Abstract:
Circuit apparatus comprises an integral structure of first and second multilayer wiring board portions and a flexible circuit portion. The wiring board portions each have at least circuit trace planes, ground planes and insulator planes. The flexible circuit portion includes at least one signal trace plane and at least one ground plane separated by at least one insulator plane; the singal trace plane of the flexible circuit portion being integral with a signal trace plane of each of the wiring board portions, the ground plane of the flexible circuit portion being integral with a ground plane of each of the wiring board portions, and the insulator plane of the flexible circuit portion being integral with an insulator plane of each of the wiring board portions. Selected ones of a plurality of electric contacts are connected to selected ones of the circuit traces of the circuit trace plane of the flexible circuit portions; others of the contacts being connected to the ground plane. A pin connector is conencted to the plurality of contacts and is arranged to electrically connect selected circuits traces and the ground plane of the flexible circuit portion to an interconnect backpanel, thereby electrically connecting the wiring board portions to the backpanel with minimum inductance.
Abstract:
A stacked packaging assembly for a plurality of integrated circuit devices employs a web of flexible interconnect material folded into a `layered` arrangement of parallel web fingers onto which a plurality of integrated circuit devices are surface-mounted. The leads of the integrated circuit devices are attached to interconnect links of the flexible interconnect web. A plurality of heat sink plates are interleaved with the folded web fingers of the stack, so as to engage the integrated circuit devices mounted on the web fingers. The heat sink plates are retained by thermally conductive spacer blocks along their edges. The spacer blocks are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers.
Abstract:
A printed circuit board handle is disclosed for use with a printed circuit board. The printed circuit board handle includes a flange that extends for the length of the handle and is mounted to the printed circuit board. Two ribs protrude from the side of the flange that is adjacent to the printed circuit board and extend for the length of the handle. The ribs contact the printed circuit board in such a manner as to separate the body of the flange from the printed circuit board and thereby prevent the capillary action that causes entrapment of flux between the flange and the printed circuit board, during the wave soldering process.
Abstract:
A previously fabricated flat flexible cable (10) includes tears and/or micro-fissures, micro-cuts or other defects or imperfections, depicted by jagged or wavy lines (16), in its edges (18). A multi-fiber tread (20), placed at the cable's edges, is enclosed within, between and/or atop one or more layers of adhesive film (22). A bond material (26) bonds the film layers to themselves at their ends (28), to the cable respectively at its sides (24), and to the thread. The bond material is also bonded to and within the micro-fissures, micro-cuts or other defects for repair thereof. The bond material also bonds thread (20) to portions of the cable adjacent to the tear to prevent further propagation of the tear into the cable.
Abstract:
A flexible cable assembly having a leadless chip carrier attached to a flexible cable for providing drive signals to a matrix display element. Pins at one end of the flexible cable assembly plug into a printed wiring board and exposed metallic pads at the other end press against mating pads on the edge of the display element; the pressed together pads are held in place with a U-shaped clamp. Connection points on the leadless chip carrier are soldered to mating soldering pads on the flexible cable. A heat sink/backer is attached to the opposite side of the flexible cable under the leadless chip carrier.
Abstract:
A stiffener for a printed circuit board which comprises an elongated metallic electrically conductive bar. Extending from the bar are a plurality of spaced apart pins with these pins being in longitudinal alignment. Each pin is constructed to facilitate physical deformation such as by including a through opening within the body of the pin or with the pin including notched-out areas in the side walls of the pin. Upon the pin incurring a sufficiently powerful striking force, the pin will deform and expand laterally.
Abstract:
A wiring module for electrically connecting a plurality of electric parts disposed on an equipment frame to a source of electric power, the module comprising an elongated insulating substrate formed to extend along a path adjacent to electric parts disposed on the frame. A pattern of wiring conductors extends along and integral with the insulating substrate for conducting electric current from the source of electric power to each of the electric parts to be connected. The insulating substrate has one or more edge portions provided with protrusions integrally formed with the substrate and extending laterally therefrom. The protrusions each are positioned on the insulating substrate at a location adjacent an electric part to be connected and at least a portion of the wiring conductors are integral with the protrusions to provide a contact on the protrusions for connection to corresponding electric parts.
Abstract:
A position transducer has an input shaft coupled to a variable inductance sensor to produce an output electrical signal representing shift angle position. The transducer includes a plurality of rigid circuit boards which are hinged to one another so that the circuit boards and the electronic circuitry supported on the boards can be wrapped around the variable inductance sensor. The individual rigid circuit board segments are laminated onto a flexible sheet having conductive tracks. The track sheet provides the hinged effect.The power supply which is mounted on one or more of the boards provides DC power through an AC circuit fed by a transistor which is switched on and off as a function of the power needs of the transducer. By thus having an ON duty cycle substantially less than 100 percent, the heat generated in the power supply is minimized thereby making feasible the packing density afforded by the plurality of hinged circuit boards.
Abstract:
A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
Abstract:
A probe for an in-circuit emulator comprising a flexible substrate composed of a base film, a pattern provided on a central portion of the base film, plastic parts mounted on both ends of the base film, a connecting element detachably provided at one end of the flexible substrate, and reinforcing members mounted on the plastic parts.