公开(公告)号：US20130307636A1

公开(公告)日：2013-11-21

申请号：US13759402

申请日：2013-02-05

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kanehisa KIMBARA ,  Osamu KAWACHI

IPC: H03H9/70

CPC classification number: H03H9/46 ,  H03H9/0542 ,  H03H9/70 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10204 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes: a circuit board; a package that includes an acoustic wave filter and is located on a top surface of the circuit board; a dummy package that is located on the top surface of the circuit board; and a lid that is located above the package and the dummy package.

Abstract translation: 复合电子部件包括：电路板; 包括声波滤波器并且位于电路板的顶表面上的封装; 位于电路板的顶表面上的虚拟封装; 以及位于包装和虚拟包装上方的盖子。

公开(公告)号：US07821346B2

公开(公告)日：2010-10-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00 ,  H03B5/32 ,  H03L1/02

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US07646255B2

公开(公告)日：2010-01-12

申请号：US11985132

申请日：2007-11-14

Applicant: Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

Inventor： Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

IPC: H03B5/12

CPC classification number: H03B5/1847 ,  H03B2200/0008 ,  H03B2200/0034 ,  H03B2200/004 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10734

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract translation: 压控振荡器（VCO）组件和模块结合有球栅阵列谐振器作为压控振荡器的电路的一部分。 VCO模块优选地至少包括振荡器电路，振荡电路和输出缓冲级电路，其全部由包括安装到印刷电路板的球栅阵列谐振器的多个互连的电气/电子部件限定。 在另一个实施例中，振荡器组件还包括至少部分地由安装到印刷电路板的集成电路限定的锁相环电路。

公开(公告)号：US07541883B2

公开(公告)日：2009-06-02

申请号：US11598491

申请日：2006-11-13

Applicant: Thomas A. Knecht ,  Robert Jacobson ,  Glen Reeser

Inventor： Thomas A. Knecht ,  Robert Jacobson ,  Glen Reeser

IPC: H03B5/18 ,  H03L7/099

CPC classification number: H03B5/1805 ,  H03B5/1221 ,  H03B5/1231 ,  H03B5/1243 ,  H03L7/06 ,  H03L7/099 ,  H03L7/16 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: A synthesizer module/oscillator assembly includes a voltage controlled oscillator with a coaxial resonator. In one embodiment, the module measures 20.3 mm×14.8 mm×3.9 mm and the coaxial resonator is positioned on the circuit board of the module between a phase locked loop integrated circuit and a main section of the voltage controlled oscillator. The phase locked loop circuit includes a loop filter and is adapted to receive the frequency signal generated by the voltage controlled oscillator and generate an adjusted frequency signal.

Abstract translation: 合成器模块/振荡器组件包括具有同轴谐振器的压控振荡器。 在一个实施例中，该模块测量为20.3mm×14.8mm×3.9mm，并且同轴谐振器位于模块的电路板之间的锁相环集成电路和压控振荡器的主要部分之间。 锁相环电路包括环路滤波器，并且适于接收由压控振荡器产生的频率信号并产生经调整的频率信号。

公开(公告)号：US20030095019A1

公开(公告)日：2003-05-22

申请号：US09999068

申请日：2001-11-19

Inventor： Allen M. Hobbs ,  Dennis R. Clark

IPC: H01P007/04

CPC classification number: H01P7/04 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10969

Abstract: A resonator including a resonator body having a longitudinally extending through hole, an electrically conductive coating formed on the inner and outer surfaces of the resonator and an electrical gap formed by cutting a groove around the circumference of the body. The groove divides the resonator body into a short section and a long section, wherein the short section is used as a conductive pad for attachment to a circuit board.

Abstract translation: 包括具有纵向延伸的通孔的谐振器体的谐振器，形成在谐振器的内表面和外表面上的导电涂层以及通过围绕本体的圆周切割凹槽而形成的电隙。 该槽将谐振器体分为短截面和长截面，其中短截面用作连接到电路板的导电垫。

公开(公告)号：US06369335B1

公开(公告)日：2002-04-09

申请号：US09525075

申请日：2000-03-14

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01N909

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  Y10T29/49137 ,  H01L2924/00

Abstract: A method for manufacturing substrate elements includes providing a mother substrate, forming at least one elongated through-hole on the mother substrate such that an entire longitudinal end surface of the first substrate element and a portion of a lateral surface of the second substrate element are exposed, forming an electrode pattern on the inner surface of the at least one elongated through-hole, and cutting the mother substrate along lines extending in the vicinity of the longitudinal ends of the at least one elongated through-hole and in a direction that is substantially perpendicular to the longitudinal axis of the elongated through-hole.

Abstract translation: 一种用于制造衬底元件的方法包括：提供母体衬底，在母体衬底上形成至少一个细长的通孔，使得第一衬底元件的整个纵向端表面和第二衬底元件的侧表面的一部分露出 在所述至少一个细长通孔的内表面上形成电极图案，并且沿着在所述至少一个细长通孔的纵向端部附近延伸的线沿着基本上 垂直于细长通孔的纵向轴线。

公开(公告)号：US5764117A

公开(公告)日：1998-06-09

申请号：US677925

申请日：1996-07-10

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A method of manufacturing a dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 一种制造介质谐振元件的方法包括至少一个电介质多级谐振器，其包括一个介电块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体 以及覆盖所述一个介质块的大致整个外表面的外导体，所述介质多级谐振器在所述一个介质块中构成多个介质谐振器; 以及固定安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US20180079036A1

公开(公告)日：2018-03-22

申请号：US15708150

申请日：2017-09-19

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Toshimasa TSUDA ,  Daisuke NISHIYAMA ,  Makoto HATANO ,  Kei OZAKI ,  Tomohisa HARADA

IPC: B23K35/26 ,  H03H9/10 ,  H03H9/25 ,  B23K35/36

CPC classification number: B23K35/262 ,  B23K35/36 ,  H03H9/1021 ,  H03H9/1092 ,  H03H9/25 ,  H05K1/181 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/10068 ,  H05K2201/10083

Abstract: A solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 25 mass % or less of Ag, and 1.3 to 6 mass % of In.

公开(公告)号：US09633873B2

公开(公告)日：2017-04-25

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi Yamauchi ,  Osamu Kawachi

IPC: H05K7/00 ,  H01L21/56 ,  H03H9/10 ,  H01L23/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H03H9/00 ,  H03H9/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

公开(公告)号：US09386703B2

公开(公告)日：2016-07-05

申请号：US14345143

申请日：2012-09-13

Applicant: Akira Oikawa

Inventor： Akira Oikawa

IPC: H05K7/00 ,  H05K1/18 ,  H03H9/05 ,  H03H9/10 ,  H05K3/28 ,  H01L23/31 ,  H05K1/02

CPC classification number: H05K1/185 ,  H01L23/3121 ,  H01L23/315 ,  H01L2224/16225 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/10068

Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

Abstract translation: 该电子装置设置有布线板，安装在布线板的上表面（前表面）上以使其功能表面（主表面）面向上表面的压电元件（电子部件），以及 树脂部分粘附到压电元件的侧表面和布线板，并且密封布线板的上表面和压电元件的功能表面之间的相对的空间。 此外，树脂部分相对于相对的空间凹陷成形。