中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

812 records (took 0.021 seconds)

    LIGHT-EMITTING DEVICE
    12.
    发明申请
    LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20170150609A1

    公开(公告)日：2017-05-25

    申请号：US15354825

    申请日：2016-11-17

    Applicant: TOYODA GOSEI CO., LTD.

    Inventor： Tomohiro MIWA ,  Hideaki KATO ,  Daisuke KATO ,  Shota SHIMONISHI

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H05B33/0803 ,  H05K1/0209 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10106 ,  Y02P70/611

    Abstract: A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring board and each connect predetermined ones of the plurality of light-emitting elements in series. A central element-connection wiring has a longest wiring length among the plurality of wirings, and a voltage applied to a central element is a lowest one of voltages applied to the plurality of light-emitting elements. A closest one of the plurality of light-emitting elements to a center of an element mounting region of the wiring board is defined as the central element, and a wiring that connects in series the central element is defined as the central element-connection wiring.

    CAMERA FOR VEHICLE VISION SYSTEM
    17.
    发明申请
    CAMERA FOR VEHICLE VISION SYSTEM 审中-公开
    车辆视觉系统相机

    公开(公告)号：US20160212847A1

    公开(公告)日：2016-07-21

    申请号：US15083896

    申请日：2016-03-29

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Marc Sigle

    IPC: H05K1/11 ,  B60R1/00 ,  H05K1/18 ,  H04N7/18 ,  G06K9/00

    CPC classification number: H05K1/111 ,  B60R1/00 ,  B60R2300/8066 ,  G06K9/00805 ,  H04N7/183 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/09418 ,  Y02P70/611

    Abstract: A vehicle vision system includes at least one camera operable to capture image data, and an image processor chip operable to process image data captured by the at least one camera for detecting at least one of a vehicle and a pedestrian present in the field of view of the at least one camera. The image processor chip is surface mounted at a mounting location of a circuit board that has a plurality of solder pads established thereat that correspond to a plurality of respective solder points of the image processor chip. The plurality of solder pads include elongated solder pads having respective longitudinal axes. The mounting location includes first, second, third and fourth quadrants. The longitudinal axes of elongated solder pads disposed at the first quadrant are aligned different from the longitudinal axes of elongated solder pads disposed at the second quadrant.

    Abstract translation: 一种车辆视觉系统包括至少一个可操作以捕捉图像数据的照相机，以及图像处理器芯片，其可操作以处理由所述至少一个照相机捕获的图像数据，用于检测在视野中存在的车辆和行人中的至少一个 至少一个相机。 图像处理器芯片被表面安装在电路板的安装位置，该电路板具有与图像处理器芯片的多个相应焊接点对应的多个焊盘。 多个焊盘包括具有相应纵向轴线的细长焊盘。 安装位置包括第一，第二，第三和第四象限。 设置在第一象限处的细长焊盘的纵向轴线与设置在第二象限处的细长焊盘的纵向轴线对准。

    PCB pad for imager of vehicle vision system
    18.
    发明授权
    PCB pad for imager of vehicle vision system 有权
    车载视觉系统成像用PCB板

    公开(公告)号：US09307640B2

    公开(公告)日：2016-04-05

    申请号：US14082574

    申请日：2013-11-18

    Applicant: MAGNA ELECTRONICS INC.

    Inventor： Marc Sigle

    IPC: H05K1/11

    CPC classification number: H05K1/111 ,  B60R1/00 ,  B60R2300/8066 ,  G06K9/00805 ,  H04N7/183 ,  H05K1/181 ,  H05K2201/09381 ,  H05K2201/09418 ,  Y02P70/611

    Abstract: A circuit board for an image processing chip of a vision system of a vehicle is configured for a surface mount device to be attached thereto and includes at least one mounting location having a plurality of solder pads established thereat. The pads are arranged in a manner that enhances soldering of the device or component to the pad and circuit board. The pads may be arranged similarly in respective portions of the mounting location, such that the pads of one portion of the mounting location may be generally parallel to one another and may be generally orthogonal to the pads of another portion of the mounting location. Optionally, the pads may be generally tear-drop shaped, and the tear-drop shaped pads may be arranged so as to point generally towards or generally away from a center area of the mounting location of the circuit board.

    Abstract translation: 用于车辆视觉系统的图像处理芯片的电路板被配置为用于附接到其上的表面安装装置，并且包括至少一个安装位置，该安装位置具有在其上建立的多个焊盘。 焊盘以增强器件或部件对焊盘和电路板的焊接的方式布置。 垫可以类似地布置在安装位置的相应部分中，使得安装位置的一部分的焊盘可以大体上彼此平行并且可以大致垂直于安装位置的另一部分的焊盘。 可选地，垫可以通常为泪滴形状，并且泪滴形垫可以被布置成大致朝向或大体上远离电路板的安装位置的中心区域。

    SOLDER PADS, METHODS, AND SYSTEMS FOR CIRCUITRY COMPONENTS
    19.
    发明申请
    SOLDER PADS, METHODS, AND SYSTEMS FOR CIRCUITRY COMPONENTS 有权
    电路组件的焊盘，方法和系统

    公开(公告)号：US20160029485A1

    公开(公告)日：2016-01-28

    申请号：US14337377

    申请日：2014-07-22

    Applicant: Cree, Inc.

    Inventor： Andrew K. Dummer

    IPC: H05K1/11 ,  B23K1/20 ,  F21K99/00 ,  H05K3/34 ,  H05K1/18 ,  B23K1/00 ,  B23K31/02

    CPC classification number: H05K1/111 ,  B23K1/0016 ,  B23K1/20 ,  B23K31/02 ,  H01L2224/16225 ,  H05K1/0295 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/048 ,  Y02P70/611

    Abstract: Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.

    Abstract translation: 提供焊盘，系统和相关方法。 第一或第二焊盘包括用于增加可用于对准待焊接到其上的至少一个部件的边缘的数量的至少一个形状。 每个焊盘可以占据基板的相同表面积。 多个电路元件可以设置在多个焊盘上，其中一些电路元件占据基板和/或焊盘的不同表面积。 提供焊盘的方法包括提供衬底，在衬底上提供焊盘，并在焊盘中提供至少一种形状，以增加可用于对准待焊接到其上的至少一个部件的多个边缘。 垫可以例如附接到表面安装陶瓷部件，无基座部件，引线框架部件和/或板上部件上。

    Bonding structure
    20.
    发明授权
    Bonding structure 有权
    粘结结构

    公开(公告)号：US09204529B2

    公开(公告)日：2015-12-01

    申请号：US13858955

    申请日：2013-04-09

    Applicant: TPK Touch Solutions (Xiamen) Inc.

    Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

    IPC: H05K1/11 ,  H05K1/02 ,  H05K3/38 ,  H05K3/36 ,  H05K3/32 ,  H05K3/28

    CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

    Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one groove structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

    Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个槽结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。

Patent Agency Ranking