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公开(公告)号：US09072173B2
公开(公告)日：2015-06-30
申请号：US14140456
申请日：2013-12-24
Inventor： Ning Hou
CPC classification number: H05K3/0097 , H05K3/368 , H05K3/4652 , H05K3/4691 , H05K2201/09145 , H05K2201/209 , H05K2203/1461 , Y10T29/49155
Abstract: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.
Abstract translation: RFPCB包括加强层和至少两个拼接在一起以在形状和尺寸上匹配加强层的FPCB。 FPCB粘附到加强层上。 加强层包括与FPCB连接并且去除部分以获得期望的柔性的电路。
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公开(公告)号：US20150157862A1
公开(公告)日：2015-06-11
申请号：US14563778
申请日：2014-12-08
Applicant: Second Sight Medical Products, Inc.
Inventor： Robert J. Greenberg , Neil H. Talbot , James S. Little
CPC classification number: H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
Abstract translation: 本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录 的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。 该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。 大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。 该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。 本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。
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公开(公告)号：US20150043172A1
公开(公告)日：2015-02-12
申请号：US14103601
申请日：2013-12-11
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Eiji MUGIYA , Kenzo KITAZAKI , Masaya SHIMAMURA , Tetsuo SAJI , Hiroshi NAKAMURA
CPC classification number: H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.
Abstract translation: 提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。 电路基板包括安装部件，密封体和屏蔽件。 电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。 屏蔽件具有外屏蔽部分和内屏蔽部分。
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公开(公告)号：US20140355211A1
公开(公告)日：2014-12-04
申请号：US14227528
申请日：2014-03-27
Applicant: Control Techniques Limited
CPC classification number: H05K1/0201 , H05K1/0209 , H05K1/0272 , H05K7/20909 , H05K2201/09063 , H05K2201/09145 , H05K2203/081
Abstract: There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.
Abstract translation: 描述了一种电子组件，其包括结构和连接到该结构以形成管道的印刷电路板（PCB）。 PCB具有布置成接收一个或多个发热部件的第一侧和第二侧。 PCB包括形成在其中的一个或多个孔。 电子组件还包括气流发生装置，其布置成沿着管道并沿着PCB的第二侧产生气流，使得空气被迫通过一个或多个孔。 通过在PCB下面形成管道并允许空气被迫通过在PCB中形成的孔，可以实现对PCB上部件的更有效的冷却。 例如，孔的位置可以被调整为使得特定部件或部件的特定部分可能暴露于通过孔的气流。
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公开(公告)号：US08882310B2
公开(公告)日：2014-11-11
申请号：US13709121
申请日：2012-12-10
Applicant: Microsoft Corporation
Inventor： David Mandelboum , Giora Yahav , Asaf Pellman , Shlomo Felzenshtein
IPC: F21V29/00 , G01S17/89 , F21V13/02 , H05K1/02 , G02B27/20 , F21V21/00 , H01S5/022 , H01S5/024 , H01S5/40
CPC classification number: F21V21/00 , F21V13/02 , G01S17/89 , G02B27/0938 , G02B27/0944 , G02B27/20 , H01S5/022 , H01S5/02208 , H01S5/02212 , H01S5/02236 , H01S5/02276 , H01S5/02288 , H01S5/02296 , H01S5/024 , H01S5/02469 , H01S5/06209 , H01S5/06216 , H01S5/4031 , H05K1/0243 , H05K1/0296 , H05K3/0052 , H05K2201/09145 , H05K2201/10106
Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.
Abstract translation: 本发明的一个实施例提供了一种低电感光源模块，其可以具有小的占地面积，并且包括印刷电路板（PCB）安装座，其具有形成在PCB安装座侧面上的第一和第二导电迹线，以及半导体光源，其具有 用于用导电接合材料接合与第一导电迹线接合电力的第一电触点，以及用于接收通过至少一个键合线连接到第二导电迹线的功率的第二电接触。
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Patent Agency Ranking
公开(公告)号：US20140160745A1
公开(公告)日：2014-06-12
申请号：US13709121
申请日：2012-12-10
Applicant: MICROSOFT CORPORATION
Inventor： David Mandelboum , Giora Yahav , Asaf Pellman , Shlomo Felzenshtein
CPC classification number: F21V21/00 , F21V13/02 , G01S17/89 , G02B27/0938 , G02B27/0944 , G02B27/20 , H01S5/022 , H01S5/02208 , H01S5/02212 , H01S5/02236 , H01S5/02276 , H01S5/02288 , H01S5/02296 , H01S5/024 , H01S5/02469 , H01S5/06209 , H01S5/06216 , H01S5/4031 , H05K1/0243 , H05K1/0296 , H05K3/0052 , H05K2201/09145 , H05K2201/10106
Abstract: An embodiment of the invention provides a low inductance light source module, which may have a small footprint and comprise a printed circuit board (PCB) mount having first and second conducting traces formed on a side of the PCB mount and a semiconducting light source having a first electrical contacts for receiving power that is bonded to the first conducting trace with a conducting bonding material and a second electrical contact for receiving power that is connected by at least one bondwire to the second conducting trace.
Abstract translation: 本发明的一个实施例提供了一种低电感光源模块，其可以具有小的占地面积，并且包括印刷电路板（PCB）安装座，其具有形成在PCB安装座侧面上的第一和第二导电迹线，以及半导体光源，其具有 用于用导电接合材料接合与第一导电迹线接合电力的第一电触点，以及用于接收通过至少一个键合线连接到第二导电迹线的功率的第二电接触。
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公开(公告)号：US08737084B2
公开(公告)日：2014-05-27
申请号：US13285019
申请日：2011-10-31
Applicant: Yu-Ching Liu , Chi-An Yu , Zhi-Jun Wang , Hai-Yang Niu , Yong Tan , Ri-Qing Chen , Ling-Lin Yuan
Inventor： Yu-Ching Liu , Chi-An Yu , Zhi-Jun Wang , Hai-Yang Niu , Yong Tan , Ri-Qing Chen , Ling-Lin Yuan
IPC: H05K5/00
CPC classification number: H05K7/1417 , H05K1/02 , H05K2201/09145
Abstract: A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.
Abstract translation: 一种固定到载体上的印刷电路板（PCB），所述载体包括用于固定所述PCB的至少一个钩子，所述PCB包括第一表面和与所述第一表面相对的第二表面。 第一表面的边缘中的至少一个凹部接收至少一个钩，因此在PCB的上表面上方没有突起。 还提供用于固定PCB的载体。
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28.发明授权Light module, composite circuit board device used therein, and assembling method thereof 有权光模块，其中使用的复合电路板装置及其组装方法公开(公告)号：US08734000B2
公开(公告)日：2014-05-27
申请号：US13151356
申请日：2011-06-02
Applicant: Hsin-Chang Chiang , Chieh-Jen Cheng , Chien-Ting Liao
Inventor： Hsin-Chang Chiang , Chieh-Jen Cheng , Chien-Ting Liao
IPC: F21V7/04
CPC classification number: H05K1/147 , H05K2201/056 , H05K2201/09063 , H05K2201/09145 , H05K2201/10106
Abstract: A light module and an assembling method thereof are disclosed. The light module includes a first circuit board, a second circuit board, and a light source, wherein the first circuit board has a first opening and a second opening, and the second circuit board has a first bending portion. The light source is disposed on the first circuit board. The second circuit board passes through the first opening and the second opening of the first circuit board to form the first bending portion and the first circuit board and the second circuit board are fixed together to complete the light module assembling.
Abstract translation: 公开了一种光模块及其组装方法。 光模块包括第一电路板，第二电路板和光源，其中第一电路板具有第一开口和第二开口，并且第二电路板具有第一弯曲部分。 光源设置在第一电路板上。 第二电路板通过第一电路板的第一开口和第二开口以形成第一弯曲部分，并且第一电路板和第二电路板固定在一起以完成光模块组装。
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公开(公告)号：US20140022752A1
公开(公告)日：2014-01-23
申请号：US13599937
申请日：2012-08-30
Applicant: Markus Wille
Inventor： Markus Wille
CPC classification number: H05K1/142 , H05K3/36 , H05K2201/09063 , H05K2201/09145 , H05K2201/1059 , Y10T29/49126
Abstract: Disclosed herein is a circuit board system comprising a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.
Abstract translation: 本文公开了一种电路板系统，其包括至少在部分上基本上是平面的载体电路板，其中载体电路板在一个或两侧具有至少一个刚性层铜包层或设置有导体轨道，其中至少一个基本上 与载体电路板并联排列的平面电路板模块布置成在载体电路板的相关凹槽中在至少一个刚性层铜包覆在一侧或两侧上或设置有导体轨道。 特别地，电路板模块被压入载体电路板中的凹槽中，并且电路板模块的边缘与相关联的凹部的边缘以摩擦锁定的方式接合以形成压配合。
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公开(公告)号：US20130136852A1
公开(公告)日：2013-05-30
申请号：US13701999
申请日：2011-06-03
Applicant: David Riedel , Stefan Liehr , Rina Ortega-Cagara
Inventor： David Riedel , Stefan Liehr , Rina Ortega-Cagara
CPC classification number: H05K3/0011 , H01L23/544 , H01L2223/5442 , H01L2223/54426 , H01L2223/5446 , H01L2223/5448 , H01L2924/0002 , H05K1/0269 , H05K1/189 , H05K3/0052 , H05K3/06 , H05K3/28 , H05K3/323 , H05K2201/0108 , H05K2201/09145 , H05K2201/09781 , H05K2201/09918 , H05K2201/10681 , H05K2203/0126 , H05K2203/0228 , H05K2203/1147 , H05K2203/166 , Y10T29/49155 , Y10T29/49789 , H01L2924/00
Abstract: A technique comprising: forming a plurality of smaller substrates from one or more larger substrates by a reduction process according to which there is some possible variation size between the smaller substrates within a variation range; and, in advance of said reduction process, providing said one or more larger substrates with one or more detection marks whose size and location are selected such that after the reduction process each smaller substrate includes a portion of at least one of said one or more detection marks, said portion having one or more edges that coincide with at least a part of one or more edges of the smaller substrate whatever actual size the smaller substrate has within said variation range.
Abstract translation: 一种技术，包括：通过还原过程从一个或多个更大的衬底形成多个较小的衬底，根据该衬底，较小衬底之间在变化范围内存在一些可能的变化尺寸; 并且在所述还原过程之前，为所述一个或多个较大的基底提供其尺寸和位置被选择的一个或多个检测标记，使得在所述还原过程之后，每个较小的基底包括所述一个或多个检测中的至少一个的一部分 所述部分具有一个或多个边缘，其与所述较小基板的一个或多个边缘的至少一部分重合，而所述较小基板在所述变化范围内具有任何实际尺寸。
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