Powder Coating Process and Facility
    25.
    发明公开

    公开(公告)号:US20240238838A1

    公开(公告)日:2024-07-18

    申请号:US18290067

    申请日:2022-05-11

    CPC classification number: B05D1/06 B05D3/0254 B05D7/02 B05D2201/00 B05D2401/32

    Abstract: Process of powder coating a substrate (1) having at least one part of reduced thickness (5, 6), such as a raised edge. After application of a powder coating material, the substrate is heat cured. During heat curing, the substrate is locally shielded from the heat source (18) at the position of the part of reduced thickness, e.g., by means of a heat shield (2). The heat shield can for example be a perforated plate. Powder coating facility comprising an overhead conveyer with a plurality of jigs (3) for supporting such heat shields.

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