公开(公告)号：US20050239347A1

公开(公告)日：2005-10-27

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

Inventor： Bruce Chamberlin ,  Mark Hoffmeyer ,  Wai Ma ,  Arch Nuttall ,  James Stack

IPC: H01R12/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20040216919A1

公开(公告)日：2004-11-04

申请号：US10860427

申请日：2004-06-03

Applicant: International Business Machines Corporation

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H05K007/06

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

公开(公告)号：US20040192084A1

公开(公告)日：2004-09-30

申请号：US10404877

申请日：2003-03-31

Inventor： Karl T. Fronk

IPC: H01R012/00

CPC classification number: H01R12/523 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1432 ,  H05K2201/10303 ,  H05K2201/10871

Abstract: The present invention provides a terminal pin for connecting a DC-DC power converter module or the like to a PCB. The pin has improved current carrying capabilities by having a diameter over most of its length that is larger than the ends that are connected to either the module or PCB. The larger diameter also provides for improved heat flow from the power converter module to the PCB. A smaller diameter portion near the PCB board provides for improved flow of solder between the pin and the PCB. A stand-off member is also provided to maintain the module and PCB at a predetermined stand-off distance.

Abstract translation: 本发明提供一种用于将DC-DC电力转换器模块等连接到PCB的端子引脚。 该引脚通过具有大于其大部分长度的直径大于连接到模块或PCB的端部而具有改善的载流能力。 较大的直径还提供了从功率转换器模块到PCB的改进的热流。 PCB板附近的较小直径的部分提供了在引脚和PCB之间改善的焊料流动。 还提供了一个支撑构件以将模块和PCB保持在预定的间隔距离。

公开(公告)号：US06784377B2

公开(公告)日：2004-08-31

申请号：US10205102

申请日：2002-07-25

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R1204

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US06545890B2

公开(公告)日：2003-04-08

申请号：US09740707

申请日：2000-12-19

Applicant: Lennart Pitzele

Inventor： Lennart Pitzele

IPC: H02M100

CPC classification number: H05K7/142 ,  H01R12/58 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US20020179324A1

公开(公告)日：2002-12-05

申请号：US10205102

申请日：2002-07-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H05K001/03

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20020146921A1

公开(公告)日：2002-10-10

申请号：US09828773

申请日：2001-04-09

Inventor： Qun Lu ,  Dayu Qu ,  Alan J. Eaton ,  Bryant E. Palmer

IPC: H05K001/00

CPC classification number: H01R12/58 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10871

Abstract: A pin connector system includes a pin portion having a first cross-sectional geometry, wherein the pin portion passes through a pin passage in a first printed circuit board. The pin passage has a second cross-sectional geometry, wherein the combination of the first and second cross-sectional geometries forms a first solder passage for allowing solder to flow through the first printed circuit board.

Abstract translation: 针连接器系统包括具有第一横截面几何形状的销部分，其中销部分穿过第一印刷电路板中的销通道。 销通道具有第二横截面几何形状，其中第一和第二横截面几何形状的组合形成第一焊料通道，以允许焊料流过第一印刷电路板。

公开(公告)号：US6011693A

公开(公告)日：2000-01-04

申请号：US977247

申请日：1997-11-24

Applicant: John G. Gore

Inventor： John G. Gore

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/28 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L41/053

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K3/303 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3447 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/3025 ,  H05K1/0271 ,  H05K2201/049 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09181 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2203/041 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

Abstract: A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion of the bottom layer which carry a plurality of solder pads. The surface mount package is positioned on the printed circuit board for placing the package bottom surface on a top surface of the printed circuit board between the cavities while positioning package contact pads in spaced relation above corresponding preselected solder pads. A solder column extends between each of the plurality of corresponding solder pads and the selected contact pads for providing an electrical connection. The solder column is formed by applying a solder paste to the solder pads on the printed circuit board, screening a low temperature solder paste onto each of the contact pads of the surface mount package, placing a solder ball onto each pad, and attaching the solder ball to each of the contact pads of the package by passing the package through a reflow oven for reflowing the low temperature solder paste without reflowing the high temperature solder ball.

Abstract translation: 用于将诸如无引线陶瓷芯片载体的表面贴装封装安装在印刷电路板上的表面安装应力消除系统包括具有连接到底层的顶层的印刷电路板。 顶层包括用于暴露底层的顶表面部分的空腔，其承载多个焊盘。 表面安装封装位于印刷电路板上，用于将封装底表面放置在印刷电路板的上表面之间，同时将封装接触焊盘定位在相应的预选焊盘上方。 焊料柱在多个对应的焊盘和所选择的接触焊盘中的每一个之间延伸以提供电连接。 焊料柱通过将焊膏涂布到印刷电路板上的焊盘上而形成，将低温焊膏筛选到表面贴装封装的每个接触焊盘上，将焊球放置在每个焊盘上，并将焊料 通过使包装通过回流炉以回流低温焊膏而不回流高温焊球，从而将其包裹到每个接触焊盘。

公开(公告)号：US5936593A

公开(公告)日：1999-08-10

申请号：US708401

申请日：1996-09-04

Applicant: Harufumi Mandai ,  Kenji Asakura ,  Teruhisa Tsuru ,  Seiji Kanba

Inventor： Harufumi Mandai ,  Kenji Asakura ,  Teruhisa Tsuru ,  Seiji Kanba

IPC: H01Q1/02 ,  H01Q1/12 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/30 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01Q1/40 ,  H01Q1/362 ,  H01Q1/38 ,  H05K1/18 ,  H05K2201/10651 ,  H05K2201/10871 ,  H05K3/308 ,  H05K3/3421

Abstract: An antenna apparatus which exhibits excellent mechanical strength and which is protected from heat and moisture, and also which is mountable on a printed wiring board with the provision of a clearance between the apparatus and the board, free from deformation caused by a warp of the board. The antenna apparatus has a rectangular-prism shaped substrate. A feeding terminal and a fixing terminal are disposed at the respective end surfaces in the longitudinal direction of the substrate. Metal strips serving as support terminals are soldered at the respective first ends to the feeding terminal and the fixing terminal, respectively. A coating material formed of a non-metallic material, such as glass, resin or the like, is applied to the surface of the substrate by way of coating, dipping or other method. A coating layer is thus formed on the substrate in a state in which the respective second ends of the metal strips project from the substrate.

Abstract translation: 具有优异的机械强度并且受到热和湿气的保护的天线装置，并且还可以在设备和板之间设置间隙安装在印刷线路板上，不受板的翘曲引起的变形 。 天线装置具有矩形棱柱形基板。 馈电端子和固定端子设置在基板的纵向方向上的相应端面处。 用作支撑端子的金属带分别在相应的第一端处焊接到馈电端子和固定端子。 由诸如玻璃，树脂等的非金属材料形成的涂料通过涂布，浸渍或其它方法施加到基材的表面。 因此，在金属带的各个第二端从基板突出的状态下，在基板上形成涂层。

公开(公告)号：US5557508A

公开(公告)日：1996-09-17

申请号：US160186

申请日：1993-12-02

Applicant: Teruhiro Sato ,  Tomio Wada ,  Yoshiyuki Hirayama

Inventor： Teruhiro Sato ,  Tomio Wada ,  Yoshiyuki Hirayama

IPC: H05K5/04 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0049 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/10371 ,  H05K2201/10871 ,  H05K2201/10924 ,  Y10S174/34 ,  Y10T29/49128

Abstract: Single flat metal sheet blank in which thin metallic parts including side frames which are to form side walls, a shield plate and external lead and the like are connected together in a developed state in positional relationships necessary for the assembly of the high-density circuit module. A circuit board is then placed on one side of the shield plate of the flat metal sheet blank. Terminals having pedestals are formed on the shield plate. The terminals are inserted into holes formed in the circuit board and connected to conductors on the circuit board. Then, operations such as severance or bending are effected on selected connecting portions at which the thin metallic parts arranged in developed state are inter-connected, and required processings are executed on the portions to be jointed, whereby the circuit module is completed. According to this production method, a space for receiving circuit components is formed between the circuit board and the shield plate, so that both sides of the circuit board can be used for mounting the circuit components, whereby a high packaging density is attained.

Abstract translation: 单层扁平金属板坯料，其中包括形成侧壁的侧框架的薄金属部件，屏蔽板和外部引线等在显影状态下以高密度电路模块组装所需的位置关系连接在一起 。 然后将电路板放置在平板金属板坯的屏蔽板的一侧上。 具有基座的端子形成在屏蔽板上。 将端子插入形成在电路板中的孔中并连接到电路板上的导体。 然后，在选择的连接部分进行诸如切断或弯曲的操作，其中布置成展开状态的薄金属部件相互连接，并且在待连接部分上执行所需的处理，从而完成电路模块。 根据该制造方法，在电路基板和屏蔽板之间形成有用于接收电路部件的空间，从而电路板的两侧可用于安装电路部件，从而获得高的封装密度。