公开(公告)号：US09955596B2

公开(公告)日：2018-04-24

申请号：US15233410

申请日：2016-08-10

Applicant: Seagate Technology LLC

Inventor： William Gunther Voss ,  Donald R. Bloyer ,  Nathan Loren Lester

IPC: H05K5/03 ,  H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K5/02

CPC classification number: H05K5/0069 ,  G11C5/06 ,  H05K1/0201 ,  H05K1/142 ,  H05K1/144 ,  H05K1/147 ,  H05K3/361 ,  H05K3/368 ,  H05K5/0217 ,  H05K5/03 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10409

Abstract: A memory cartridge for use during assembly of a storage drive apparatus. The memory cartridge includes a first memory printed circuit board (PCB). The memory cartridge also includes a second memory PCB, where the second memory PCB is operatively coupled to the first memory PCB by a first flexible connection. The memory cartridge also includes a chassis configured to fasten to the first memory PCB and to the second memory PCB such that the first and second memory PCBs have a spaced relationship to each other, and where the spaced relationship defines a gap.

公开(公告)号：US20180103542A1

公开(公告)日：2018-04-12

申请号：US15724740

申请日：2017-10-04

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masahiro Shinotsuka ,  Kazunori Miyake ,  Teruhiko Suzuki

IPC: H05K1/02 ,  H05K7/14 ,  G03G15/00

CPC classification number: H05K1/0259 ,  G03G15/80 ,  G03G21/1652 ,  H05K1/0215 ,  H05K1/0298 ,  H05K7/1422 ,  H05K2201/09663 ,  H05K2201/10409

Abstract: A printed circuit board for mounting on a support member, the printed circuit board including: a plurality of mounted portions for mounting the printed circuit board on the support member; a ground pattern configured to be electrically connected to the support member through the plurality of mounted portions; and a slit extended from a first mounted portion to a second mounted portion of the plurality of mounted portions and between a first portion, in which an electronic device is provided, of the ground pattern and a second portion, in which an electronic device is not provided, of the ground pattern.

公开(公告)号：US09939855B2

公开(公告)日：2018-04-10

申请号：US14942787

申请日：2015-11-16

Applicant: SMART Modular Technologies, Inc.

Inventor： Victor Mahran ,  Robert S. Pauley, Jr.

IPC: G06F1/18 ,  H05K7/14 ,  H05K1/14 ,  G06F1/20 ,  G11C5/02 ,  H05K1/02

CPC classification number: G06F1/185 ,  G06F1/20 ,  G11C5/025 ,  H05K1/0209 ,  H05K1/144 ,  H05K1/145 ,  H05K7/1431 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10409 ,  Y10T29/4913

Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.

公开(公告)号：US20180054912A1

公开(公告)日：2018-02-22

申请号：US15243690

申请日：2016-08-22

Applicant: John Michael Hannig

Inventor： John Michael Hannig

IPC: H05K7/18 ,  H05K7/20 ,  H05K7/14

CPC classification number: H05K7/18 ,  H05K1/0271 ,  H05K1/144 ,  H05K7/1417 ,  H05K7/142 ,  H05K7/1422 ,  H05K7/20009 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A frame for dampening vibrations in a printed circuit board (PCB) assembly is provided. The frame includes a substrate having a first surface and a second surface and multiple ridges extending from at least one of the first and second surfaces. The ridges define recesses, and at least one of the recesses is configured to accommodate an electronic component of a PCB in the PCB assembly. Also provided is a PCB assembly including a PCB and the frame.

公开(公告)号：US09871464B2

公开(公告)日：2018-01-16

申请号：US15308492

申请日：2014-05-14

Applicant: Mitsubishi Electric Corporation

Inventor： Kotaro Sugisawa

IPC: H02M7/04 ,  H05K1/02 ,  H02M7/00

CPC classification number: H02M7/04 ,  H02M1/44 ,  H02M5/458 ,  H02M7/003 ,  H02M2001/0006 ,  H05K1/02 ,  H05K1/0215 ,  H05K9/0039 ,  H05K2201/0999 ,  H05K2201/10409

Abstract: A control unit includes a power supply board on which a control power-supply circuit that generates a control voltage is mounted, a control board on which a control circuit that is operated based on the control voltage is mounted, and a connection medium that connects the power supply board and the control board to each other and is used to supply the control voltage from the control power-supply circuit to the control circuit. A signal ground of the control power-supply circuit and a signal ground of the control circuit are connected to each other via a frame ground without via the connection medium.

公开(公告)号：US20180010775A1

公开(公告)日：2018-01-11

申请号：US15104299

申请日：2016-01-29

Applicant: SEJONG MATERIALS CO., LTD

Inventor： Jaedeok SUNG

IPC: F21V19/00 ,  H05K1/02 ,  H05K3/00 ,  H05K3/04

CPC classification number: F21S43/00 ,  F21S43/14 ,  F21S43/15 ,  F21S43/19 ,  F21S43/195 ,  F21V19/0015 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/0278 ,  H05K1/056 ,  H05K3/0044 ,  H05K3/041 ,  H05K2201/09036 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2201/10522 ,  H05K2203/0108 ,  H05K2203/1327 ,  H05K2203/302

Abstract: The present invention relates to a manufacturing method of a metal PCB assembly for a vehicle lamp and the metal PCB assembly made by the method. The manufacturing method of a metal PCB assembly for a vehicle lamp comprises a step S100 in which a material of a metal PCB 14 is prepared, a step S110 in which a circuit pattern 22 and a plurality of unit patterns 16 are formed and cut from the material of a metal PCB 14 to form a metal PCB 14, a step S120 in which a bending groove 24 is formed on a bottom surface of the metal PCB 14, a step S130 in which each of the unit patterns 16 is protruded forward around the bending groove 24 of the metal PCB 14 such that each of the unit patterns 16 is bent to be inclined from the metal PCB 14, and a step S140 in which a stepwise injection molded products 12 is coupled with the metal PCB 14 while the unit pattern 16 is protruded.

公开(公告)号：US09867274B2

公开(公告)日：2018-01-09

申请号：US14804748

申请日：2015-07-21

Applicant: FUJITSU LIMITED

Inventor： Jun Taguchi

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

公开(公告)号：US20170367206A1

公开(公告)日：2017-12-21

申请号：US15466288

申请日：2017-03-22

Applicant: Delta Electronics, Inc.

Inventor： Ming-Tang YANG ,  Chun-Hsiung YEH ,  Shih-Lin LAI

IPC: H05K7/14 ,  H01R12/72 ,  H05K1/14

CPC classification number: H05K7/1407 ,  H01R12/721 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K7/142 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: An electronic device is provided, including a first circuit board, a second circuit board, a supporting member, and a first locking member. The first circuit board has a first hole. The second circuit board has a second hole, a pin, and a metal connector, wherein the pin is connected to the first circuit board. The supporting member has a first portion disposed in the first hole, a second portion, and a screw hole extending from the first portion to the second portion, wherein the diameter of the first portion is less than that of the second portion. The first locking member passes through the second hole and enters the screw hole to affix the second circuit board to the supporting member. The second portion is disposed between the first circuit board and the second circuit board to form a gap therebetween.

公开(公告)号：US20170345803A1

公开(公告)日：2017-11-30

申请号：US15163197

申请日：2016-05-24

Applicant: Intel Corporation

Inventor： Alan W. Tate ,  Andrew F. Thompson

IPC: H01L25/10 ,  H05K1/18 ,  H01L25/00 ,  H05K3/30

CPC classification number: G06F1/185 ,  G11C5/04 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1082 ,  H05K1/141 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: Printed circuit board (PCB) structures and methods of assembling them are described herein. In some embodiments, a PCB structure may include a first mounting hole; first, second, and third projections radiating from the first mounting hole; and a second mounting hole adjacent to the third projection. The first and second mounting holes located at opposite ends of the third projection. The second mounting hole to cause an electrical coupling of a bottom integrated circuit (IC) module to a connection structure included in a PCB, and the first mounting hole, the first projection, and the second projection to cause positioning of a top IC module above the bottom IC module and electrical coupling of the top IC module to the connection structure.

公开(公告)号：US09799973B2

公开(公告)日：2017-10-24

申请号：US15259144

申请日：2016-09-08

Applicant: Ross Video Limited

Inventor： Donald Mark Sizemore ,  Curtis Rylee Keim ,  Nicholas Daniel Parry ,  Mark Justin Sonderegger ,  Thomas Curtis Brown

IPC: H01R12/00 ,  H01R12/73 ,  H01R12/70 ,  H05K1/11 ,  H05K3/36

CPC classification number: H01R12/737 ,  H01R12/7011 ,  H01R12/7047 ,  H01R12/722 ,  H05K1/117 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10409 ,  H05K2201/209 ,  H05K2203/167

Abstract: Printed circuit board pad layouts and mechanical retainers are disclosed herein. For example, a printed circuit board is disclosed having a row of electrically conductive pads, the row of pads including pairs of signal pads with exactly one reference pad interposed between each pair of the signal pads. As another example, a mechanical retainer is disclosed that may assist in interconnecting two printed circuit boards and that has a longitudinal body with a threaded end, a head at an end opposite the threaded end, and a shank connecting the head to the threaded end.