectively transfer heat generated from the element to the other device through the connector.

Abstract translation: 提供移动终端。 移动终端包括至少一个元件，连接器选择性地连接到另一个设备，以提供至少一个元件与另一个元件之间的数据交换路径，以及导热框架，其一侧与至少一个元件接触 并且另一侧与连接器接触以将从至少一个元件产生的热量传递到连接器。 连接器通过导热框架连接到包括在移动终端中的元件和另一个设备，以通过连接器有效地将从元件产生的热量传递到另一个设备。

公开(公告)号：US08737080B2

公开(公告)日：2014-05-27

申请号：US13006570

申请日：2011-01-14

Applicant: Yang Zhang ,  Yongsheng Peng ,  Jack B. Steenstra

Inventor： Yang Zhang ,  Yongsheng Peng ,  Jack B. Steenstra

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H01L23/5385 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/182 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: A modular package may be utilized to mount an RF system-on-chip in one of plural configurations, such that the same modular package may be utilized to enable plural device formats, while reducing the amount of RF testing needed to change device formats. In one configuration, a surface mount device is mounted onto a first surface of a board, and the board is directly surface mounted onto a base board. Here, the base board includes a hole for accommodating the surface mount device, providing a thin device format. In a second configuration, a spacer is mounted onto the first surface of the board, such that a gap is provided between the board and the base board for accommodating the surface mount device, providing a relatively thicker device, but providing additional surface area where the hole otherwise would be, reducing the device size.

Abstract translation: 可以使用模块化封装来将RF系统片上安装在多个配置中的一个中，使得可以使用相同的模块化封装来实现多种设备格式，同时减少改变设备格式所需的RF测试的量。 在一种配置中，表面安装装置安装在板的第一表面上，并且板被直接表面安装到基板上。 这里，基板包括用于容纳表面安装装置的孔，提供薄的装置格式。 在第二构造中，间隔件被安装在板的第一表面上，使得在板和基板之间设置有用于容纳表面安装装置的间隙，提供相对较厚的装置，但是提供额外的表面积， 否则将会是，减少设备大小。