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公开(公告)号：US20230413445A1
公开(公告)日：2023-12-21
申请号：US18240032
申请日：2023-08-30
Applicant: WHIRLPOOL CORPORATION
Inventor： MATTHEW P. EBROM , NEOMAR GIACOMINI , MARK E. GLOTZBACH , BRIAN N. RADFORD
CPC classification number: H05K1/181 , G06F1/1637 , G06F3/041 , H05K3/325 , H05K1/144 , G06F2203/04103 , H05K2201/0367 , H05K2201/10598 , H05K2201/041 , H05K2201/10106
Abstract: Example human-machine interface (HMI) assemblies are disclosed. One example HMI assembly includes a printed circuit board (PCB) and a backer selectively flexible between a first curved state and a second flexed state, and attached to the fascia in the second flexed state to bias the PCB against the fascia.
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公开(公告)号：US20230413439A1
公开(公告)日：2023-12-21
申请号：US18459949
申请日：2023-09-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Issei YAMAMOTO
CPC classification number: H05K1/14 , H05K3/4611 , H05K1/181 , H05K1/189 , H05K3/284 , H05K1/0296 , H05K1/183 , H05K1/028 , H05K2201/041
Abstract: Wiring board includes rigid board and flexible board laminated on rigid board. Cavity recessed in thickness direction of rigid board is formed in surface of rigid board which is located on flexible board side. Side surface and bottom surface of cavity are formed of rigid board. Top surface of cavity is formed of flexible board.
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公开(公告)号：US20230309215A1
公开(公告)日：2023-09-28
申请号：US18022876
申请日：2020-09-03
Applicant: Telefonaktiebolaget LM Ericsson (publ)
Inventor： Marthinus DA SILVERIA , Neil McGOWAN
CPC classification number: H05K1/0239 , H05K1/144 , H05K1/115 , H05K2201/041
Abstract: A radio frequency (RF) coupler is configured to carry RF signals from a first printed circuit board (PCB) to a second PCB. The RF coupler includes a first trace on an outer surface of the first PCB and a second trace on an outer surface of the second PCB. The first trace and the second trace at least partially overlap to form an RF broadside coupler when the first PCB is positioned adjacent the second PCB. Each of the first trace and the second trace are covered by respective dielectric coatings such that a direct current (DC) electrical connection between the first trace and the second trace is prevented when the first PCB is positioned adjacent the second PCB.
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公开(公告)号：US11737211B2
公开(公告)日：2023-08-22
申请号：US17371813
申请日：2021-07-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong Min , Ho Hyung Ham , Yong Soon Jang , Ki Suk Kim , Hyung Ki Lee , Chi Won Hwang
CPC classification number: H05K1/115 , G06F1/189 , H05K2201/0338 , H05K2201/041
Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
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公开(公告)号：US11706868B2
公开(公告)日：2023-07-18
申请号：US17761557
申请日：2021-04-16
Inventor： Qing Gong
CPC classification number: H05K1/0216 , H05K1/0224 , H05K1/144 , H05K2201/041 , H05K2201/10128
Abstract: A circuit board includes at least one circuit board unit sequentially stacked in a thickness direction of the circuit board, an insulating layer, an electromagnetic shielding layer, and a barrier layer. The circuit board unit includes a substrate layer, and two conductive layers respectively disposed on two opposite sides of the substrate layer in a thickness direction of the substrate layer, and each of the conductive layers includes a plurality of signal lines. The insulating layer is located on a side of an outermost conductive layer away from the substrate layer. The electromagnetic shielding layer is located on a side of the insulating layer away from the substrate layer. The barrier layer is located between the electromagnetic shielding layer and the outermost conductive layer. The barrier layer at least covers a plurality of signal lines in the outermost conductive layer.
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Patent Agency Ranking
公开(公告)号：US20230180383A1
公开(公告)日：2023-06-08
申请号：US18162668
申请日：2023-01-31
Applicant: AT&S (China) Co. Ltd.
Inventor： Nick Xin , Mikael Tuominen , Seok Kim Tay
CPC classification number: H05K1/0278 , H05K1/0366 , H05K3/4691 , H05K1/144 , H05K3/0032 , H05K2201/09036 , H05K2201/09845 , H05K2203/107 , H05K2201/041
Abstract: A component carrier with a stack including a first core layer structure and a second core layer structure, and a recess extending completely through the first core layer structure and extending at least partially into the second core layer structure. Each core layer structure has at least one electrically conductive layer structure and at least one electrically insulating layer structure. The core layer structures are stacked with one on top of the other in a stacking direction.
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公开(公告)号：US20190252840A1
公开(公告)日：2019-08-15
申请号：US16394365
申请日：2019-04-25
Applicant: AMAZON TECHNOLOGIES, INC.
Inventor： James Siminoff , Mark Siminoff
IPC: H01R33/94 , H05K5/00 , H01R33/945 , H05K3/36 , H01R12/70 , H01R33/97 , H01R13/639 , H05K5/02 , H05K1/14 , H01R31/06 , H01R13/622
CPC classification number: H01R33/94 , H01R12/707 , H01R12/7088 , H01R12/714 , H01R13/622 , H01R13/6397 , H01R13/748 , H01R31/065 , H01R33/72 , H01R33/9456 , H01R33/971 , H05K1/144 , H05K3/368 , H05K5/0052 , H05K5/0069 , H05K5/0073 , H05K5/0247 , H05K5/069 , H05K2201/041 , H05K2201/048 , H05K2201/10318 , H05K2201/10356 , H05K2201/2018
Abstract: A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.
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公开(公告)号：US20190229449A1
公开(公告)日：2019-07-25
申请号：US16371708
申请日：2019-04-01
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC: H01R12/59 , H01R12/69 , H01B7/08 , H05K1/02 , B60J5/04 , H01B7/04 , B60R16/02 , H01B7/00 , H01R43/20
CPC classification number: H01R12/592 , B60J5/0413 , B60R16/0215 , B60Y2410/115 , H01B7/0045 , H01B7/04 , H01B7/08 , H01B7/421 , H01B13/01254 , H01R12/69 , H01R43/205 , H01R2201/26 , H05K1/0201 , H05K1/028 , H05K1/118 , H05K3/0052 , H05K3/28 , H05K3/366 , H05K3/368 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/041 , H05K2201/052 , H05K2201/09063 , H05K2201/10189 , H05K2203/0228
Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
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公开(公告)号：US20190199025A1
公开(公告)日：2019-06-27
申请号：US16222745
申请日：2018-12-17
Applicant: LG Display Co., Ltd.
Inventor： Geunyoung KIM
CPC classification number: H01R12/79 , H01B7/04 , H01B7/08 , H01R12/7011 , H01R12/7076 , H01R12/88 , H01R13/6461 , H05K1/0245 , H05K1/115 , H05K1/118 , H05K1/144 , H05K2201/041 , H05K2201/09409 , H05K2201/09709 , H05K2201/09781 , H05K2201/10128 , H05K2201/10356
Abstract: In at least one embodiment, the present disclosure provides a device that includes a cable. The cable includes a film. A first cable pin and a second cable pin are spaced apart from one another in a first pin region on a first face of the film. A third cable pin and a fourth cable pin are spaced apart from one another in a second pin region on a second face of the film that is opposite the first face. A first cable signal line on the first face of the film is connected to the first cable pin, and a second cable signal line on the first face of the film is connected to the second cable pin. A third cable signal line on the second face of the film is connected to the third cable pin, and a fourth cable signal line on the second face of the film is connected to the fourth cable pin.
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公开(公告)号：US20180301859A1
公开(公告)日：2018-10-18
申请号：US15954448
申请日：2018-04-16
Applicant: Ring Inc.
Inventor： James Siminoff , Mark Siminoff
IPC: H01R33/94 , H05K1/14 , H01R12/70 , H01R12/71 , H01R31/06 , H01R13/74 , H01R33/97 , H01R13/622 , H05K5/00 , H05K5/02 , H01R33/72 , H01R13/639
CPC classification number: H01R33/94 , H01R12/707 , H01R12/7088 , H01R12/714 , H01R13/622 , H01R13/6397 , H01R13/748 , H01R31/065 , H01R33/72 , H01R33/9456 , H01R33/971 , H05K1/144 , H05K3/368 , H05K5/0052 , H05K5/0069 , H05K5/0073 , H05K5/0247 , H05K5/069 , H05K2201/041 , H05K2201/048 , H05K2201/10318 , H05K2201/10356 , H05K2201/2018
Abstract: A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.
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