公开(公告)号：US20180083253A1

公开(公告)日：2018-03-22

申请号：US15814136

申请日：2017-11-15

Applicant: Johnson Controls Technology Company

Inventor： Ronald J. Dulle

IPC: H01M2/22 ,  H05K3/32 ,  H01M10/6551 ,  H02J7/00 ,  H01M10/48 ,  H01M10/42 ,  H01M10/058 ,  H01M10/04 ,  H01M2/34 ,  H01M2/30 ,  H01M2/24 ,  H01M2/20 ,  H01M2/12 ,  H01M2/10 ,  H01H47/32 ,  G01R31/36 ,  B60R16/033 ,  B60R16/03 ,  B60L15/20 ,  B60L11/18 ,  B60L11/14 ,  B60L11/12 ,  B60L3/12 ,  B60L3/00 ,  B60L1/14 ,  B60L1/02 ,  B60L1/00 ,  H05K1/18 ,  H05K1/02 ,  H02H7/18 ,  H01R12/71 ,  H01M4/66 ,  H01M2/32 ,  G01R31/02

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L15/20 ,  B60L50/16 ,  B60L50/51 ,  B60L50/61 ,  B60L50/64 ,  B60L50/66 ,  B60L58/12 ,  B60L58/21 ,  B60L58/26 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/3835 ,  G01R31/385 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7011 ,  Y02T10/7016 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module may include a housing, a plurality of battery cells disposed in the housing, a battery terminal extending from the battery module for coupling the battery module with electrical components in the vehicle, and a contactor. A voltage supplied to a relay coil in the contactor may generate a magnetic field to actuate a contactor switch. The battery module may also include a printed circuit board (PCB) disposed in the housing. The PCB may include a relay control circuit configured to control a current flowing across the relay coil, and the relay control circuit may operate in a pull-in mode to transition the contactor switch into a closed position and in a hold mode to maintain the contactor switch in the closed position.

公开(公告)号：US20180063940A1

公开(公告)日：2018-03-01

申请号：US15410081

申请日：2017-01-19

Applicant: Qorvo US, Inc.

Inventor： Tarak A. Railkar ,  Kevin J. Anderson ,  Walid M. Meliane

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L25/00 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

公开(公告)号：US20180049311A1

公开(公告)日：2018-02-15

申请号：US15713705

申请日：2017-09-25

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/40 ,  H05K9/00 ,  H05K1/14 ,  H05K3/36 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H01L21/481 ,  H01L21/4817 ,  H01L21/4867 ,  H01L23/295 ,  H01L23/49811 ,  H01L23/5386 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/112 ,  H01L25/16 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/131 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15322 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K3/341 ,  H05K3/368 ,  H05K3/4038 ,  H05K9/0024 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10287 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Vertical shielding and interconnect structures for system-in-a-package modules, where the vertical shielding and interconnect structures are readily manufactured and are space efficient.

公开(公告)号：US20180048255A1

公开(公告)日：2018-02-15

申请号：US15790561

申请日：2017-10-23

Applicant: LCDRIVES CORP.

Inventor： Russel Hugh Marvin ,  David H. Leach

IPC: H02P27/06 ,  H05K1/02 ,  H02M7/00 ,  H05K1/18 ,  H03K17/16 ,  H02P29/02

CPC classification number: H02P27/06 ,  H02M7/003 ,  H02M2007/4835 ,  H02P27/14 ,  H02P29/02 ,  H03K17/161 ,  H05K1/0204 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: One example includes a half-bridge switching circuit system. The system includes a first plurality of switches arranged between a first rail voltage and an output on which an output voltage is provided and a second plurality of switches arranged between a second rail voltage and the output, the first and second pluralities of switches being controlled via a plurality of switching signals. The system also includes a plurality of flying capacitors arranged to interconnect the first and second pluralities of switches, and further includes a plurality of snubber circuits that are each arranged in parallel with a respective one of the plurality of flying capacitors, the first plurality of switches, and the second plurality of switches.

公开(公告)号：US20180027655A1

公开(公告)日：2018-01-25

申请号：US15215412

申请日：2016-07-20

Applicant: Infineon Technologies AG

Inventor： Philip Georg Brockerhoff ,  Tilo Weide

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K3/306 ,  H05K1/182 ,  H05K3/325 ,  H05K2201/09709 ,  H05K2201/10545 ,  H05K2201/1059

Abstract: A method for mounting components on a printed circuit board comprising the following steps: Arranging a first component on a first surface of the printed circuit board and a second component on a second surface of the printed circuit board, wherein the first component occupies a laterally overlapping position with the second component; and applying a first force to the first component for mounting it on the printed circuit board and/or applying a second force to the second component for mounting it on the printed circuit board. Further, a printed circuit board is suggested.

公开(公告)号：US20180012879A1

公开(公告)日：2018-01-11

申请号：US15205702

申请日：2016-07-08

Applicant: Cisco Technology, Inc.

Inventor： Paul L. Mantiply ,  Straty Argyrakis

IPC: H01L25/18 ,  H05K1/18 ,  H01L23/538 ,  H05K3/34 ,  H01L25/00 ,  H01L23/367 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L25/16 ,  H01L25/50 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/1427 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102 ,  H02M3/158 ,  H05K1/0204 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

公开(公告)号：US09831482B2

公开(公告)日：2017-11-28

申请号：US14231246

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Mikhail S. Balk ,  Richard M. DeKeuster ,  Stephen D. Cash

IPC: H01M2/10 ,  H01M2/22 ,  B60R16/03 ,  H02J7/00 ,  G01R31/36 ,  H01M10/04 ,  H01M10/058 ,  H01M2/12 ,  H01M2/24 ,  H01M2/20 ,  H01M2/34 ,  H01H47/32 ,  H01M10/48 ,  H05K1/18 ,  H05K3/32 ,  B60L11/18 ,  H01M2/30 ,  H01M10/6551 ,  B60L1/00 ,  B60L1/02 ,  B60L1/14 ,  B60L3/00 ,  B60L3/12 ,  B60L11/12 ,  B60L11/14 ,  B60L15/20 ,  B60R16/033 ,  H01M10/42 ,  H01R12/71 ,  H05K1/02 ,  H02H7/18 ,  G01R31/02 ,  H01M2/32 ,  H01M4/66

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A system includes a lid disposed over battery cells in a battery module. The lid includes flexible fingers, and each of the flexible fingers aligns with a corresponding one of the battery cells. Each of the flexible fingers is configured to exert a downward force against the corresponding one of the battery cells, and the flexible fingers are configured to accommodate varying heights of the battery cells.

公开(公告)号：US09831035B2

公开(公告)日：2017-11-28

申请号：US14529337

申请日：2014-10-31

Applicant: Deere & Company

Inventor： Christopher J. Schmit ,  Neal D. Clements ,  Andrew D. Wieland

IPC: H01G2/08 ,  H01G4/32 ,  H01G4/38 ,  H01G4/228 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G2/08 ,  H01G4/228 ,  H01G4/32 ,  H01G4/38 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2201/10651

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

公开(公告)号：US09826623B2

公开(公告)日：2017-11-21

申请号：US14893255

申请日：2013-12-12

Applicant: KANEKA CORPORATION

Inventor： Aki Koukami ,  Kazuo Hagiwara ,  Keisuke Oguma ,  Kazuhide Fujimoto

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/29 ,  H01L23/373 ,  H05K3/28 ,  H05K1/18 ,  H01L23/31

CPC classification number: H05K1/0209 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3737 ,  H01L2924/0002 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/06 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2203/1327 ,  H01L2924/00

Abstract: A heat dissipation structure including: a printed circuit board; a first heat-generating element; a second heat-generating element; and a cured product of a thermally conductive curable liquid resin composition, the printed circuit board having a first surface and a second surface that is opposite to the first surface, the first heat-generating element being placed on the first surface, the second heat-generating element being placed on the second surface, the first heat-generating element generating an equal or greater amount of heat than the second heat-generating element, the second heat-generating element being surrounded by the cured product, the first heat-generating element being surrounded by a layer that has a lower thermal conductivity than the cured product.

公开(公告)号：US20170301474A1

公开(公告)日：2017-10-19

申请号：US15485126

申请日：2017-04-11

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Kenji SAITO

IPC: H01G4/38 ,  H01G4/228 ,  H01G4/30 ,  H05K1/18

CPC classification number: H05K1/181 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H05K2201/09236 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: In an embodiment, with a capacitor mounting structure 200, series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that signals flow through them in the opposite directions, respectively. In addition, the series-connected first multilayer capacitor 211 and second multilayer capacitor 212 are placed in such a way that their respective internal electrode layers 211c, 212c face each other. The capacitor mounting structure can prevent the overall ESL value from increasing even when multilayer capacitors are connected in series.