Abstract:
A charged-particle beam microscope is provided for imaging a sample. The microscope has a stage to hold a sample and a charged-particle beam column to direct a charged-particle beam onto the sample. The charged-particle beam column includes a charged-particle beam source to generate a charged-particle beam, and charged-particle beam optics to converge the charged-particle beam onto the sample. The microscope also has a light beam column to direct a light beam onto the sample. The light beam column includes a light beam source to generate a light beam, and light-beam optics to converge the light beam onto the sample. One or more detectors are provided to detect charged-particle and light radiation emanating from the sample to generate an image. A controller to analyze the detected charged-particle radiation and detected light radiation to generate an image of the sample.
Abstract:
A charge monitor having a Langmuir probe is provided, wherein a positive and negative charge rectifier are operably coupled to the probe and configured to pass only a positive and negative charges therethrough, respectively. A positive current integrator is operably coupled to the positive charge rectifier, wherein the positive current integrator is biased via a positive threshold voltage, and wherein the positive current integrator is configured to output a positive dosage based, at least in part, on the positive threshold voltage. A negative current integrator is operably coupled to the negative charge rectifier, wherein the negative current integrator is biased via a negative threshold voltage, and wherein the negative current integrator is configured to output a negative dosage based, at least in part, on the negative threshold voltage. A positive charge counter and a negative charge counter are configured to respectively receive the output from the positive current integrator and negative current integrator in order to provide a respective cumulative positive charge value and cumulative negative charge value associated with the respective positive charge and negative charge.
Abstract:
A member for a charged particle beam device (56), which is used for a charged particle beam device (1c), includes a frame (55) to be attached to a frame (3c), and a diaphragm element (18a) provided in the frame (55). In the diaphragm element (18a), a diaphragm (19), which air-tightly separates the inside and the outside of a vacuum chamber (4a) from each other in a state where the pressure inside the vacuum chamber (4a) partitioned by the frame (3c) and the frame (55) is reduced more than the pressure outside the vacuum chamber (4a), and allows a charged particle beam to be transmitted therethrough, is formed. Moreover, in the diaphragm element (18a), a buffer film (33) for preventing a sample (12) and the diaphragm (19) from coming into contact with each other is formed so as to be positioned on a sample stage (22) side rather than on the diaphragm (19).
Abstract:
A projection exposure apparatus (10) for microlithography has a plurality of optical components (M1-M6) forming an exposure beam path, as well as a distance measurement system (30, 130, 230) configured to measure a distance between at least one of the optical components and a reference element (40, 140, 240). The distance measurement system comprises a frequency comb generator (32, 132, 232), which is configured to generate electromagnetic radiation (36, 236) having a comb-shaped frequency spectrum.
Abstract:
An apparatus for extending the useful life of an ion source, comprising an arc chamber containing a plurality of cathodes to be used sequentially and a plurality of repellers to protect cathodes when not in use. The arc chamber includes an arc chamber housing defining a reaction cavity, gas injection openings, a plurality of cathodes, and at least one repeller element. A method for extending the useful life of an ion source includes providing power to a first cathode of an arc chamber in an ion source, operating the first cathode, detecting a failure or degradation in performance of the first cathode, energizing a second cathode, and continuing operation of the arc chamber with the second cathode.
Abstract:
Methods disclosed herein include: (a) forming a channel in a sample, the channel extending one micron or more along a direction oriented at an angle to a surface of the sample; (b) exposing a portion of the sample above the channel to a particle beam to cause particles to leave the surface of the sample; and (c) forming an image of the sample based on particles that leave the surface.
Abstract:
A method and apparatus for reducing drift in a charged particle beam system. The method includes providing a charged particle beam column including a charged particle beam, a lens system, and a sample chamber; disposing a temperature-controlled device between the lens system and the sample chamber to control heat transfer between the lens system and the sample chamber; and controlling the temperature of the temperature-controlled device to reduce or eliminate the thermal drift of the position of a sample within the sample chamber relative to the position of the charged particle beam.
Abstract:
An electrostatic chuck protection method includes providing an exposed chuck surface with a protective surface for preventing adherence of foreign materials including a substance exhibiting volatility in a vacuum environment, and removing the protective surface in order to perform a process of forming a substrate electrostatically held on the chuck surface with a surface layer including a substance having volatility in a vacuum chamber. The protective surface may be provided when a low vacuum pumping mode of operation is performed in a vacuum environment surrounding the chuck surface.
Abstract:
Methods disclosed herein include: (a) forming a channel in a sample, the channel extending one micron or more along a direction oriented at an angle to a surface of the sample; (b) exposing a portion of the sample above the channel to a particle beam to cause particles to leave the surface of the sample; and (c) forming an image of the sample based on particles that leave the surface.
Abstract:
Method for operating a processing system and refurbishing a ceramic substrate holder within a process chamber of the processing system are described. The method includes plasma processing one or more substrates on the ceramic substrate holder, where the processing causes erosion of a nitride material of the ceramic substrate holder. The method further includes refurbishing the ceramic substrate holder in-situ without a substrate residing on the ceramic substrate holder, where the refurbishing includes exposing the ceramic substrate holder to a plasma-excited nitrogen-containing gas in the process chamber to at least partially reverse the erosion of the nitride material.