公开(公告)号：US20170086304A1

公开(公告)日：2017-03-23

申请号：US14859026

申请日：2015-09-18

Applicant: Delaware Capital Formation, Inc.

Inventor： Mark Hahn

IPC: H05K3/10 ,  B23K26/0622 ,  B23K9/09 ,  B23K26/21 ,  H05K1/18 ,  B23K9/167

CPC classification number: H05K3/103 ,  B23K9/0043 ,  B23K9/091 ,  B23K9/092 ,  B23K9/167 ,  B23K9/23 ,  B23K26/0622 ,  B23K26/21 ,  B23K26/22 ,  B23K26/32 ,  B23K2101/38 ,  B23K2103/00 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/07 ,  H01L24/08 ,  H01L24/09 ,  H01L24/42 ,  H01L24/44 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02163 ,  H01L2224/02185 ,  H01L2224/04042 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/48476 ,  H01L2224/80007 ,  H01L2224/80009 ,  H01L2224/8019 ,  H01L2224/8034 ,  H01L2924/00014 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.

公开(公告)号：US09591770B2

公开(公告)日：2017-03-07

申请号：US14256828

申请日：2014-04-18

Applicant: KLA-Tencor Corporation

Inventor： Robert Haynes ,  Mehran Nasser-Ghodsi

IPC: H02G3/22 ,  H02G1/14 ,  H05K3/40 ,  H05K1/14 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K3/4046 ,  H05K1/147 ,  H05K3/365 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10545 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Embodiments of this invention use multi-layer ceramic substrate with one or more hermetically sealed and filled metal vias with smaller pitch and size in combination with flexible printed circuit cables and interposers to provide a custom electric feed through for vacuum to atmosphere chambers. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

Abstract translation: 本发明的实施例使用具有一个或多个具有较小节距和尺寸的密封和填充的金属通孔的多层陶瓷基板，与柔性印刷电路电缆和插入件组合，以提供用于真空到大气室的定制电加料。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。

公开(公告)号：US09560736B2

公开(公告)日：2017-01-31

申请号：US14546494

申请日：2014-11-18

Applicant: Cisco Technology, Inc.

Inventor： Long Dang ,  Don Nguyen ,  Michael Brooks

IPC: H05K1/02 ,  H05K3/22 ,  F16B2/24 ,  H05K1/18

CPC classification number: H05K7/2039 ,  F16B2/248 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K3/22 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10265 ,  H05K2201/10393

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract translation: 在一个实施例中，印刷电路板具有孔。 该孔在印刷电路板的表面上具有最长的程度。 夹子通过脚的脚插在孔中。 脚是具有长度超过孔的最长程度的一半的延伸部。 散热器部分地通过夹子相对于印刷电路板保持。 散热器的一部分接触夹子的环，并且将夹子施加在远离印刷电路板的夹子上。 印刷电路板相对于散热器的夹子的脚将夹子固定到印刷电路板上以抵抗力。 所述插脚构造成抵消所述脚，使得所述延伸部与沿着所述孔的最长延伸部分延伸的长度小于所述脚的长度的总和小于通过所述孔插入的最长程度。

公开(公告)号：US20160029492A1

公开(公告)日：2016-01-28

申请号：US14771512

申请日：2014-01-31

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Nozomu HIKINO ,  Hiroyuki TAKEBE

IPC: H05K3/00 ,  H04M1/02 ,  H05K1/03 ,  H05K1/11 ,  B29C45/14 ,  B29C45/16

CPC classification number: H05K3/0014 ,  B29C45/14 ,  B29C45/16 ,  B29C45/1671 ,  B29C2045/0079 ,  B29C2045/1687 ,  B29K2055/02 ,  B29K2069/00 ,  B29L2009/00 ,  B29L2031/3456 ,  B29L2031/3481 ,  H01Q1/243 ,  H04M1/0202 ,  H04M1/0249 ,  H05K1/0284 ,  H05K1/032 ,  H05K1/119 ,  H05K1/165 ,  H05K3/36 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10265 ,  H05K2201/2036 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

Abstract translation: 第一树脂层（1）具有被第二树脂层（2）和暴露区域（1a）覆盖的被覆区域。 设置在所述露出区域（1a）中的接触部（1b） 以及设置在（a）被覆盖区域与露出区域（1a）之间的边界和（b）接触部分（1b）之间的弯曲部分（1c）。

公开(公告)号：US20150302964A1

公开(公告)日：2015-10-22

申请号：US14687040

申请日：2015-04-15

Applicant: Electroninks Writeables, Inc.

Inventor： Michael A. Bell ,  Analisa Russo

IPC: H01F7/02 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01F7/0252 ,  H05K1/0386 ,  H05K1/11 ,  H05K1/181 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/08 ,  H05K2201/10234 ,  H05K2201/10265 ,  H05K2203/104

Abstract: An electrical component for attachment to paper and other substrates comprises, according to one embodiment, a functional electronic part including one or more support pillars on an underside thereof. Each of the support pillars comprises: a channel extending therethrough from a top opening to a bottom opening, where the top opening of the channel is adjacent to the functional electronic part; and a magnet moveably positioned in the channel in electrical contact with the functional electronic part, where the bottom opening of the channel has a width smaller than a maximum lateral dimension of the magnet.

Abstract translation: 根据一个实施例，用于附接到纸和其它基底的电气部件包括在其下侧上包括一个或多个支撑柱的功能电子部件。 每个支撑柱包括：从顶部开口延伸到底部开口的通道，其中通道的顶部开口与功能电子部件相邻; 以及可移动地定位在所述通道中的与所述功能电子部件电接触的磁体，其中所述通道的底部开口具有小于所述磁体的最大横向尺寸的宽度。

公开(公告)号：US20150194753A1

公开(公告)日：2015-07-09

申请号：US14664900

申请日：2015-03-22

Applicant: Apple Inc.

Inventor： John Raff ,  Robert Scritzky

IPC: H01R12/71 ,  H05K1/18 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/716 ,  H01R12/79 ,  H01R13/20 ,  H05K1/0281 ,  H05K1/144 ,  H05K1/183 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/10189 ,  H05K2201/10265 ,  Y10T29/49126

Abstract: Board-to-board connectors that may consume a reduced amount of space in an electronic device by having a reduced height, provide a durable and reliable connection, and may be easy to manufacture. In one example, a board-to-board connector having a reduced height may reside at least partially in a recess or opening in a printed circuit board or other substrate.

Abstract translation: 板对板连接器可以通过具有减小的高度而消耗电子设备中的空间，提供耐用和可靠的连接，并且可以容易地制造。 在一个示例中，具有降低的高度的板对板连接器至少部分地可以位于印刷电路板或其他基板中的凹部或开口中。

公开(公告)号：US20150133001A1

公开(公告)日：2015-05-14

申请号：US14482242

申请日：2014-09-10

Applicant: International Business Machines Corporation

Inventor： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC: H01L23/00 ,  H01R13/02 ,  H01R13/24 ,  H01L25/00 ,  H01L21/48

CPC classification number: H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

Abstract translation: 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

公开(公告)号：US20150027766A1

公开(公告)日：2015-01-29

申请号：US14326193

申请日：2014-07-08

Applicant: CANON KABUSHIKI KAISHA

Inventor： Satoshi Ogawara

IPC: H05K1/16 ,  G03G15/00

CPC classification number: G03G15/80 ,  G03G21/1652 ,  H05K1/0254 ,  H05K1/0269 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2201/10265 ,  H05K2201/1028 ,  H05K2201/10295 ,  H05K2201/10363

Abstract: A printed circuit board, including: a substrate on which a component is mounted by solder; and a contact plate having a soldered portion soldered on the substrate, the contact plate being configured to be brought into contact with a contact of an apparatus to which the substrate is to be attached, wherein the soldered portion is soldered on a surface of the substrate opposite to a surface of the substrate on which the component is mounted, and wherein the contact plate has a suppressing portion configured to suppress an adhesion of a flux of the solder to a portion in which the contact plate is to be contacted by the contact, the suppressing portion making a flow path of the flux from the soldered portion to the portion longer than a straight-line distance from the soldered portion to the portion.

Abstract translation: 一种印刷电路板，包括：通过焊料在其上安装部件的基板; 以及具有焊接在所述基板上的焊接部分的接触板，所述接触板被构造成与所述基板要附接的装置的接触部接触，其中所述焊接部分被焊接在所述基板的表面上 与其上安装有部件的基板的表面相对，并且其中接触板具有抑制部分，该抑制部分被配置为抑制焊料焊剂与接触板与接触部分接触的部分的粘附， 所述抑制部分使得所述焊剂从所述焊接部分流向比从所述焊接部分到所述部分的直线距离长的部分。

公开(公告)号：US20140273641A1

公开(公告)日：2014-09-18

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R13/46 ,  H01R43/16

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

Abstract translation: 公开了一种电连接器，其具有基板和可移动的电触头，其安装到基板并且从基板延伸距离D。 一层可压缩材料（例如泡沫或弹性体材料）被定位在邻近至少一些电触头的衬底上，并且理想地具有稍微大于距离D的未压缩厚度以提供对电触点的保护。 当诸如电连接器或其他电路构件的匹配电气装置与其电触头及其可压缩材料层配合到电连接器时，可压缩材料层被压缩至小于距离D的厚度，允许触点 以便与匹配的电气设备形成适当的电互连。 可选择可压缩材料，其具有力至压缩图，其包括至少一个拐点，在拐点的一侧上限定第一区域，其中给定的力增量提供更大的压缩增量，并且第二区域 拐点的另一侧，同样的压缩力增量提供了显着更小的压缩增量。 可压缩材料可以起到防止可移动电触头损坏连接器的处理，包装，运输，组装，测试，连接和/或配合的作用。

公开(公告)号：US08644029B1

公开(公告)日：2014-02-04

申请号：US13192709

申请日：2011-07-28

Applicant: Daxiong Ji

Inventor： Daxiong Ji

IPC: H05K1/18

CPC classification number: H05K3/3415 ,  H05K3/306 ,  H05K3/3442 ,  H05K2201/10265 ,  H05K2201/10515 ,  H05K2201/10583 ,  Y02P70/613

Abstract: A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.

Abstract translation: 小型宽带表面贴装偏置三通包括具有功能的第一电容器和虚拟第二电容器的印刷电路板，以及结合在两个电容器顶上的电感器。 电容器，粘合剂和焊料可以通过标准表面安装拾取和放置机械进行沉积。 电感器线结合到第一电容器接合焊盘之一和电感器焊盘。 电路元件接合焊盘包括与印刷电路板边缘相邻的部分，并且与导电板的底面上的接合焊盘导电连接。 用于第一电容器接合焊盘的导电通孔减少寄生电感并延长工作频率范围。 平顶绝缘帽包围偏置三通和顶部。 盖在电感器和电路元件之间形成空气间隙，并提供用于利用当今组装设备操纵偏置三通的表面。