公开(公告)号：US20190222211A1

公开(公告)日：2019-07-18

申请号：US16246855

申请日：2019-01-14

Applicant: MH GoPower Company Limited

Inventor： Mei-huan Yang ,  Cheng-liang Wu ,  Remigio Perales ,  Kun-hsien Chen ,  Wei-sheng Chao ,  Ying-lin Tseng ,  I-tsung Chen

IPC: H03K17/785 ,  H01L31/0687 ,  H03K17/78 ,  H01L31/16 ,  H05K1/18 ,  H05K1/14

CPC classification number: H03K17/785 ,  H01L31/0687 ,  H01L31/16 ,  H03K17/78 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: This disclosure presents a power switching module combining a novel gate driver with a photonic isolated power source which can output a high voltage and high power at the same time, and thus can drive a power semiconductor device. The disclosed power switching module could simplify the switched mode power supply structure to (1) replace the isolated power supply module; (2) simplify circuitry of the gate driver by integrating gate driver signaling opto-electronics; and (3) provide a module with power semiconductor device under switched mode power supply structure.

公开(公告)号：US20190215946A1

公开(公告)日：2019-07-11

申请号：US15880553

申请日：2018-01-26

Applicant: Tung-Yi Wu

Inventor： Tung-Yi Wu

IPC: H05K1/02 ,  H05K7/20 ,  F28F13/06

CPC classification number: H05K1/0203 ,  F28F13/06 ,  H05K7/20 ,  H05K7/20509 ,  H05K2201/10159 ,  H05K2201/10393 ,  H05K2201/10522

Abstract: A memory heat dissipation unit is disclosed. The memory heat dissipation unit includes a main body having a first portion, a second portion and a connection portion having two lateral edges separately connected to the first and the second portion. The first and the second portion have at least one first heat-receiving section and at least one second heat-receiving section formed thereon, respectively; and the first and the second heat-receiving section are correspondingly in contact with at least one memory chip each to exchange heat with the chips and accordingly cool the same.

公开(公告)号：US20190200422A1

公开(公告)日：2019-06-27

申请号：US16286666

申请日：2019-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-min KIM ,  Ho-seong SHIN ,  Kyoung-hwan JANG

IPC: H05B33/04 ,  H05B33/10 ,  H05K3/00 ,  H05B33/12 ,  H05K3/28

CPC classification number: H05B33/04 ,  H05B33/10 ,  H05B33/12 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/007 ,  H05K3/284 ,  H05K3/288 ,  H05K2201/09018 ,  H05K2201/09145 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

公开(公告)号：US20190191550A1

公开(公告)日：2019-06-20

申请号：US16326538

申请日：2017-05-10

Applicant: SANYO Electric Co., Ltd.

Inventor： Hideyuki Sasao ,  Takashi Imasato

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/18 ,  H03K17/687 ,  B60R16/03

CPC classification number: H05K1/0263 ,  B60R16/03 ,  H02G3/16 ,  H03K17/687 ,  H05K1/02 ,  H05K1/181 ,  H05K3/34 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: Bus bars are soldered to a wiring pattern of a printed board to which the bus bars are connected, and the bus bars ate screwed to the printed board. Tips of bolts passing through holes in the bus bars and holes in the punted board may be tightened using nuts. The holes in the printed board may be electrically connected to the wiring pattern.

公开(公告)号：US20180367055A1

公开(公告)日：2018-12-20

申请号：US15963267

申请日：2018-04-26

Applicant: Mitsubishi Electric Corporation

Inventor： Yasuhiko KITAMURA ,  Hiroaki TAKAHASHI ,  Shozo KANZAKI ,  Toshiyuki YASUTOMI

IPC: H02M7/00 ,  H02P27/06 ,  H05K1/18 ,  H05K1/11 ,  H01G9/15 ,  H01G11/04 ,  H01G9/26 ,  H01G11/10 ,  H01G9/028 ,  H01G9/045 ,  H01G11/30 ,  H01G11/78 ,  H05K1/02 ,  H01G11/18 ,  H01G9/00 ,  H02M1/14

CPC classification number: H02M7/003 ,  H01G9/0003 ,  H01G9/028 ,  H01G9/045 ,  H01G9/15 ,  H01G9/26 ,  H01G11/04 ,  H01G11/10 ,  H01G11/18 ,  H01G11/30 ,  H01G11/78 ,  H02M1/14 ,  H02M7/5387 ,  H02P27/06 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/1009 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: To downsize a power smoothing capacitor substrate unit for opening/closing modules configured to convert a low-voltage DC power to AC power to drive a three-phase AC motor. A plurality of unit capacitors (101) being a conductive polymer aluminum electrolytic capacitor are connected between a positive-side first conductive plate (10P0) connected to a positive-side power supply terminal (125P) and a negative-side second conductive plate (10N) connected to a negative-side power supply terminal (124N), and three or more capacitor rows are arranged for each of three pairs of divided power supply terminal blocks (130B) connected to the opening/closing modules (90B) and one or more capacitor rows are arranged between the terminal blocks. Accordingly, ripple currents in a large number of capacitors connected in parallel to each other are equalized to prevent a temperature increase in each capacitor.

公开(公告)号：US20180331081A1

公开(公告)日：2018-11-15

申请号：US15777458

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Eng Huat Goh ,  Wee Hoe ,  Khang Choong Yong ,  Ping Ping Ooi

IPC: H01L25/16 ,  H01L25/18 ,  H05K1/18 ,  H01L23/538 ,  H01L25/00 ,  H05K3/30 ,  H05K1/14

CPC classification number: H01L25/16 ,  H01L23/48 ,  H01L23/5386 ,  H01L25/065 ,  H01L25/18 ,  H01L25/50 ,  H01L2924/1432 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19042 ,  H01L2924/19106 ,  H05K1/144 ,  H05K1/147 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2201/10356 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734

Abstract: Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180320832A1

公开(公告)日：2018-11-08

申请号：US15973922

申请日：2018-05-08

Applicant: LEDVANCE GmbH

Inventor： Bernhard Rieder ,  Christoph Strauss ,  Florian Wagner ,  Xiongqiang He

IPC: F21K9/278 ,  H05K1/18

CPC classification number: F21K9/278 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2201/10651

Abstract: A light engine for a tube lamp has a substrate defining a longitudinal direction, having at least three conductive traces extending in the longitudinal direction. At least two of the conductive traces are divided into a plurality of trace sections. The light engine further includes a plurality of semiconductor light emitting elements, each light emitting element having two electric terminals and being arranged perpendicular to the longitudinal direction and electrically connected with a first electric terminal to one of the conductive traces and with a second electric terminal to another one of the conductive traces.

公开(公告)号：US20180317321A1

公开(公告)日：2018-11-01

申请号：US15904577

申请日：2018-02-26

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kenichi MORI ,  Kazuyuki KUBOTA ,  Yoshihiro IHARA

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/11 ,  H01R12/72

CPC classification number: H05K1/144 ,  H01R12/721 ,  H01R12/725 ,  H01R12/728 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/10522

Abstract: A circuit board module is electrically connectable to a socket by inserting one end part thereof into the socket, and includes a circuit board and a terminal board having a first surface provided with a column of socket-connection pads and mounted on the surface of the circuit board at the one end part. The terminal board includes first, second, and third pad columns provided on a second surface of the terminal board opposite to the first surface. The circuit board includes fourth, fifth, and sixth pad columns respectively provided on the surface of the circuit board opposing the second surface of the terminal board, at positions opposing the first, second, and third pad columns of the terminal board, respectively.

公开(公告)号：US20180317316A1

公开(公告)日：2018-11-01

申请号：US15968171

申请日：2018-05-01

Applicant: Octavo Systems LLC

Inventor： Erik James Welsh ,  Peter Linder

IPC: H05K1/02 ,  G06F17/50 ,  H01L25/16 ,  H05K1/18

CPC classification number: H05K1/0231 ,  G06F17/5063 ,  G06F17/5072 ,  H01L25/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10522

Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.

公开(公告)号：US20180310409A1

公开(公告)日：2018-10-25

申请号：US15841324

申请日：2017-12-14

Applicant: BOSJOB COMPANY LTD.

Inventor： Liang-huan WENG ,  Min-hsiang WENG

IPC: H05K1/18 ,  H05K1/14 ,  H05K1/02 ,  B23K9/10

CPC classification number: H05K1/18 ,  B23K9/1006 ,  H05K1/0263 ,  H05K1/144 ,  H05K2201/09227 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10522 ,  H05K2201/10651 ,  H05K2201/10901

Abstract: A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.