中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

318 records (took 0.024 seconds)

    LIGHT-EMITTING DIODE
    21.
    发明申请
    LIGHT-EMITTING DIODE 有权
    发光二极管

    公开(公告)号：US20110062483A1

    公开(公告)日：2011-03-17

    申请号：US12855717

    申请日：2010-08-13

    Applicant: Wenbing Wang ,  Ming-Wei Chan

    Inventor： Wenbing Wang ,  Ming-Wei Chan

    IPC: H01L33/62

    CPC classification number: H05K3/3447 ,  H01L33/483 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K3/3468 ,  H05K2201/062 ,  H05K2201/10106 ,  H05K2203/044 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: This invention provides a light-emitting diode (LED). The LED is electrically connected with a circuit board. The LED includes a light-emitting chip, an encapsulating element, a lead, and a heat insulating element. The encapsulating element encapsulates the light-emitting chip. The lead is coupled with the light-emitting chip and the circuit board. The lead and the encapsulating element form a first connecting place. The lead and the circuit board form a second connecting place. The heat insulating element is disposed between the first connecting place and the second connecting place.

    Abstract translation: 本发明提供一种发光二极管（LED）。 LED与电路板电连接。 LED包括发光芯片，封装元件，引线和隔热元件。 封装元件封装发光芯片。 引线与发光芯片和电路板耦合。 引线和封装元件形成第一连接位置。 引线和电路板形成第二连接处。 绝热元件设置在第一连接位置和第二连接位置之间。

    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF
    22.
    发明申请
    HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF 有权
    散热基板及其制造方法

    公开(公告)号：US20110061901A1

    公开(公告)日：2011-03-17

    申请号：US12614407

    申请日：2009-11-07

    Applicant: Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    Inventor： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

    IPC: H05K1/00 ,  H05K3/00

    CPC classification number: H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

    Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

    Abstract translation: 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

    METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF
    23.
    发明申请
    METHOD FOR SOLDERING ELECTRONIC COMPONENTS OF CIRCUIT BOARD AND CIRCUIT BOARD STRUCTURE THEREOF 审中-公开
    焊接电路板电路元件及其电路板结构的方法

    公开(公告)号：US20110024177A1

    公开(公告)日：2011-02-03

    申请号：US12511161

    申请日：2009-07-29

    Applicant: Hung Tao Wong ,  Chung Yang Wu

    Inventor： Hung Tao Wong ,  Chung Yang Wu

    IPC: H05K1/11 ,  H05K3/34

    CPC classification number: H05K3/3447 ,  H05K1/0201 ,  H05K1/0272 ,  H05K1/116 ,  H05K3/3468 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09627 ,  Y10T29/49144

    Abstract: A method for soldering electronic components of a circuit board and a circuit board structure thereof are presented. The method includes providing a circuit board first; disposing at least one solder hole and at least one heat collecting hole on the circuit board, in which the heat collecting hole is disposed around the solder hole to form a heat collecting area; extending a pin of an electronic component into the solder hole; filling a solder within the solder hole through a soldering process; and keeping heat of the solder in the heat collecting area by the heat collecting hole. Thus, the pin of the electronic component within the solder hole is successfully combined with the solder.

    Abstract translation: 本发明提供一种焊接电路板的电子部件及其电路板结构的方法。 该方法包括首先提供电路板; 在所述电路板上设置至少一个焊料孔和至少一个集热孔，其中所述集热孔设置在所述焊料孔周围以形成集热区域; 将电子部件的销延伸到焊料孔中; 通过焊接工艺在焊料孔内填充焊料; 并且通过集热孔将焊料的热量保持在集热区域中。 因此，焊料孔内的电子部件的销被成功地与焊料组合。

    Circuit board having configurable ground link and with coplanar circuit and ground traces
    25.
    发明授权
    Circuit board having configurable ground link and with coplanar circuit and ground traces 失效
    电路板具有可配置的接地链路和共面电路和接地迹线

    公开(公告)号：US07658622B2

    公开(公告)日：2010-02-09

    申请号：US12386592

    申请日：2009-04-21

    Applicant: Victor L. Bartholomew

    Inventor： Victor L. Bartholomew

    IPC: H01R12/00

    CPC classification number: H05K1/0219 ,  H05K1/0201 ,  H05K1/0293 ,  H05K1/117 ,  H05K3/3405 ,  H05K3/3452 ,  H05K2201/0305 ,  H05K2201/062 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09354 ,  H05K2201/0969 ,  H05K2201/10356 ,  H05K2203/173 ,  Y10S439/943 ,  Y10T29/49155

    Abstract: A transition circuit board for transitioning a cable to a connector is provided. A circuit board has an outer surface with a circuit trace, ground plane and ground link provided thereon. A cable pad and a contact pad are provided at opposite ends of the circuit trace. The ground link is electrically common with the ground plane and is located adjacent to, and separated by a space from, the circuit trace. An insulating coating is provided over at least part of the circuit trace, the ground plane and the outer surface of the circuit board. The insulating coating has a mask aperture there-through exposing an uncoated portion of the circuit trace and the ground link. A conductive jumper material is provided on the uncoated portion of the circuit trace and the ground link to electrically join the circuit trace with the ground plane.

    Abstract translation: 提供了一种用于将电缆转换到连接器的转换电路板。 电路板具有外表面，其上设置有电路迹线，接地平面和接地链路。 在电路迹线的相对端设有电缆垫和接触垫。 接地链路与接地平面电气相同，并且位于与电路迹线相邻并且与电路迹线隔开的空间中。 在电路板的至少一部分，接地平面和电路板的外表面上提供绝缘涂层。 绝缘涂层在其上具有掩模孔，通过暴露电路迹线的未涂覆部分和接地链路。 在电路迹线的未涂覆部分和接地链路上提供导电跳线材料，以将电路迹线与接地平面电连接。

    Mobile terminal device and method for radiating heat therefrom
    26.
    发明授权
    Mobile terminal device and method for radiating heat therefrom 有权
    移动终端装置及其散热方法

    公开(公告)号：US07616446B2

    公开(公告)日：2009-11-10

    申请号：US11940758

    申请日：2007-11-15

    Applicant: Yousuke Watanabe

    Inventor： Yousuke Watanabe

    IPC: H05K7/20 ,  H05K1/11 ,  H04M1/00

    CPC classification number: H05K1/0207 ,  G06F1/203 ,  H04M1/0202 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/141 ,  H05K1/148 ,  H05K3/4641 ,  H05K2201/062

    Abstract: In a mobile terminal device, at least one heat conduction layer formed of a member, such as copper, aluminum or carbon, being excellent in heat conductivity is provided inside a circuit board on which electronic components are mounted. The heat generated in the electronic components is promptly dispersed in the direction of the face of the circuit board by the heat conduction layer, and transferred from the whole face of the circuit board to the operation member, such as keys, and the housing, and then radiated to the outside. With this structure, the local temperature rise at the operation member and the housing can be suppressed, and the temperature on the surface of the mobile terminal device can be made uniform, without significantly increasing the cost and the thickness of the mobile terminal device. In addition, high-performance electronic components can be used by adopting this structure. Furthermore, the rigidity of the circuit board can be raised, and the reliability of the mobile terminal device can be improved.

    Abstract translation: 在移动终端装置中，在安装了电子部件的电路基板的内部设置有由导热性优异的铜，铝或碳等构件形成的至少一个导热层。 在电子部件中产生的热量通过导热层迅速地分散在电路板的表面方向上，并从电路板的整个面传递到操作部件，例如键和壳体，以及 然后辐射到外面。 利用这种结构，可以抑制操作构件和壳体处的局部温度上升，并且可以使移动终端装置的表面上的温度均匀，而不会显着增加移动终端装置的成本和厚度。 此外，通过采用该结构，可以使用高性能的电子部件。 此外，可以提高电路板的刚性，并且可以提高移动终端装置的可靠性。

    MULTILAYER BUILD-UP WIRING BOARD
    27.
    发明申请
    MULTILAYER BUILD-UP WIRING BOARD 有权
    多层建筑接线板

    公开(公告)号：US20090173523A1

    公开(公告)日：2009-07-09

    申请号：US12406009

    申请日：2009-03-17

    Applicant: Naohiro HIROSE ,  Honjin En

    Inventor： Naohiro HIROSE ,  Honjin En

    IPC: H05K1/02

    CPC classification number: H01L29/40 ,  H01L21/4763 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/03 ,  H05K3/064 ,  H05K3/244 ,  H05K3/382 ,  H05K3/403 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/062 ,  H05K2201/093 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2201/09681 ,  H05K2203/1178

    Abstract: Mesh holes 35a and 59a of upper solid layers 35 and upper solid layers 59 are formed to overlie on one another, so that the insulating properties of interlayer resin insulating layers 50 are not lowered. Here, the diameter of each mesh hole is preferably 75 to 300 μm. The reason is as follows. If the diameter of the mesh hole is less than 75 μm, it is difficult to overlay the upper and lower mesh holes on one another. If the diameter exceeds 300 μm, the insulating properties of the interlayer resin insulating layers deteriorate. In addition, the distance between the mesh holes is preferably 100 to 2000 μm. The reason is as follows. If the distance is less than 100 μm, the solid layer cannot function. If the distance exceeds 2000 μm, the deterioration of the insulating properties of the interlayer resin insulating film occurs.

    Abstract translation: 上固体层35和上固体层59的网孔35a和59a形成为彼此重叠，使得层间树脂绝缘层50的绝缘性能不降低。 这里，每个网孔的直径优选为75〜300μm。 原因如下。 如果网孔的直径小于75μm，则难以将上，下网孔叠置在一起。 如果直径超过300μm，则层间树脂绝缘层的绝缘性能变差。 此外，网眼之间的距离优选为100〜2000μm。 原因如下。 如果距离小于100um，则固体层不能起作用。 如果距离超过2000μm，则发生层间树脂绝缘膜的绝缘性劣化。

Patent Agency Ranking