公开(公告)号：US20140312479A1

公开(公告)日：2014-10-23

申请号：US14198399

申请日：2014-03-05

Applicant: Flextronics AP, LLC

Inventor： Omar Garcia Lopez ,  Pedro Alejandro Ahumada Quintero ,  Enrique Avelar Secada ,  Murad Kurwa ,  Juan Carlos Gonzalez

IPC: H01L23/00

CPC classification number: H01L23/562 ,  H01L23/3107 ,  H01L24/83 ,  H01L2224/26122 ,  H01L2224/291 ,  H01L2224/83815 ,  H01L2924/1011 ,  H01L2924/12042 ,  H01L2924/15151 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09036 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Methods of and devices for providing escaping routes for the flux and gases generated to move away from the solder joint in the process of solder joint formation.

Abstract translation: 用于在焊点形成过程中产生的焊剂和气体远离焊点移动的漏斗路径的方法和装置。

公开(公告)号：US20140254180A1

公开(公告)日：2014-09-11

申请号：US14286534

申请日：2014-05-23

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Wei-Yu Yeh ,  Chih-Hsuan Sun

IPC: F21V29/00 ,  F21K99/00

CPC classification number: H05K1/0203 ,  F21K9/20 ,  F21V29/70 ,  F21V29/763 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/056 ,  H05K1/111 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10969 ,  Y10T29/4913

Abstract: A Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board. The LED is in thermal contact with the thermal pad. The module further includes a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.

Abstract translation: 发光二极管（LED）模块包括具有前侧和后侧的电路板，耦合到电路板的背面的散热器，设置在电路板的前侧的散热垫，设置在LED 在电路板的正面。 LED与散热垫热接触。 模块还包括放置在热垫上并与热垫热接触的散热装置。

公开(公告)号：US08816375B2

公开(公告)日：2014-08-26

申请号：US13698302

申请日：2011-06-08

Applicant: Herbert Brunner ,  Patrick Ninz

Inventor： Herbert Brunner ,  Patrick Ninz

IPC: H01L33/00

CPC classification number: H01L33/40 ,  H01L24/73 ,  H01L33/0079 ,  H01L33/387 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/12036 ,  H01L2924/12042 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radiation-emitting semiconductor body is provided which, besides an epitaxial semiconductor layer sequence having an active zone that is suitable for generating electromagnetic radiation, has a carrier layer that is intended to mechanically stabilize the epitaxial semiconductor layer sequence. The semiconductor body furthermore has contact structures for electrical contacting of the semiconductor body, which respectively have a volume region and a surface bonding region. The surface bonding region is formed from a material which is different from the material of the volume region.

Abstract translation: 提供一种辐射发射半导体本体，除了具有适于产生电磁辐射的有源区的外延半导体层序列之外，还具有旨在使外延半导体层序列机械稳定的载体层。 半导体本体还具有用于半导体主体的电接触的接触结构，该接触结构分别具有体积区域和表面结合区域。 表面结合区域由与体积区域的材料不同的材料形成。

公开(公告)号：US08804364B2

公开(公告)日：2014-08-12

申请号：US13169009

申请日：2011-06-26

Applicant: Hao-Jung Li

Inventor： Hao-Jung Li

IPC: H05K7/00 ,  H05K1/11

CPC classification number: H05K1/113 ,  H05K1/0206 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/09663 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A footprint of a printed circuit board (PCB) for a leadframe-based package includes a plurality of pads arranged within a central region on a main surface of the PCB; and an array of signal pads disposed within a peripheral region surrounding the central region.

Abstract translation: 用于基于引线框的封装的印刷电路板（PCB）的占位面积包括布置在PCB的主表面上的中心区域内的多个焊盘; 以及设置在围绕中心区域的周边区域内的信号焊盘阵列。

公开(公告)号：US08791369B2

公开(公告)日：2014-07-29

申请号：US13358555

申请日：2012-01-26

Applicant: Terumichi Kita

Inventor： Terumichi Kita

IPC: H05K1/16

CPC classification number: H05K1/0243 ,  H01L2224/16 ,  H05K1/111 ,  H05K2201/0969 ,  H05K2201/10727 ,  H05K2201/10969

Abstract: An electronic component that can be mounted with good balance includes a substrate, a plurality of first terminals located on a peripheral portion of one main surface of the substrate, a ground electrode located in a center of the one main surface of the substrate and including openings, and at least two second terminals located on the one main surface of the substrate and within the openings of the ground electrode and that are electrically isolated from the ground electrode. The second terminals are arranged at positions that are point symmetrical about a center of the ground electrode.

Abstract translation: 可以平衡地安装的电子部件包括基板，位于基板的一个主表面的周边部分上的多个第一端子，位于基板的一个主表面的中心的接地电极，并且包括开口 以及位于基板的一个主表面上并且在接地电极的开口内并且与接地电极电隔离的至少两个第二端子。 第二端子被布置在关于接地电极的中心点对称的位置处。

公开(公告)号：US20140138124A1

公开(公告)日：2014-05-22

申请号：US14045329

申请日：2013-10-03

Applicant: Continental Automotive GmbH

Inventor： Erich Mattmann

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0265 ,  H05K1/053 ,  H05K3/102 ,  H05K3/3452 ,  H05K3/44 ,  H05K2201/10969 ,  H05K2203/1344 ,  Y10T29/49124

Abstract: An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor.

Abstract translation: 用于传导高电流的电路及其制造方法。 电路具有载体主体，载体表面，覆盖载体表面的绝缘层，用于传导布置在绝缘层上的电流的带状导体和外绝缘层。 保护层具有至少一个凹部以提供带状导体的电接触面积。

公开(公告)号：US20130133193A1

公开(公告)日：2013-05-30

申请号：US13305502

申请日：2011-11-28

Applicant: Chih-Tai Hsu ,  Nan-Cheng Chen ,  Chih-Ming Chiang ,  Hung-Chang Hung ,  Xin Zhong

Inventor： Chih-Tai Hsu ,  Nan-Cheng Chen ,  Chih-Ming Chiang ,  Hung-Chang Hung ,  Xin Zhong

IPC: H05K3/34 ,  H05K3/12

CPC classification number: H01L23/49503 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00015 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09427 ,  H05K2201/10803 ,  H05K2201/10969 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53174 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a surface mount technology process for an advanced quad flat no-lead package process and a stencil used therewith. The surface mount technology process for an advanced quad flat no-lead package includes providing a printed circuit board. A stencil with first openings is mounted over the printed circuit board. A solder paste is printed passing the first openings to form first solder paste patterns. The stencil is taken off. A component placement process is performed to place the advanced quad flat no-lead package comprising a die pad on the printed circuit board, wherein the first solder paste patterns contact a lower surface of the die pad, and an area ratio of the first openings to the lower surface of the die pad is between 1:2 and 1:10. A reflow process is performed to melt the first solder paste patterns to surround a sidewall of the die pad.

Abstract translation: 本发明提供了一种用于高级四边形扁平无铅封装工艺的表面贴装技术工艺和与其一起使用的模板。 用于高级四边形扁平无铅封装的表面贴装技术工艺包括提供印刷电路板。 具有第一开口的模板安装在印刷电路板上。 印刷焊膏通过第一开口形成第一焊膏图案。 模具被取下。 执行部件放置处理以将包括管芯焊盘的高级四边形扁平无引线封装放置在印刷电路板上，其中第一焊膏图案接触管芯焊盘的下表面，并且将第一开口与 芯片焊盘的下表面在1:2与1:10之间。 进行回流处理以熔化第一焊膏图案以围绕管芯焊盘的侧壁。

公开(公告)号：US20130130492A1

公开(公告)日：2013-05-23

申请号：US13671669

申请日：2012-11-08

Applicant: STMicroelectronics, Inc.

Inventor： Anthony M. Chiu ,  Tong Yan Tee

IPC: H01L21/48

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: Solder joint reliability in an integrated circuit package is improved. Each terminal of a quad, flat, non-leaded integrated circuit package is formed having portions that define a solder slot in the bottom surface of the terminal. An external surface of the die pad of the integrated circuit package is also formed having portions that define a plurality of solder slots on the periphery of the die pad. When solder is applied to the die pad and to the terminals, the solder that fills the solder slots increases the solder joint reliability of the integrated circuit package.

Abstract translation: 提高了集成电路封装中的焊接可靠性。 四边形，平坦的，非引线的集成电路封装的每个端子形成有在端子的底表面中限定焊料槽的部分。 集成电路封装的管芯焊盘的外表面也形成有在管芯焊盘的周边上限定多个焊料槽的部分。 当焊料施加到管芯焊盘和端子时，填充焊料槽的焊料增加了集成电路封装的焊点可靠性。

公开(公告)号：US20130020606A1

公开(公告)日：2013-01-24

申请号：US13186461

申请日：2011-07-19

Applicant: Chang HAN ,  Lac NGUYEN

Inventor： Chang HAN ,  Lac NGUYEN

IPC: H01L33/62 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0204 ,  H05K1/0306 ,  H05K1/05 ,  H05K2201/0385 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10969 ,  H01L2924/00014

Abstract: An LED device with improved circuit board LED support structure is presented. A top surface of a thermally-conductive substrate of this LED device comprises a thermally-conductive pillar. The pillar is not covered with a dielectric layer and an LED package is arranged directly on the pillar with the LED packages bottom thermally-conductive plate in direct contact with the pillar top surface.

Abstract translation: 提出了一种具有改进的电路板LED支撑结构的LED器件。 该LED装置的导热基板的顶面包括导热柱。 柱子不被电介质层覆盖，并且LED封装直接布置在柱上，LED封装底部导热板与柱顶表面直接接触。

公开(公告)号：US08325951B2

公开(公告)日：2012-12-04

申请号：US12689283

申请日：2010-01-19

Applicant: Yunlong Wang

Inventor： Yunlong Wang

IPC: H04R25/00

CPC classification number: H04R19/005 ,  H01L2924/15151 ,  H01L2924/16151 ,  H05K1/0243 ,  H05K3/341 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2201/10969 ,  Y10T29/49117

Abstract: MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate.

Abstract translation: 公开了MEMS麦克风封装及其制造方法。 MEMS麦克风封装包括容纳MEMS感测元件，IC芯片和由公共基板支撑的其它无源元件的空腔。 空腔由顶盖构件形成，壳体壁围绕并支撑顶盖构件，并且公共衬底支撑壳体壁。 导电外壳包围并围绕空腔，并且电连接到PCB板上的公共模拟接地引线。 顶盖构件和外壳壁不导电。 并且导电套管不直接连接到封装的接地引线。 声吸收层被夹在导电壳体和由顶盖构件，壳体壁和基底形成的空腔之间。