公开(公告)号：US09933131B2

公开(公告)日：2018-04-03

申请号：US15058755

申请日：2016-03-02

Applicant: WHIRLPOOL CORPORATION

Inventor： Matthew P. Ebrom ,  Eric J. Schuh ,  Sithaarth T. Subramaniyam ,  Sugosh Venkataraman ,  Shivayogi Annigeri ,  Michael E. Gatt ,  Ajay Ram Narayana Pillai ,  Mihir Ponkshe

IPC: F21V23/06 ,  F21V7/04 ,  F21V23/00 ,  F21V33/00 ,  H05K1/02 ,  F24C7/08 ,  F21W131/305 ,  F21W131/307

CPC classification number: F21V7/04 ,  F21V23/005 ,  F21V23/06 ,  F21V33/0044 ,  F21W2131/305 ,  F21W2131/307 ,  F24C7/082 ,  H05K1/0274 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: In one aspect, a device has a controller and a fascia assembly, with a fascia, and a printed circuit board (PCB) mounted to the fascia. The PCB has a plurality of holes, and a plurality of light emitting diodes (LEDs), wherein one LED is mounted adjacent to each hole. The device also includes a wiring harness coupling the controller to the PCB wherein the LEDs may be energized according to signals received from the controller; and a console adjacent the PCB. The console has a plurality of light reflecting cups arranged therein so that each light reflecting cup covers an LED and the adjacent hole to reflect light from the LEDs through the holes so that the light is visible through the fascia assembly.

公开(公告)号：US09917068B2

公开(公告)日：2018-03-13

申请号：US14213774

申请日：2014-03-14

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Hao-Cheng Hou ,  Yu-Feng Chen ,  Jung Wei Cheng ,  Yu-Min Liang ,  Tsung-Ding Wang

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/13 ,  H05K3/34

CPC classification number: H01L24/17 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/81805 ,  H01L2924/00011 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00

Abstract: In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer.

公开(公告)号：US20180041026A1

公开(公告)日：2018-02-08

申请号：US15725572

申请日：2017-10-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： HIROKI SAKAMOTO

IPC: H02H7/16 ,  H05K1/18 ,  H01G4/002 ,  H05K3/46 ,  H01G4/258 ,  H05K3/40 ,  H05K3/34 ,  H05K1/11 ,  H01G4/40

CPC classification number: H02H7/16 ,  H01G2/06 ,  H01G4/002 ,  H01G4/248 ,  H01G4/258 ,  H01G4/30 ,  H01G4/40 ,  H05K1/0257 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/141 ,  H05K1/167 ,  H05K1/181 ,  H05K3/0047 ,  H05K3/027 ,  H05K3/1233 ,  H05K3/341 ,  H05K3/3442 ,  H05K3/4053 ,  H05K3/4611 ,  H05K2201/0792 ,  H05K2201/09072 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10378 ,  H05K2201/10553 ,  H05K2201/10636 ,  H05K2203/043 ,  H05K2203/046 ,  H05K2203/107

Abstract: An electronic-device having an intermediate connection layer interposed between a wiring substrate and an electronic component. The intermediate connection layer has a laminated structure including a rigid substrate and a flexible substrate. A first conductor part is formed on one principal surface of the flexible substrate, and second and third conductor parts are formed on both principal surfaces of the rigid substrate, respectively. The rigid substrate includes an opening, and the first conductor part of the flexible substrate includes a narrowed fuse part at a position opposite the opening. Windows are formed near the fuse part. The flexible substrate and the rigid substrate are electrically connected with each other via solder.

公开(公告)号：US20170311450A1

公开(公告)日：2017-10-26

申请号：US15648465

申请日：2017-07-13

Applicant: Subtron Technology Co., Ltd.

Inventor： Yu-Chi Huang ,  Kuo-Tung Lin

IPC: H05K3/00 ,  H05K3/34

CPC classification number: H05K3/007 ,  B32B2457/08 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85005 ,  H01L2924/15151 ,  H01L2924/15313 ,  H05K3/3421 ,  H05K2201/0154 ,  H05K2201/09072 ,  H05K2203/0156 ,  H01L2924/00014

Abstract: A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.

公开(公告)号：US09768527B2

公开(公告)日：2017-09-19

申请号：US15288538

申请日：2016-10-07

Applicant: AVX Corporation

Inventor： Peter Bishop

IPC: H01R4/24 ,  H01R4/48 ,  H01R12/53 ,  H01R12/71 ,  H05K3/32 ,  H01R4/18 ,  H01R12/70 ,  H01R13/62 ,  H05K1/11 ,  H01R101/00 ,  H05K3/34

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

公开(公告)号：US09723718B2

公开(公告)日：2017-08-01

申请号：US14452785

申请日：2014-08-06

Applicant: Mitsubishi Electric Corporation

Inventor： Taichi Obara ,  Rei Yoneyama ,  Takami Otsuki ,  Eiju Shitama

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/15 ,  H05K3/34 ,  H05K7/12 ,  H05K7/00 ,  H01L23/13 ,  H01L23/373 ,  H01L23/498

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49844 ,  H01L2224/32225 ,  H01L2924/19105 ,  H05K1/11 ,  H05K1/111 ,  H05K1/186 ,  H05K1/188 ,  H05K3/3442 ,  H05K2201/09072 ,  H05K2201/09745 ,  H05K2201/10 ,  H05K2201/10174 ,  H05K2201/1059 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10674 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

公开(公告)号：US09674960B2

公开(公告)日：2017-06-06

申请号：US14700204

申请日：2015-04-30

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

Inventor： Johannes Stahr ,  Markus Leitgeb

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/185 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/14 ,  H05K1/144 ,  H05K1/181 ,  H05K1/186 ,  H05K3/4623 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09618 ,  H05K2201/10 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49126 ,  Y10T29/49144

Abstract: A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein.

公开(公告)号：US09673365B2

公开(公告)日：2017-06-06

申请号：US14771850

申请日：2014-03-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Martin Haushalter ,  David O'Brien

IPC: H01L33/62 ,  H01L33/48 ,  H05K1/18 ,  H05K3/34 ,  F21K9/20 ,  H05K1/14

CPC classification number: H01L33/62 ,  F21K9/20 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K1/141 ,  H05K1/142 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09954 ,  H05K2201/10106 ,  Y02P70/613 ,  H01L2924/00014

Abstract: An electronic device includes a printed circuit board having a cutout, wherein an optoelectronic component including a housing having an outer surface, the housing has a chip receptacle space at a top side, an optoelectronic semiconductor chip is arranged in the chip receptacle space, the housing has a first soldering contact surface and a second soldering contact surface, the first soldering contact surface and the second soldering contact surface face in the same spatial direction as the outer surface, and the first soldering contact surface and the second soldering contact surface are set back relative to the outer surface, is arranged in the cutout.

公开(公告)号：US20170136945A1

公开(公告)日：2017-05-18

申请号：US15417453

申请日：2017-01-27

Applicant: YAZAKI CORPORATION

Inventor： Kazuhiro SHOHHARA

IPC: B60Q3/20 ,  F21V23/06 ,  H01L33/62 ,  F21V14/02

CPC classification number: B60Q3/20 ,  F21V14/02 ,  F21V15/012 ,  F21V19/00 ,  F21V19/0015 ,  F21V23/06 ,  F21Y2107/50 ,  F21Y2115/10 ,  H01L33/62 ,  H02G5/005 ,  H05K1/183 ,  H05K2201/09045 ,  H05K2201/09072 ,  H05K2201/0999 ,  H05K2201/10106 ,  H05K2201/10272

Abstract: An illumination device includes a light emitting element, a bus bar in which the light emitting element is attached, and a housing in which the bus bar is insert-molded. The bus bar includes a bus bar main body which is flat-plate-shaped and a bent piece extended in the bus bar main body and bent so as to be inclined to the bus bar main body. The housing includes a protruding part which protrudes from a surface covering the bus bar main body so as to cover at least a part of the bent piece and which has an inclined surface parallel to the bent piece, and a hole on the inclined surface of the protruding part formed so that the bent piece is exposed. The light emitting element is attached to the bent piece so as to be accommodated in the hole.

公开(公告)号：US20170099745A1

公开(公告)日：2017-04-06

申请号：US15383405

申请日：2016-12-19

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K7/20

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.