公开(公告)号：US20160379937A1

公开(公告)日：2016-12-29

申请号：US15138441

申请日：2016-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： KyongSoon CHO ,  Myoungkyun KIL ,  Hansung RYU

IPC: H01L23/00 ,  H05K1/11 ,  H05K1/02 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/111 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate strip is provided. The substrate strip includes a core layer including first and second substrate regions spaced apart from each other and a dummy region between the first and second substrate regions, a first interconnection layer disposed on top surfaces of the first and second substrate regions, a second interconnection layer disposed on bottom surfaces of the first and second substrate regions, and a warpage control member provided on any one of a top surface and a bottom surface of the dummy region. The warpage control member includes a metal.

Abstract translation: 提供衬底条。 衬底条包括芯层，该芯层包括彼此间隔开的第一和第二衬底区域以及在第一和第二衬底区域之间的虚设区域，设置在第一和第二衬底区域的顶表面上的第一互连层，第二互连层 设置在第一和第二基板区域的底表面上，以及翘曲控制构件，设置在虚拟区域的顶表面和底表面中的任一个上。 翘曲控制构件包括金属。

公开(公告)号：US20160360612A1

公开(公告)日：2016-12-08

申请号：US15241871

申请日：2016-08-19

Applicant: WASEDA UNIVERSITY

Inventor： Eiji Iwase ,  Tomoya Koshi

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/09 ,  H05K3/22

CPC classification number: H05K1/0283 ,  H05K1/0277 ,  H05K1/03 ,  H05K1/092 ,  H05K1/11 ,  H05K1/118 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/225 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/2009 ,  H05K2203/0723 ,  H05K2203/0776 ,  H05K2203/105 ,  H05K2203/125 ,  H05K2203/173

Abstract: A self-healing wire includes, an electric wire arranged on a substrate, and a hybrid structure in which the electric wire is covered with at least one fluid selected from the group consisting of a fluid having conductive particles dispersed therein and a fluid having metal ions dissolved therein, formed on a healing portion for a crack to be generated in the electric wire. And a stretchable device includes the self-healing wire formed on a stretchable base material and an electric element mounted only on a base material higher in rigidity than the stretchable base material. Even when a crack is generated in the electric wire due to stretching of the substrate having flexibility, the crack is bridged by the conductive particles or a solid metal deposited from the metal ions in the fluid. Thus the self-healing wire and the stretchable device having both high conductivity and high stretchability are provided.

Abstract translation: 自修复线包括布置在基板上的电线，以及混合结构，其中电线被选自由其中分散有导电粒子的流体和具有金属离子的流体组成的组中的至少一种流体覆盖 溶解在其中，形成在用于在电线中产生的裂纹的愈合部分上。 另外，可拉伸装置包括形成在可拉伸基材上的自修复线，以及只安装在刚性高于伸缩性基材的基材上的电气元件。 即使由于具有柔性的基板的拉伸而在电线中产生裂纹，所以裂纹由导电颗粒或从流体中的金属离子沉积的固体金属桥接。 因此，提供了具有高导电性和高拉伸性的自愈线和可拉伸装置。

公开(公告)号：US20160353616A1

公开(公告)日：2016-12-01

申请号：US15236255

申请日：2016-08-12

Applicant: Apple Inc.

Inventor： Richard Hung Minh Dinh ,  Shayan Malek ,  Scott A. Myers ,  Ronald W. Dimpflmaier

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/34 ,  H01L23/552 ,  H01L23/29 ,  H01M2/02 ,  H01L23/373 ,  H01L23/66 ,  H03F3/195 ,  H03F3/213 ,  G06F1/16 ,  H05K1/18 ,  H01L23/24

CPC classification number: H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

Abstract: Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

Abstract translation: 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

公开(公告)号：US09485855B2

公开(公告)日：2016-11-01

申请号：US14776389

申请日：2014-03-06

Applicant: ENPLAS CORPORATION

Inventor： Yuki Ueyama

IPC: H01R13/648 ,  H05K1/02 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11 ,  H01R12/71 ,  G01R31/28 ,  H05K3/34

CPC classification number: H05K1/0271 ,  G01R31/2863 ,  H01R12/716 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/2009

Abstract: A substrate reinforcing structure for preventing and suppressing deformation or the like of a substrate with a fixed electric component socket.A first reinforcing plate in, for example, a frame shape is attached to a back surface of a wiring board. Further, a second reinforcing plate in, for example, a flat shape is provided on a back side of the first reinforcing plate. In a preferred embodiment of the present invention, a first insulating sheet is further provided between the wiring board and the first reinforcing plate, and a spacer is provided on the second reinforcing plate and abutted to a part of the wiring board where contact pins do not protrude. A second insulating sheet is further provided on the second reinforcing plate.

Abstract translation: 例如，将框状的第一加强板安装在布线基板的背面。 此外，在第一加强板的背面设置有例如平坦形状的第二加强板。 在本发明的优选实施例中，第一绝缘片还设置在布线板和第一加强板之间，并且间隔件设置在第二加强板上，并且与接线脚不相邻的布线板的一部分 突出 第二绝缘片还设置在第二加强板上。

公开(公告)号：US20160316073A1

公开(公告)日：2016-10-27

申请号：US15093813

申请日：2016-04-08

Applicant: KONICA MINOLTA, INC.

Inventor： Kiyohito TSUJIHARA ,  Shiro UMEDA ,  Yuki HIGUCHI

IPC: G03G15/00 ,  H01R12/77 ,  H04N1/00 ,  H04N1/04

CPC classification number: H04N1/0083 ,  H04N1/00795 ,  H04N1/04 ,  H04N2201/0049 ,  H04N2201/0081 ,  H05K1/00 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/0145 ,  H05K2201/2009

Abstract: An image reading device which reads an image to obtain an image signal includes: a scanning unit; a chassis member; a control unit provided in a position which does not move together with the scanning unit; and a flexible flat cable which connects the scanning unit to the control unit, includes one end attached to a side of the chassis member and a position other than the one end fixed to a position which does not move with the scanning unit, includes a range closer to the one end than the fixed position parallel to a moving direction of the scanning unit, and is arranged to extend from the one end to one side, be bent into a U-shape, enter between the scanning unit and the chassis member, and reach the fixed position, and the flexible flat cable includes a transmitting layer, a shielding layer, and a stress adjusting layer.

Abstract translation: 读取图像以获得图像信号的图像读取装置包括：扫描单元; 底盘构件; 设置在不与扫描单元一起移动的位置的控制单元; 以及将扫描单元连接到控制单元的柔性扁平电缆，包括附接到底架构件的一侧的一端和固定到不与扫描单元一起移动的位置的一端之外的位置包括范围 更靠近平行于扫描单元的移动方向的固定位置的一端，并且被布置成从一端延伸到一侧，弯曲成U形，进入扫描单元和底座构件之间， 并且达到固定位置，并且柔性扁平电缆包括透射层，屏蔽层和应力调节层。

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。

公开(公告)号：US09465467B2

公开(公告)日：2016-10-11

申请号：US14564335

申请日：2014-12-09

Applicant: LG Display Co., Ltd.

Inventor： Sunghoon Lee

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04102 ,  H05K1/0281 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/052 ,  H05K2201/058 ,  H05K2201/09781 ,  H05K2201/1034 ,  H05K2201/10356 ,  H05K2201/2009

Abstract: A flexible printed circuit board having enhanced peeling force and a touch panel including the same are provided. The flexible printed circuit board (FPCB) includes a first bonding portion and a second bonding portion respectively bonded to a first circuit unit and a second circuit unit. The first bonding portion includes a pad corresponding portion corresponding to pads of the first circuit unit and dummy portions outwardly extending from both end portions of the pad corresponding portion. An FPCB wiring formation portion includes FPCB wirings respectively connected to the pads and extending from the first bonding portion to the second bonding portion and concave portions respectively disposed to be adjacent to the dummy portions and having a curved surface.

Abstract translation: 提供了具有增强的剥离力的柔性印刷电路板和包括其的触摸面板。 柔性印刷电路板（FPCB）包括分别接合到第一电路单元和第二电路单元的第一接合部分和第二接合部分。 第一接合部分包括对应于第一电路单元的焊盘的焊盘对应部分和从焊盘对应部分的两个端部向外延伸的虚拟部分。 FPCB布线形成部分包括分别连接到焊盘并且从第一接合部分延伸到第二接合部分的FPCB布线和分别设置成与虚设部分相邻并且具有弯曲表面的凹部。

公开(公告)号：US09454982B2

公开(公告)日：2016-09-27

申请号：US13660477

申请日：2012-10-25

Applicant: NHK SPRING CO., LTD.

Inventor： Hajime Arai

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  G11B5/48

CPC classification number: G11B5/4846 ,  G11B5/1272 ,  G11B5/4826 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0245 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/056 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/18 ,  H05K2201/05 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/2009 ,  Y10T29/49194

Abstract: A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities. The wiring structure further comprises a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.

Abstract translation: 包括支撑头部并附接到负载束施加负载到头上的弯曲部的头部悬架的布线结构包括形成在挠曲件上并连接到头部上的写入布线和读取布线，每个布线具有相反极性的导线。 所述布线结构还包括层叠的交错部分，其包括电连接到所述写入布线的相应导线的部分，所述片段通过电绝缘层堆叠在并面对所述线，使得所述相对的线和片段具有相反的极性。

公开(公告)号：US20160278219A1

公开(公告)日：2016-09-22

申请号：US15163978

申请日：2016-05-25

Applicant: YAZAKI CORPORATION

Inventor： Ken Ito

IPC: H05K5/00 ,  H05K3/22 ,  H05K5/02

CPC classification number: H05K5/0034 ,  H05K3/22 ,  H05K3/284 ,  H05K5/0226 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/0989 ,  H05K2201/09972 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case, is provided at a part of a plate surface of a circuit board which is mounted with electronic components and is covered by the outer case formed by the mold resin. The outer case is multi-material molded using plural kinds of resin having different fluidities. A rear wall of the outer case located on the rear surface side of the mold exclusion part is made of one of the plural kinds of the resin having a fluidity higher than a fluidity of another one of the plural kinds of the resin constituting the other portion of the outer case.

Abstract translation: 一种电子电路单元，其具有被模制树脂覆盖的后表面侧和从外壳暴露的前表面侧的模具排除部分设置在安装有电子部件的电路板的板表面的一部分处 并被由模制树脂形成的外壳覆盖。 外壳使用具有不同流动性的多种树脂进行多材料成型。 位于模具排除部的后表面侧的外壳的后壁由构成另一部分的多种树脂中的另一种的流动性高于多种树脂的多种树脂中的一种制成 的外壳。

公开(公告)号：US20160278212A1

公开(公告)日：2016-09-22

申请号：US15031383

申请日：2014-12-10

Applicant: MITSUBISHI HEAVY INDUSTRIES AUTOMOTIVE THERMAL SYSTEMS CO., LTD.

Inventor： Shunsuke YAKUSHIJI ,  Hitoshi TAMAKI ,  Takayuki TAKASHIGE

IPC: H05K1/18 ,  H02K11/00

CPC classification number: H05K1/18 ,  F04B35/04 ,  F04B39/121 ,  F04C18/0215 ,  F04C23/008 ,  F04C2240/803 ,  F04C2240/808 ,  H02K11/00 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/2009 ,  H05K2201/2045 ,  Y02P70/613

Abstract: This invention provides an affixing structure that reduces costs and makes it possible to lower the risk of vibration causing damage or the like to electrical connection terminals on an electronic component affixed to a circuit board. The affixing structure, which is affixed to a circuit board (21) via a plurality of lead frames (55) that are part of a transformer (50), is characterized in that at least one second side wall that is perpendicular to a first side wall where the lead frames (55) are arranged is adhesively supported on the circuit board (21) by a support (60), the height (H3) of the part of the support (60) in contact with the transformer (50) is greater than or equal to the height (H2) of the center of gravity of the electronic component, and the length (L) of the support (60) in the direction of the first side wall is greater than or equal to the aforementioned height (H3).

Abstract translation: 本发明提供了一种降低成本的固定结构，并且可以降低对固定到电路板的电子部件上的电连接端子的振动造成损坏等的风险。 经由作为变压器（50）的一部分的多个引线框架（55）固定到电路板（21）的固定结构的特征在于，至少一个第二侧壁垂直于第一侧 通过支撑件（60）将布置有引线框架（55）的壁粘接地支撑在电路板（21）上，与变压器（50）接触的支撑件（60）部分的高度（H3）是 大于或等于电子部件的重心的高度（H2），并且支撑件（60）在第一侧壁的方向上的长度（L）大于或等于上述高度（ H3）