公开(公告)号：US20160050745A1

公开(公告)日：2016-02-18

申请号：US14460357

申请日：2014-08-15

Applicant: HTC Corporation

Inventor： Hsin-Chih Liu ,  Ying-Yen Cheng ,  Yu-Jing Liao

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/095 ,  H05K1/11 ,  H05K1/147 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/058 ,  H05K2201/09409

Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.

Abstract translation: 电子组件包括电子模块，刚性板，第一柔性板，第二柔性板和导电粘合剂层。 第一柔性板从电子模块延伸，并且在第一连接端具有第一连接端和第一焊盘装置。 第一垫排列具有多个第一垫。 第二柔性板连接到刚性板，并且在第二连接端具有第二连接端和第二垫布置。 第二垫布置具有多个第二垫。 第一焊盘通过导电粘合剂层在结构上和电连接到第二焊盘。

公开(公告)号：US20150237737A1

公开(公告)日：2015-08-20

申请号：US14342288

申请日：2013-11-11

Applicant: JX Nippon Mining & Metals Corporation

Inventor： Hideta Arai ,  Atsushi Miki ,  Kohsuke Arai ,  Kaichiro Nakamuro

IPC: H05K3/02 ,  H05K1/02 ,  H05K3/36 ,  H05K1/14 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/022 ,  C25D1/04 ,  C25D7/0614 ,  H05K1/028 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/14 ,  H05K3/361 ,  H05K3/384 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/05 ,  H05K2201/058 ,  Y10T29/49126 ,  Y10T428/12431 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil.

Abstract translation: 一种表面处理的铜箔，其良好地结合到树脂上，并且当通过树脂观察时可以获得良好的可见性，并且提供使用其的层压体。 在层压到铜箔上之前，将层压在具有50以上且65以下的Dgr。B（PI）的聚酰亚胺的表面处理铜箔上形成覆铜层压板，其包含具有色差的表面 ＆Dgr; E * ab为50以上，基于JIS Z 8730通过聚酰亚胺，并且从铜箔边缘延伸到不具有铜箔的部分的亮度曲线中的顶部平均Bt和底部平均Bb之间的差异Dgr ; B（＆Dgr; B = Bt-Bb）为40以上，其中，从通过从表面层压的聚酰亚胺的铜箔的拍摄图像的亮度的测量结果的观察点与亮度曲线获得亮度曲线 用CCD照相机，沿着观察到的铜箔的延伸方向的垂直方向对各观察点进行处理。

公开(公告)号：US20140376174A1

公开(公告)日：2014-12-25

申请号：US13922136

申请日：2013-06-19

Applicant: SMART Storage Systems, Inc.

Inventor： David Lee Dean ,  Dennis Bennett ,  Robert W. Ellis

IPC: G06F1/20

CPC classification number: G06F1/20 ,  G01R31/20 ,  G06F1/186 ,  H05K1/118 ,  H05K1/14 ,  H05K1/144 ,  H05K1/148 ,  H05K5/0026 ,  H05K7/20 ,  H05K2201/042 ,  H05K2201/058 ,  Y10T29/49002

Abstract: An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail.

Abstract translation: 电子组件和制造方法包括：具有圆形轨道和气流接头的气流支架，气流支架电连接圆形轨道和气流接头; 连接到圆形导轨的顶板，用于电连接顶板和圆形导轨; 以及附接到圆形导轨的底板，用于电连接顶板和圆形导轨，底板被定位成在顶板和底板之间形成热通道，用于引导空气通过圆形导轨的通风口。

公开(公告)号：US08851356B1

公开(公告)日：2014-10-07

申请号：US13158149

申请日：2011-06-10

Applicant: Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

Inventor： Henry V. Holec ,  Wm. Todd Crandell ,  Eric Henry Holec

IPC: B23K31/02

CPC classification number: H05K3/363 ,  B23K1/0016 ,  B23K37/04 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01R4/02 ,  H01R12/61 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/058 ,  H05K2201/09481 ,  H05K2201/09918 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/0228 ,  H05K2203/043 ,  H05K2203/16

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

Abstract translation: 本发明的实施例包括柔性电路板互连和相关的方法。 在一个实施例中，本发明包括将多个柔性电路板连接在一起的方法，包括在第一柔性电路板的上表面和第二柔性电路板的下表面之间施加焊料组合物的步骤; 将第一柔性电路板的上表面和第二柔性电路板的下表面保持在一起; 并且用热源回流焊料组合物，以将第一柔性电路板和第二柔性电路板结合在一起，以分别形成长度大于第一柔性电路板或第二柔性电路板的长度的柔性电路板条。 在一个实施例中，本发明包括用于将柔性电路板保持在一起的电路板夹，所述夹具包括u形紧固件; 连接到U形紧固件的弹簧张力臂; 以及连接到弹簧张力臂的连接机构。 本文还包括其它实施例。

公开(公告)号：US08537091B2

公开(公告)日：2013-09-17

申请号：US12203152

申请日：2008-09-03

Applicant: Chih-Chung Chao

Inventor： Chih-Chung Chao

IPC: G02F1/1345

CPC classification number: H05K3/363 ,  G09G3/20 ,  H05K1/147 ,  H05K2201/0397 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/10128 ,  H05K2203/167

Abstract: A flat panel display includes a display screen, a first flexible printed circuit, and a second flexible printed circuit. The second flexible printed circuit has a plurality of pads and is electrically connected to the display screen. The first flexible printed circuit is electrically connected between the display screen and the second flexible printed circuit and has a plurality of pins corresponding to the pads. The pins are divided into a plurality of groups, and each the group is respectively located at the different sides of the first flexible.

Abstract translation: 平板显示器包括显示屏，第一柔性印刷电路和第二柔性印刷电路。 第二柔性印刷电路具有多个焊盘并电连接到显示屏。 第一柔性印刷电路电连接在显示屏和第二柔性印刷电路之间，并且具有对应于焊盘的多个引脚。 引脚被分成多个组，并且每个组分别位于第一柔性体的不同侧。

公开(公告)号：US20130176692A1

公开(公告)日：2013-07-11

申请号：US13822648

申请日：2011-09-14

Applicant: Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

Inventor： Nikolai Haslebner ,  Markus Leitgeb ,  Michael Gossler ,  Mike Morianz

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K1/0266 ,  H01L2224/2518 ,  H05K1/0269 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/11 ,  H05K1/115 ,  H05K1/14 ,  H05K1/18 ,  H05K1/182 ,  H05K1/189 ,  H05K3/36 ,  H05K3/4638 ,  H05K3/4688 ,  H05K2201/0355 ,  H05K2201/058 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/166 ,  Y10T29/49126

Abstract: For a method for producing a circuit board consisting of a plurality of circuit board areas, wherein the individual circuit board areas comprise at least one layer made of an in insulating base material and a conducting pattern located on or in the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

Abstract translation: 对于用于制造由多个电路板区域组成的电路板的方法，其中各电路板区域包括至少一层由绝缘基底材料制成的层和位于基底材料上的导电图案，下面是 提供：衬底材料，形成在衬底材料中的至少一个对准标记，布置在衬底材料上的第一电路板区域，至少一个额外的电路板区域，其基本上邻接第一电路板区域或至少部分地与第一电路板区域重叠 第一电路板，附加电路板区域相对于对准标记定向，以及多个第一电路板区域和至少一个附加电路板区域的导电图案的连接。 因此，当电路板区域耦合时，可以实现改进的配准和取向。

公开(公告)号：US20120137505A1

公开(公告)日：2012-06-07

申请号：US13368248

申请日：2012-02-07

Applicant: Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

Inventor： Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

IPC: H01P11/00

CPC classification number: H05K3/0014 ,  H01Q1/38 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/058 ,  H05K2203/0113 ,  H05K2203/0353 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract translation: 提供了一种制造折纸形天线辐射结构的方法。 在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道， 衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

公开(公告)号：US20120088376A1

公开(公告)日：2012-04-12

申请号：US13326845

申请日：2011-12-15

Applicant: David J. BRAUN ,  Mark G. CLARK ,  John R. DANGLER ,  Matthew S. DOYLE ,  Thomas D. KIDD ,  Jason T. STOLL

Inventor： David J. BRAUN ,  Mark G. CLARK ,  John R. DANGLER ,  Matthew S. DOYLE ,  Thomas D. KIDD ,  Jason T. STOLL

IPC: H01R12/71 ,  H01R43/00

CPC classification number: H01R43/01 ,  H01R12/52 ,  H01R12/613 ,  H01R12/778 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/058 ,  H05K2201/09181 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y10T29/49174 ,  Y10T29/49194 ,  Y10T29/4922

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract translation: 一种电缆组件，用于通过连接到每个电路板的连接器组件将多个电路板互连在一起。 电缆组件包括具有第一端部的第一电缆和具有第二端部的第二电缆。 第一端部的第一周边具有沿着连接器组件的宽度方向共同形成列的多个第一半通孔。 第二端部的第二周边具有沿着连接器组件的宽度方向共同形成列的多个第二半通孔。 第一和第二端部联接在一起以形成连接单元，使得第一半通孔和第二半通孔连接在一起以形成完整的通孔。

公开(公告)号：US08106300B2

公开(公告)日：2012-01-31

申请号：US12244216

申请日：2008-10-02

Applicant: David J. Braun ,  Mark G. Clark ,  John R. Dangler ,  Matthew S. Doyle ,  Thomas D. Kidd ,  Jason T. Stoll

Inventor： David J. Braun ,  Mark G. Clark ,  John R. Dangler ,  Matthew S. Doyle ,  Thomas D. Kidd ,  Jason T. Stoll

IPC: H01B7/08

CPC classification number: H01R43/01 ,  H01R12/52 ,  H01R12/613 ,  H01R12/778 ,  H01R12/79 ,  H05K1/0219 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/3447 ,  H05K3/36 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/058 ,  H05K2201/09181 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y10T29/49174 ,  Y10T29/49194 ,  Y10T29/4922

Abstract: A cable assembly for interconnecting a plurality of circuit boards together by using a connector assembly connected to each of the circuit boards. The cable assembly includes a first cable having a first end part and a second cable having a second end part. A first periphery of the first end part has a plurality of first half vias that collectively form a column along a width direction of the connector assembly. A second periphery of the second end part has a plurality of second half vias that collectively form a column along the width direction of the connector assembly. The first and second end parts are coupled together to form a connecting unit, such that the first half vias and the second half vias are joined together to form full vias.

Abstract translation: 一种电缆组件，用于通过连接到每个电路板的连接器组件将多个电路板互连在一起。 电缆组件包括具有第一端部的第一电缆和具有第二端部的第二电缆。 第一端部的第一周边具有沿连接器组件的宽度方向共同形成列的多个第一半通孔。 第二端部的第二周边具有沿着连接器组件的宽度方向共同形成列的多个第二半通孔。 第一和第二端部联接在一起以形成连接单元，使得第一半通孔和第二半通孔连接在一起以形成完整的通孔。

公开(公告)号：US20110124155A1

公开(公告)日：2011-05-26

申请号：US13015739

申请日：2011-01-28

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: H01L21/50

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。