公开(公告)号：US20100290183A1

公开(公告)日：2010-11-18

申请号：US12812724

申请日：2008-01-31

Applicant: Christopher N. Rijken ,  Mark D. Tupa ,  Michael R. Durham

Inventor： Christopher N. Rijken ,  Mark D. Tupa ,  Michael R. Durham

IPC: G06F1/20 ,  H05K7/00 ,  G06F1/16 ,  H05K3/30

CPC classification number: H05K7/20518 ,  G01K1/20 ,  H05K1/0201 ,  H05K1/18 ,  H05K2201/0187 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2203/304 ,  Y10T29/49135

Abstract: A system contains a temperature sensitive device and a printed circuit board. The temperature sensitive device is coupled to the printed circuit board. An aperture is cut out of the printed circuit board between the temperature sensitive device and a heat generating device to act as an insulator for the temperature sensitive device.

Abstract translation: 系统包含温度敏感设备和印刷电路板。 温度敏感器件耦合到印刷电路板。 在印刷电路板之间，在感温装置和发热装置之间切出孔，作为温度敏感装置的绝缘体。

公开(公告)号：US07825340B2

公开(公告)日：2010-11-02

申请号：US12193492

申请日：2008-08-18

Applicant: Hitoshi Kashio

Inventor： Hitoshi Kashio

IPC: H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/112 ,  H05K3/0017 ,  H05K3/064 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/0554

Abstract: In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.

Abstract translation: 在本发明的一个实施例中，双面布线板的连接装置包括由第一侧导电层和第一侧连接导电层构成的第一侧连接接地部分和第二侧连接接地部分 由第二侧导电层构成; 所述第一侧连接接地部和所述第二侧连接用接地部在各自的中央部彼此面对，并且将绝缘基板夹在其间; 与第一侧连接接地部的周缘部和第二侧连接接地部的周缘部对应地形成基板孔; 并且第一侧连接接地部分的周边端部和第二侧连接接地部分的周边端部经由基板孔相互连接。

公开(公告)号：US20100265678A1

公开(公告)日：2010-10-21

申请号：US12625775

申请日：2009-11-25

Applicant: Jitender Pratap Singh ,  Vijay Malhi

Inventor： Jitender Pratap Singh ,  Vijay Malhi

IPC: H05K5/00 ,  B29C45/02

CPC classification number: H05K3/284 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H05K5/0278 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2203/1316 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method of enhancing adhesion of a molding material with a substrate is provided. The method includes forming one or more perforations on a substrate, forming a coat of an affinitive material on at least one of the perforations, and filling the molding material in the perforations. The affinitive material has an affinity for the molding material. Therefore, the molding material adheres to the coat of the affinitive material.

Abstract translation: 提供了一种提高成型材料与基材的附着力的方法。 该方法包括在基底上形成一个或多个穿孔，在至少一个穿孔上形成亲和材料的涂层，并将成型材料填充到穿孔中。 亲和材料对成型材料具有亲和力。 因此，成型材料粘附于亲合材料的外套。

公开(公告)号：US07812488B2

公开(公告)日：2010-10-12

申请号：US12034952

申请日：2008-02-21

Applicant: Pino Cosco ,  Klaus S. Fischer

Inventor： Pino Cosco ,  Klaus S. Fischer

IPC: H02K29/08

CPC classification number: H05K1/0259 ,  H02K1/2786 ,  H02K11/40 ,  H02K29/08 ,  H02K2211/03 ,  H05K2201/09063

Abstract: An electronically commutated motor (ECM 21) has reduced vulnerability to Electro-Static Discharge (ESD). The motor has an internal stator (50) and an external rotor (22) equipped with a permanent magnet (28), which rotor is separated by an air gap from the internal stator (50). The rotor has a shaft (34) on which a magnetic yoke element (24) is mounted. A leakage flux region on an end face (27) of the magnet (28) actuates a Hall sensor (48) located adjacent a first aperture (48′) in a circuit board (46) supporting electronic control components. In order to prevent static discharges from passing through the first aperture (48′) and endangering the electronic components, the circuit board (46) is formed with a second aperture (43) on whose edge is provided at least one electrical conductor (95′, 95″), connected to ground (112), to which any charge that builds up during operation can harmlessly discharge.

Abstract translation: 电子换向电机（ECM 21）减少了对静电放电（ESD）的脆弱性。 电动机具有内部定子（50）和配备有永磁体（28）的外部转子（22），该转子由与内部定子（50）的气隙分开。 转子具有安装有磁轭元件（24）的轴（34）。 磁体（28）的端面（27）上的泄漏通量区域致动位于支撑电子控制部件的电路板（46）中邻近第一孔（48'）的霍尔传感器（48）。 为了防止静电放电通过第一孔（48'）并危及电子部件，电路板（46）形成有第二孔（43），其边缘上设置有至少一个电导体（95' ，95“），其连接到地面（112），在操作期间建立的任何电荷可以无害地释放。

公开(公告)号：US07791892B2

公开(公告)日：2010-09-07

申请号：US11669362

申请日：2007-01-31

Applicant: Michael J. Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell, Jr.

Inventor： Michael J. Domitrovits ,  Edward J. Donnelly ,  Raymond F. Frizzell, Jr.

IPC: H05K1/14

CPC classification number: H05K1/0271 ,  H01R12/716 ,  H01R12/721 ,  H05K3/341 ,  H05K3/3421 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Disclosed are an electronic component, an assembly of an electronic component and an electronic carrier substrate, and a method of connecting the electronic component to the carrier substrate. The carrier substrate has a first coefficient of thermal expansion (CTE), and the electronic component has a second CTE. The assembly further comprises a conductive material on the carrier substrate for connecting the electronic component to the carrier substrate, and the electrical component is connected to the carrier substrate by heating and then cooling this conductive material. The electronic component includes an expansion joint to allow the electronic component to expand and contract relative to the carrier substrate during the heating and cooling of the conductive material.

Abstract translation: 公开了电子部件，电子部件和电子载体基板的组件以及将电子部件连接到载体基板的方法。 载体衬底具有第一热膨胀系数（CTE），并且电子部件具有第二CTE。 组件还包括在载体基板上的用于将电子部件连接到载体基板的导电材料，并且电气部件通过加热连接到载体基板，然后冷却该导电材料。 电子部件包括膨胀接头，以在导电材料的加热和冷却期间允许电子部件相对于载体基板膨胀和收缩。

公开(公告)号：US07785113B2

公开(公告)日：2010-08-31

申请号：US11885262

申请日：2006-10-27

Applicant: Masanori Mizoguchi

Inventor： Masanori Mizoguchi

IPC: H01R12/00

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

Abstract: An electrical connection structure allowing reduction in height and easy disassembly, wherein a first connecting member comprises a flexible substrate comprising a flexible insulating film, at least one conductive pad formed on at least one side thereof, a conductive circuit pattern extending from the rim of the pad, a through-hole formed through the thickness thereof at a planar position within the pad, and a small aperture formed at a planar position within the pad and communicating with the through-hole, and a second connecting member comprises a conductive projection formed at least one side thereof and electrically connected with a conductive circuit pattern formed inside or on the second connecting member, where the electrical connection is formed in the manner such that the conductive projection of the second connecting member is inserted in the through-hole of the first connecting member, through the small aperture in the pad, bending the pad and the portion of the insulating film under the pad, along the direction of insertion of the conductive projection, so that the pad is pressed onto the conductive projection due to elastic force of the pad and the insulating film bent.

Abstract translation: 一种电连接结构，其允许降低高度并易于拆卸，其中第一连接构件包括柔性基底，该柔性基底包括柔性绝缘膜，至少一个导电垫在其至少一侧上形成，导电电路图案从 衬垫，在衬垫内的平面位置处形成通过其厚度的通孔，以及形成在衬垫内的平面位置并与通孔连通的小孔，第二连接构件包括形成在 至少一个侧面，与形成在第二连接构件的内部或第二连接构件上的导电电路图案电连接，其中电连接形成为使得第二连接构件的导电突起插入第一连接构件的通孔中 连接构件，通过垫中的小孔，弯曲垫和绝缘f的部分 沿着导电突起的插入方向在衬垫下面，使得由于焊盘的弹性力和绝缘膜弯曲而将焊盘压在导电突起上。

公开(公告)号：US20100212149A1

公开(公告)日：2010-08-26

申请号：US12557222

申请日：2009-09-10

Applicant: Zdenko GRAJCAR

Inventor： Zdenko GRAJCAR

IPC: H05K3/00

CPC classification number: H05K1/144 ,  F21K9/00 ,  H05K1/0204 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/306 ,  H05K3/3415 ,  H05K3/368 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10303 ,  H05K2201/10818 ,  H05K2203/0169 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A light circuit manufacturing process includes forming a palletized driver PCB board having a plurality of driver PCBs, forming a plurality of power PCBs on a palletized surface, forming slots in the driver PCBs, forming holes in the power PCBs, aligning both the power PCB palletization and the driver PCB palletization using reference holes such that the edges of each extend further in one direction or the other, and inserting thermal tabs into both the power PCB and the driver PCB.

Abstract translation: 光电路制造工艺包括形成具有多个驱动器PCB的码垛驱动PCB板，在码垛表面上形成多个电源PCB，在驱动器PCB中形成槽，在电源PCB中形成孔，使电源PCB码垛 以及使用参考孔的驱动器PCB码垛，使得每个边缘在一个方向上进一步延伸，并且将热突片插入到电源PCB和驱动器PCB中。

公开(公告)号：US20100206620A1

公开(公告)日：2010-08-19

申请号：US12768893

申请日：2010-04-28

Applicant: Tougo TERAMOTO ,  Masahiro Takashima

Inventor： Tougo TERAMOTO ,  Masahiro Takashima

IPC: H05K1/00

CPC classification number: H05K1/028 ,  H04N5/2251 ,  H05K2201/09063

Abstract: The present invention relates to a bendable printed board, an image pickup apparatus, and a camera. The bendable printed board is provided with: a first end connected to a moving body movable in an arbitral direction within a predefined plane; a second end connected to a fixed body with slack providing movability to the moving body; and a slit formed on at least a part of a slack portion of the printed board.

Abstract translation: 本发明涉及一种可弯曲印刷电路板，摄像装置和照相机。 可弯曲印刷电路板设置有：连接到可在预定平面内在仲裁方向上移动的移动体的第一端; 连接到具有松弛的固定体的第二端，向移动体提供可移动性; 以及形成在印刷电路板的松弛部分的至少一部分上的狭缝。

公开(公告)号：US20100193970A1

公开(公告)日：2010-08-05

申请号：US12759196

申请日：2010-04-13

Applicant: Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

Inventor： Philip Damberg ,  Belgacem Haba ,  David B. Tuckerman ,  Teck-Gyu Kang

IPC: H01L23/48

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, a flexible substrate overlying and spaced from a first face of the microelectronic element, and a plurality of conductive terminals exposed at a surface of the flexible substrate. The conductive terminals are electrically interconnected with the microelectronic element and the flexible substrate includes a gap extending at least partially around at least one of the conductive terminals. In certain embodiments, the package includes a support layer, such as a compliant layer, disposed between the first face of the microelectronic element and the flexible substrate. In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，覆盖并与微电子元件的第一面间隔开的柔性基板，以及暴露在柔性基板的表面处的多个导电端子。 导电端子与微电子元件电互连，并且柔性基板包括至少部分地围绕至少一个导电端子延伸的间隙。 在某些实施例中，封装包括设置在微电子元件的第一面和柔性基板之间的支撑层，例如顺应层。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：US07751015B2

公开(公告)日：2010-07-06

申请号：US10987872

申请日：2004-11-12

Applicant: Masahiro Murakami

Inventor： Masahiro Murakami

IPC: G02F1/1345

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H01L2924/0002 ,  H05K2201/09063 ,  H01L2924/00

Abstract: A panel module for an LCD device has an LCD panel including a TFT panel and a counter panel, signal line and scanning line drive boards for connecting to external circuits, and TCPs connecting together the TFT panel and the drive boards. The signal line driver TCP has a plurality of slits in the film substrate thereof and bent at the slits, allow the signal line drive board to be located on the rear side of the backlight unit of the LCD device. The panel module is suited any of stacked, L-shaped or U-shaped board structure.

Abstract translation: 用于LCD装置的面板模块具有包括TFT面板和对面板的LCD面板，用于连接到外部电路的信号线和扫描线驱动板以及将TFT面板和驱动板连接在一起的TCP。 信号线驱动器TCP在其薄膜基板中具有多个狭缝并在狭缝处弯曲，允许信号线驱动板位于LCD装置的背光单元的后侧。 面板模块适用于任何堆叠的L形或U形板结构。