中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

144 records (took 0.018 seconds)

    Edge connector and printed circuit board assembly
    24.
    发明授权
    Edge connector and printed circuit board assembly 有权

    公开(公告)号：US11870169B2

    公开(公告)日：2024-01-09

    申请号：US17262967

    申请日：2019-07-26

    Applicant: IMS CONNECTOR SYSTEMS GMBH

    Inventor： Christoph Müllinger-Bausch ,  Roland Baumgärtner ,  Michael Regenbrecht

    IPC: H01R12/72 ,  H05K1/18

    CPC classification number: H01R12/721 ,  H05K1/18 ,  H05K2201/09754 ,  H05K2201/10189

    Abstract: The present invention relates to an edge connector (1) for a printed circuit board (50), comprising an at least two-part housing (10) with a first housing part (20) and a second housing part (30), wherein the first housing part (20) has a recess (25) in which at least one conductor (15) is arranged, said at least one conductor (15) having a first limb (16) with a first end (17) and a second limb (18) with a second end (19), wherein the housing (10) comprises a first region (12) in a first plane (11), in which each first end (17) protrudes out of the housing (10) in an assembly direction (5) in order to connect to a conductor track (54) of the printed circuit board (50), and the housing (10) has a second region (14) in a second plane (13) which is arranged parallel and at a distance to the first plane (11) in the assembly direction (5), wherein the second limb (18) is arranged at an angle of 90° to the first limb (16), and the second limb (18) protrudes into a mating plug recess (35) in the second housing part (30) in a plug-in direction (6). The present invention additionally relates to a printed circuit board assembly (2) with at least one such edge connector.

    Reducing or eliminating board-to-board connectors
    28.
    发明授权
    Reducing or eliminating board-to-board connectors 有权
    减少或消除板对板连接器

    公开(公告)号：US09525222B2

    公开(公告)日：2016-12-20

    申请号：US14250811

    申请日：2014-04-11

    Applicant: Apple Inc.

    Inventor： Anna-Katrina Shedletsky ,  Nathan Guide

    IPC: H01R13/648 ,  H01R12/61 ,  H05K3/28 ,  H05K3/36

    CPC classification number: H01R12/613 ,  H05K3/284 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09754 ,  H05K2201/10424 ,  H05K2203/025

    Abstract: Embodiments of the present disclosure provide a method for creating a connection mechanism for a circuit board. The method includes securing a plurality of electrical conductors to a sleeve. Once the electrical conductors have been coupled to the sleeve, the sleeve and the plurality of conductors are coupled to, and molded with, the circuit board. At least one side of the circuit board, such as, for example, the molding over the plurality of electrical conductors, is subsequently reduced to expose at least a portion of at least one of the plurality of electrical conductors. An electrical connector is then coupled to the at least the portion of the one or more of the plurality of electrical conductors that was exposed when the first side of the printed circuit board was reduced.

    Abstract translation: 本公开的实施例提供了一种用于创建电路板的连接机构的方法。 该方法包括将多个电导体固定到套筒上。 一旦电导体已经耦合到套筒，套管和多个导体被耦合到电路板并且与其成型。 电路板的至少一侧，例如多个电导体上的模制件，随后被减少以露出多个电导体中的至少一个电导体的至少一部分。 然后，电连接器被耦合到当印刷电路板的第一面减小时暴露的多个电导体中的一个或多个的至少一部分。

    Plastic Electronic Device Structures With Embedded Components
    30.
    发明申请
    Plastic Electronic Device Structures With Embedded Components 有权
    具有嵌入式组件的塑料电子器件结构

    公开(公告)号：US20150313003A1

    公开(公告)日：2015-10-29

    申请号：US14263749

    申请日：2014-04-28

    Applicant: Apple Inc.

    Inventor： Darshan R. Kasar

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H01Q1/243 ,  H01Q1/42 ,  H05K1/189 ,  H05K3/284 ,  H05K9/0024 ,  H05K2201/09754 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1476

    Abstract: Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.

    Abstract translation: 诸如电气部件和电线以及柔性印刷电路上的迹线的电路可以嵌入注射成型的塑料结构内。 电气元件可以包括集成电路，连接器和系统级封装电路模块。 系统级封装电路模块可以包括安装在基板上并被塑料覆盖的部件。 连接器可以包括用于与电子设备或电池上的相应连接器配合的连接器。 注射成型的塑料结构可以形成外壳。 壳体可以形成电子设备的一部分，接收电子设备的外部壳体或其他结构。 近场通信天线可以嵌入在塑料外壳内。 信号线和塑料纤维可以交织以形成嵌入在塑料外壳或其它注模塑料结构中的网状物。

Patent Agency Ranking