Abstract:
A light source module including a substrate, a plurality of light emitting devices installed on the substrate, and a plurality of lenses installed on the substrate to cover the plurality of light emitting devices, respectively, and each of the plurality of lenses having a pair of open end portions facing one another, the plurality of lenses arranged such that an open end portion of one lens faces an opened end portion of an adjacent lens is provided.
Abstract:
A flexible display comprises a display panel that includes a flexible substrate and subpixels formed in a display area defined on a surface of the flexible substrate. A data driver is mounted to a data driver area defined on the surface of the flexible substrate. The flexible display can have a connector mounted to a connector area defined on the surface of the substrate. A bent portion of the flexible substrate is between the display area and the connector area and causes the connector area to be bent back towards an other surface of the flexible substrate. A system board can further be electrically connected to the connector mounted on the connector area through a cable.
Abstract:
A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.
Abstract:
Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.
Abstract:
There is provided an interconnection structure. An interconnection structure according to an aspect of the invention may include: a plurality of side portions provided on one surface of a substrate part and a plurality of cavities located between the side portions and located further inward than the side portions; and electrode pattern portions provided on surfaces of the side portions and the cavities.
Abstract:
A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently.
Abstract:
A printed board to be loaded into a printed-board-receiving structure having a backboard and a guide rail, the backboard having a connector plug-in connectable to a connector on the printed board, the guide rail guiding the printed board toward the backboard and having a groove including a sloping portion, the printed board includes a sloping portion forming a projection at an end of the printed board, the projection being fittable and slidable along the groove in the guide rail.
Abstract:
A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
Abstract:
A method for reducing the fitting thrust of golden finger (101,103) and a PCB (100). The method and the PCB (100) solve the problem of excessive inserting force of the golden finger (101,103) of the prior art, through modifying the shape of the edge of the PCB (100), the edge of the PCB open reeds of a connector (201, 203) at different time. The PCB (100) has at least one concave edge section or at least one convex edge section or at least one tilt edge section, and the edge can further be beveled. The bonding pads of the golden finger can be assorted, pin ends of a part of golden fingers (101, 103) can be partially removed or these golden fingers can be completely removed, the pin ends of a part of golden fingers (101,103) can be preserved. Through the method, the purpose of reducing the fitting thrust upon inserting the PCB (100) into the connector can be achieved.
Abstract:
Provided is an inductor which effectively uses a mounting space and has remarkably reduced radiation noise. The inductor is provided with a magnetic core (1) having a high magnetic permeability, and a coil element (2) integrally embedded in the magnetic core. The magnetic core (1) has a spherical structure, and the coil element (2) has a spherical coil structure wherein a coil conductive wire is spherically laminated. The extracting end of the coil element configures connecting terminals (2a, 2b) by extending to the external of the magnetic core. Since the coil element having the spherical coil structure is integrally embedded inside the magnetic core having the spherical structure, a leaking magnetic flux is remarkably reduced and the magnetic flux is prevented from being disturbed.