公开(公告)号：US20030067074A1

公开(公告)日：2003-04-10

申请号：US09974947

申请日：2001-10-10

Inventor： Larry D. Kinsman

IPC: H01L023/52

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

Abstract translation: 本发明涉及一种用于连接放置在电路板的相对侧上的集成电路的装置和方法，该集成电路通过利用嵌入电路板中的导电元件并从板的一个表面延伸到另一个表面。 导电迹线沿着电路板的表面从导电元件延伸到集成电路。 导电迹线可以由多个导电层形成。

公开(公告)号：US06211468B1

公开(公告)日：2001-04-03

申请号：US09132828

申请日：1998-08-12

Applicant: David J. Windschitl

Inventor： David J. Windschitl

IPC: H01R909

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K3/002 ,  H05K3/388 ,  H05K3/4076 ,  H05K2201/0166 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H01L2924/00

Abstract: A flexible circuit includes a flexible non-conductive substrate having a first surface and a second surface. A first electrically conductive trace is provided on the first surface and a second electrically conductive trace is provided on the second surface. A passage extends through the substrate from an end of the first trace to an end of the second trace. The passage includes a beveled opening of a first size formed in the first side and axially aligned with a second beveled opening of the first size formed in the second side. The first and second openings are interconnected by an aperture axially aligned therewith and being of a second size less than the first size. An electrically conductive surface is provided on the passage for electrically interconnecting the first trace and the second trace.

Abstract translation: 柔性电路包括具有第一表面和第二表面的柔性非导电基底。 第一导电迹线设置在第一表面上，第二导电迹线设置在第二表面上。 通道从第一迹线的端部延伸穿过基底到第二迹线的末端。 通道包括形成在第一侧中的第一尺寸的斜切开口，并且与形成在第二侧中的第一尺寸的第二斜切开口轴向对准。 第一和第二开口通过与其轴向对齐并且具有小于第一尺寸的第二尺寸的孔相互连接。 在通道上设置导电表面，用于电连接第一迹线和第二迹线。

公开(公告)号：US5805425A

公开(公告)日：1998-09-08

申请号：US718885

申请日：1996-09-24

Applicant: Robert K. Peterson

Inventor： Robert K. Peterson

IPC: H01L23/498 ,  H01R13/24 ,  H05K1/02 ,  H05K3/46 ,  H05K1/14

CPC classification number: H01R13/2414 ,  B82Y15/00 ,  H01L23/49827 ,  H05K3/462 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H05K1/0206 ,  H05K2201/0116 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K3/4623

Abstract: First and second electronic parts interconnected by a nonconductive nanoporous film having first and second parallel surfaces, said film having metal-filled pores extending through the thickness of the film, such that each of said parts is contacted by the metal in at least several pores, a number of the pores being perpendicular to the surfaces of the film, and other pores being oblique to the surfaces of the film, whereby thermal dissipation is enhanced in the plane of the film.

Abstract translation: 通过具有第一和第二平行表面的非导电纳米多孔膜相互连接的第一和第二电子部件，所述膜具有延伸穿过膜的厚度的金属填充孔，使得每个所述部分在至少几个孔中与金属接触， 多个孔垂直于膜的表面，其他孔与膜的表面倾斜，从而在膜的平面上增加散热。

公开(公告)号：US5328752A

公开(公告)日：1994-07-12

申请号：US948334

申请日：1992-09-21

Applicant: Keita Miyazato

Inventor： Keita Miyazato

IPC: B29C67/00 ,  G03F7/00 ,  H05K3/00 ,  B32B9/00

CPC classification number: B29C67/007 ,  G03F7/0035 ,  G03F7/0037 ,  H05K3/0023 ,  H05K2201/0195 ,  H05K2201/09836 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The instant invention discloses a process for producing a substrate for use in printed circuit which comprises: a vessel for containing a photo-curable resin; a masking means positioned above and in close proximity to the resin surface; a planar light for irradiating through the mask a thin layer of the photo-curable resin, means for moving the thin-layered cured product in the vertical direction, means for coating additional uncured resin on the cured product and irradiating the same to form a newly formed thin-layered cured product thereon, and means for successively coating and forming additional thin-layers of cured products. The second aspect of this invention relates to a substrate for use in printed circuit boards produced by the above-mentioned process and apparatus.

Abstract translation: 本发明公开了一种制造用于印刷电路的基板的方法，该方法包括：用于容纳光固化树脂的容器; 位于树脂表面上方且紧邻树脂表面的掩蔽装置; 用于通过掩模照射光固化树脂的薄层的平面光，用于在垂直方向上移动薄层固化产物的装置，用于在固化产物上涂覆另外的未固化树脂并将其照射以形成新的 在其上形成的薄层固化产物，以及用于连续地涂覆和形成附加的固化产物薄层的装置。 本发明的第二方面涉及一种用于通过上述方法和装置制造的印刷电路板的基板。

公开(公告)号：US09699919B2

公开(公告)日：2017-07-04

申请号：US15041104

申请日：2016-02-11

Applicant: Yazaki Corporation

Inventor： Akemi Maebashi ,  Pharima Akanitsuk

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/09818 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.

公开(公告)号：US09443788B2

公开(公告)日：2016-09-13

申请号：US13966633

申请日：2013-08-14

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： Takamasa Takano

IPC: H05K1/11 ,  H01L23/48 ,  H01L21/48 ,  H01L21/768 ,  H01L23/14 ,  H01L23/498 ,  H05K3/42 ,  H05K3/44

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15786 ,  H01L2924/1579 ,  H05K1/113 ,  H05K3/426 ,  H05K3/445 ,  H05K2201/09436 ,  H05K2201/09581 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/0733 ,  H05K2203/1178 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49165 ,  H01L2224/05647 ,  H01L2924/01024 ,  H01L2924/01079

Abstract: A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole electrodes by filling a conductive material into the plurality of through-holes, forming a first insulation layer on one surface of the substrate, forming a plurality of first openings which expose the plurality of through-hole electrodes corresponding to each of the plurality of through-hole electrodes, on the first insulation layer and correcting a position of the plurality of first openings using the relationship between a misalignment amount of a measured distance value of an open position of a leaning through-hole among the plurality of through-holes and of a design distance value of the open position of the leaning through-hole among the plurality of through-holes with respect to a center position of the substrate.

Abstract translation: 一种制造通孔电极基板的方法包括在基板上形成多个通孔，通过在多个通孔中填充导电材料形成多个通孔电极，在一个通孔上形成第一绝缘层 在所述第一绝缘层上形成多个第一开口，所述多个第一开口将与所述多个通孔电极中的每一个相对应的多个通孔电极暴露在所述第一绝缘层上，并且使用所述关系来校正所述多个第一开口的位置 在多个通孔中的倾斜通孔的打开位置的测量距离值的偏移量与多个通孔中的倾斜通孔的打开位置的设计距离值之间， 相对于基板的中心位置。

公开(公告)号：US09320143B2

公开(公告)日：2016-04-19

申请号：US13845325

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Ming Weng ,  Wei-Ming Cheng ,  Han-Pei Huang

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

公开(公告)号：US09173298B2

公开(公告)日：2015-10-27

申请号：US14097251

申请日：2013-12-05

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Yong Ha Woo ,  E-Tung Chou ,  Wen-Lun Lo

IPC: H01L21/48 ,  H01L21/44 ,  H05K3/00 ,  H01L23/498 ,  H01L25/10 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/09 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/181 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0379 ,  H05K2201/09836 ,  H05K2201/10674 ,  H05K2203/0384 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract translation: 封装基板包括电路板，多个第一导电柱和多个第二导电柱。 电路板包括形成在第一基底的第一表面上的第一基底和第一导电图案层。 第一导电柱从第一导电图案层延伸并电连接到第一导电图案层。 第二导电柱从第一导电图案层延伸并与之电连接。 每个第二导电柱的高度大于每个第一导电柱的高度。

公开(公告)号：US20150201499A1

公开(公告)日：2015-07-16

申请号：US14153071

申请日：2014-01-12

Applicant: Zohar SHINAR ,  Joel VIDAL

Inventor： Zohar SHINAR ,  Joel VIDAL

IPC: H05K3/12 ,  B29C67/00

CPC classification number: H05K3/125 ,  B29C64/112 ,  B29C64/135 ,  B29C64/386 ,  B29C70/882 ,  B29K2105/0058 ,  B29K2995/0005 ,  B29K2995/0006 ,  B29K2995/0007 ,  B29L2031/3406 ,  B29L2031/3425 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y80/00 ,  H05K1/0206 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0268 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0284 ,  H05K1/092 ,  H05K1/165 ,  H05K1/167 ,  H05K1/186 ,  H05K3/0005 ,  H05K3/1283 ,  H05K3/225 ,  H05K3/284 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/4664 ,  H05K3/4685 ,  H05K3/4688 ,  H05K2201/0367 ,  H05K2201/037 ,  H05K2201/0391 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/098 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/09872 ,  H05K2201/10098 ,  H05K2203/013 ,  H05K2203/107 ,  H05K2203/163 ,  H05K2203/166

Abstract: Device, system, and method of three-dimensional printing. A device includes: a first 3D-printing head to selectively discharge conductive 3D-printing material; a second 3D-printing head to selectively discharge insulating 3D-printing material; and a processor to control operations of the first and second 3D-printing heads based on a computer-aided design (CAD) scheme describing a printed circuit board (PCB) intended for 3D-printing. A 3D-printer device utilizes 3D-printing methods, in order to 3D-print: (a) a functional multi-layer PCB; or (b) a functional stand-alone electric component; or (c) a functional PCB having an embedded or integrated electric component, both of them 3D-printed in a unified 3D-printing process.

Abstract translation: 三维打印的设备，系统和方法。 一种装置包括：第一3D打印头，用于选择性地排放导电3D打印材料; 第二3D打印头，用于选择性地放电绝缘3D打印材料; 以及基于描述用于3D打印的印刷电路板（PCB）的计算机辅助设计（CAD）方案来控制第一和第二3D打印头的操作的处理器。 3D打印机设备利用3D打印方法，以便3D打印：（a）功能性多层PCB; 或（b）功能独立电气部件; 或（c）具有嵌入或集成电气部件的功能PCB，它们都以统一的3D打印过程3D打印。

公开(公告)号：US08642908B2

公开(公告)日：2014-02-04

申请号：US13202176

申请日：2010-10-13

Applicant: Jonas Moran ,  Mats Kleverman

Inventor： Jonas Moran ,  Mats Kleverman

IPC: H03K17/975

CPC classification number: G06F3/0202 ,  H03K17/9645 ,  H05K1/0275 ,  H05K1/053 ,  H05K1/115 ,  H05K1/116 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0026 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/445 ,  H05K2201/0108 ,  H05K2201/0376 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/107

Abstract: An electronic device comprises a housing having an outer face and an inner face. A key is provided on the housing, which comprises a micro hole formed in the housing and a conductive material extending within the micro hole to the outer face of the housing. A sensor is coupled to the conductive material to detect whether an object is brought into contact or out of contact with the micro hole at the outer face.

Abstract translation: 电子设备包括具有外表面和内表面的壳体。 在壳体上设有钥匙，该钥匙包括形成在壳体中的微孔和在微孔内延伸到壳体外表面的导电材料。 传感器耦合到导电材料，以检测物体是否与外表面的微孔接触或脱离接触。