公开(公告)号：US20150131244A1

公开(公告)日：2015-05-14

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONALE DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: G01K11/26 ,  H05K1/18

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The electrical device (2, 202) according to the invention comprises a first electrical component (4) and a second electrical component (6) connected to each other via an electrical connection means (26) having an electrically insulating support plate (24), and a weld joint (22) deposited on the support plate (24).The weld joint (22) has a melting temperature (TO significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection means (26) are provided to be subjected.The electrical device (2) comprises a cement (28) that completely covers the exposed weld joint (22), the material of the cement (28) being chosen to maintain its adhesion and its tightness with respect to the weld joint (22) when the ambient operating temperature (Ta) is applied.

Abstract translation: 根据本发明的电气设备（2,202）包括通过具有电绝缘支撑板（24）的电连接装置（26）彼此连接的第一电气部件（4）和第二电气部件（6） 和沉积在支撑板（24）上的焊接接头（22）。 焊接接头（22）的熔融温度（TO显着低于设置有两个电气部件和电连接装置26中的至少一个）的环境工作温度（Ta），电气装置 2）包括完全覆盖暴露的焊接接头（22）的水泥（28），选择水泥（28）的材料以在环境工作温度下保持其粘合力及其相对于焊接接头（22）的密封性 （Ta）。

公开(公告)号：US09007265B2

公开(公告)日：2015-04-14

申请号：US12651539

申请日：2010-01-04

Applicant: Nirod K. Das

Inventor： Nirod K. Das

IPC: H01Q1/38 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01Q1/38 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/0366 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0281 ,  H05K2201/10068

Abstract: Substrate arrangements useful for high-performance radio-frequency planar circuits and antennas eliminate excitation of parallel-plate or surface-wave radiations. By eliminating such radiation which escapes sideways through the substrates, the loss of valuable power carried away by these radiations can be avoided, and/or complications resulting from these radiations (e.g., in the form or electromagnetic interference, cross-talk between circuit components or poor signal integrity) can be avoided. A new type of substrate layer is embedded with thin conducting wires that are closely packed and oriented normal to the substrate layering. These conducting wires change the substrate behavior in a unique way. Such new substrate layers may be used in slotline/coplanar waveguide circuits and microstrip antennas to achieve high-performance radio-frequency operations.

Abstract translation: 用于高性能射频平面电路和天线的衬底布置消除了平行板或表面波辐射的激发。 通过消除通过基板横向逸出的这种辐射，可以避免由这些辐射带走的有价值功率的损失，和/或由这些辐射引起的并发症（例如，形式或电磁干扰，电路部件之间的串扰或 信号完整性差）。 一种新型的基底层被埋入细密的导线，其紧密堆积并且垂直于基底分层。 这些导线以独特的方式改变基板行为。 这种新的衬底层可以用于槽线/共面波导电路和微带天线中，以实现高性能的射频操作。

公开(公告)号：US20140369013A1

公开(公告)日：2014-12-18

申请号：US14345143

申请日：2012-09-13

Applicant: Akira Oikawa

Inventor： Akira Oikawa

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L23/3121 ,  H01L23/315 ,  H01L2224/16225 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/0271 ,  H05K3/284 ,  H05K2201/10068

Abstract: The electronic device is provided with a wiring board, a piezoelectric element (electronic component) which is mounted on an upper surface (front surface) of the wiring board so as to make its functional surface (major surface) face the upper surface, and a resin part which is adhered to a side surfaces of the piezoelectric element and to the wiring board and seals a facing space between the upper surface of the wiring board and the functional surface of the piezoelectric element. Further, the resin part is recessed in shape relative to the facing space.

Abstract translation: 该电子装置设置有布线板，安装在布线板的上表面（前表面）上以使其功能表面（主表面）面向上表面的压电元件（电子部件），以及 树脂部分粘附到压电元件的侧表面和布线板，并且密封布线板的上表面和压电元件的功能表面之间的相对的空间。 此外，树脂部分相对于相对的空间凹陷成形。

公开(公告)号：US20140313682A1

公开(公告)日：2014-10-23

申请号：US14257006

申请日：2014-04-21

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： HIROYUKI MITOME

IPC: H05K1/02

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3426 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10424 ,  H05K2201/10462 ,  H05K2201/10553 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A composite electronic component includes a metal component with a wide surface terminal, a printed circuit board with a wide surface mounting pad; and a plurality of small area solder films partitioned into small sectioned regions. The small sectioned regions are sectioned by grid-shaped solder resist banks on the wide surface mounting pad. A cream solder is applied on the individual small sectioned regions to form the plurality of small area solder films. The grid-shaped solder resist bank has a width configured to: reduce a bubble that occurs in the sectioned region at one side of the grid-shaped solder resist bank from merging with a bubble that occurs in the sectioned region at another side of the grid-shaped solder resist bank; and act as an escaping route for a bubble that occur in the small area solder film.

Abstract translation: 复合电子部件包括具有宽表面端子的金属部件，具有宽表面安装焊盘的印刷电路板; 以及划分成小截面区域的多个小面积焊料膜。 小截面区域由宽表面安装垫上的格栅状阻焊堤分段。 在各个小截面区域上施加膏状焊料以形成多个小面积的焊料膜。 栅格形阻焊堤具有一宽度，该宽度被配置为：减小在栅极阻焊堤一侧的截面区域中发生的气泡，与在栅格另一侧的截面区域中发生的气泡合并 形阻焊银行; 并作为发生在小面积焊料膜中的气泡的逸出路线。

公开(公告)号：US08279610B2

公开(公告)日：2012-10-02

申请号：US12674505

申请日：2008-08-21

Applicant: Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

Inventor： Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

IPC: H05K1/00 ,  H05K1/18

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

Abstract translation: 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基座的短边方向上的与一个角位置相对的另一个角位置处设置有沿着基座的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。

公开(公告)号：US20120236510A1

公开(公告)日：2012-09-20

申请号：US13051946

申请日：2011-03-18

Applicant: Chih Wei Wong

Inventor： Chih Wei Wong

IPC: H05K7/02 ,  H05K3/30

CPC classification number: H05K7/205 ,  H05K1/0201 ,  H05K1/185 ,  H05K2201/10068 ,  Y10T29/4913

Abstract: A system and method of making an apparatus for managing heat distribution in an oscillator system is disclosed. In an example embodiment, the apparatus includes a resonator configured to provide a periodic signal, a circuit coupled to the resonator configured to compensate for changes in the periodic signal due to variation in temperature, and further includes a heat source configured to generate heat that heats the resonator and the circuit. At least one of the resonator, circuit, and heat source is embedded in a substrate, and the resonator, circuit, and heat source are arranged to heat the resonator and circuit substantially the same amount.

Abstract translation: 公开了一种制造用于管理振荡器系统中的热分配的装置的系统和方法。 在一个示例性实施例中，该装置包括被配置为提供周期性信号的谐振器，耦合到谐振器的电路，被配置为补偿由温度变化引起的周期性信号的变化，并且还包括被配置为产生热量的热源 谐振器和电路。 谐振器，电路和热源中的至少一个嵌入在衬底中，并且谐振器，电路和热源被布置成加热谐振器和电路基本上相同的量。

公开(公告)号：US08053953B2

公开(公告)日：2011-11-08

申请号：US12514278

申请日：2007-11-08

Applicant: Hiroaki Yamada

Inventor： Hiroaki Yamada

IPC: H01L41/053

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αk of the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.

Abstract translation: 通过焊接表面安装在布线板上的电子部件，其中抑制了表面安装后的焊料中出现裂缝的电子部件可以包括：构成容器的至少一部分并由陶瓷制成的部件; 以及设置在构件的外表面上并用于通过焊料将电子部件表面安装在布线板上的外部端子。 构成外部端子的层的膜厚被设计成当构成构件的陶瓷的热膨胀系数为α1时，构件和外部端子的组合膨胀系数αk满足1.029＆lt; 1lE;αk/α1＆nlE的关系; 1.216。 外部端子优选地包括作为电极体的镍层。

公开(公告)号：US07737796B2

公开(公告)日：2010-06-15

申请号：US12009406

申请日：2008-01-18

Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

IPC: H03L1/04

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 公开了一种用于高稳定性的恒温型引线引出型晶体振荡器，其包括向多个引线从其引出的晶体谐振器供热，以保持温度恒定的供热体。 供热体包括：导热板，其具有用于引线的通孔并且安装在电路板上，并且面向并直接热连接到晶体谐振器和用于加热的片状电阻器 电路板与导热板相邻，并且热连接到导热板。

公开(公告)号：US20100060108A1

公开(公告)日：2010-03-11

申请号：US12514278

申请日：2007-11-08

Applicant: Hiroaki Yamada

Inventor： Hiroaki Yamada

IPC: H01L41/053

CPC classification number: H05K3/3442 ,  B81B7/0051 ,  B81B2207/07 ,  H01L23/49838 ,  H01L2224/16225 ,  H03H9/02102 ,  H03H9/02133 ,  H03H9/1021 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10909 ,  Y02P70/613

Abstract: An electronic component, which is surface-mounted on a wiring board by soldering, and in which the occurrence of cracks in the solder after surface-mounting is suppressed, may include: a member constituting at least part of a container and made of ceramic; and an external terminal provided on the outer surface of the member and used in surface-mounting the electronic component on the wiring board by solder. The film thickness of a layer constituting the external terminal is designed so that when the thermal expansion coefficient of the ceramic constituting the member is α1, combined expansion coefficient αk of the member and the external terminal satisfies a relation of 1.029≦αk/α1≦1.216. The external terminal preferably comprises a nickel layer as an electrode body.

Abstract translation: 通过焊接表面安装在布线板上的电子部件，其中抑制了表面安装后的焊料的裂纹的发生，可以包括：构成容器的至少一部分并由陶瓷制成的部件; 以及设置在构件的外表面上并用于通过焊料将电子部件表面安装在布线板上的外部端子。 构成外部端子的层的膜厚被设计成当构成构件的陶瓷的热膨胀系数为α1时，构件和外部端子的组合膨胀系数αk满足1.029＆lt; 1lE;αk/α1＆nlE的关系; 1.216。 外部端子优选地包括作为电极体的镍层。

公开(公告)号：US20090236134A1

公开(公告)日：2009-09-24

申请号：US12381692

申请日：2009-03-16

Applicant: Thomas A. Knecht ,  Glen Reeser

Inventor： Thomas A. Knecht ,  Glen Reeser

IPC: H05K1/16

CPC classification number: H05K1/0243 ,  H01P7/082 ,  H01P7/084 ,  H05K3/3436 ,  H05K2201/10068

Abstract: A ball grid array resonator for use as, for example, a high “Q” inductive element in the tank circuit of a voltage controlled oscillator. The resonator comprises a ceramic substrate including opposed top and bottom surfaces, each having a continuous strip of conductive material formed thereon and, in one embodiment, at least two conductive vias which extend through the substrate and electrically interconnect the respective strips of conductive material to define a continuous and elongate path or transmission line for an RF signal. The respective strips of conductive material may be spiral-shaped, hook-shaped, serpentine-shaped, or otherwise suitably shaped depending upon the desired application. Conductive balls/spheres on the bottom surface define RF signal input/output pads and ground pads adapted for electrical connection to the printed circuit board or substrate of, for example, a voltage controlled oscillator.

Abstract translation: 一种球栅阵列谐振器，用作例如压控振荡器的电路中的高“Q”电感元件。 谐振器包括陶瓷衬底，其包括相对的顶表面和底表面，每个陶瓷衬底具有在其上形成的导电材料的连续条带，并且在一个实施例中，至少两个导电通孔延伸穿过衬底并电连接导电材料的各条带以限定 用于RF信号的连续且细长的路径或传输线。 相应的导电材料条可以是螺旋形的，钩形的，蛇形的，或者根据所需的应用适当地成形。 底表面上的导电球/球体限定RF信号输入/输出焊盘和适于与例如压控振荡器的印刷电路板或基板电连接的接地焊盘。