公开(公告)号：US20170234511A1

公开(公告)日：2017-08-17

申请号：US15582629

申请日：2017-04-29

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: F21V19/00 ,  F21V23/00 ,  A41D27/20 ,  A43B3/00 ,  A41D27/08 ,  H05K1/18 ,  F21V23/04

CPC classification number: F21V19/002 ,  A41D1/005 ,  A41D27/085 ,  A41D27/205 ,  A43B1/0072 ,  A43B3/001 ,  A43B3/0031 ,  A43B3/242 ,  A43B23/24 ,  F21V23/003 ,  F21V23/04 ,  F21Y2115/10 ,  H05K1/181 ,  H05K2201/10037 ,  H05K2201/10106

Abstract: A lighting unit is removably inserted into a pocket to create a light effect through use of a light effect material. The lighting unit has a PCB with a first side to which one or more LEDs and a battery are mounted. A clear potting material encloses the PCB, LEDs, and the battery and creates a transparent space proximate an inner surface of the light effect material which maintains the light effect material at a preselected distance from the LEDs so that light emitted from each light emitting die is dispersed by a plurality of dispersive elements in the light effect materials to create the light material viewing effect.

公开(公告)号：US20170170526A1

公开(公告)日：2017-06-15

申请号：US15358150

申请日：2016-11-22

Applicant: Xiaomi Inc.

Inventor： Zongqiang WANG ,  Xianmin ZHANG ,  Shasha SHI

IPC: H01M10/42 ,  B23K26/21 ,  C09J9/02 ,  C09J7/00 ,  C09J5/00 ,  H01M10/44 ,  H01M10/04

CPC classification number: H01M10/425 ,  B23K26/21 ,  C09J5/00 ,  C09J7/00 ,  C09J9/02 ,  C09J2201/602 ,  C09J2203/33 ,  H01M2/021 ,  H01M2/30 ,  H01M2/34 ,  H01M10/04 ,  H01M10/443 ,  H01M2220/20 ,  H01M2220/30 ,  H05K1/117 ,  H05K1/181 ,  H05K3/321 ,  H05K3/325 ,  H05K3/3442 ,  H05K2201/10037 ,  H05K2201/10181 ,  H05K2201/10409

Abstract: Disclosed are a protective main board for a battery cell, an electronic terminal and a method for assembling a battery cell of an electronic terminal. The protective main board for a battery cell includes a main board body and a conducting component. The main board body includes a main board circuit and a protection circuit configured to protect the battery cell, and the protection circuit is connected with the main board circuit. The conducting component is arranged on the main board body, and includes a first conducting member and a second conducting member, and the battery cell is electrically connected with the protection circuit through the first conducting member and the second conducting member respectively.

公开(公告)号：US20170135226A1

公开(公告)日：2017-05-11

申请号：US14981961

申请日：2015-12-29

Applicant: FUJIAN JOY SOLAR TECHNOLOGY CORPORATION

Inventor： Guangyan Chen

IPC: H05K3/30 ,  F21S9/03 ,  H05K3/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/34 ,  F21S9/037 ,  F21Y2101/00 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/301 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10106 ,  H05K2201/10143 ,  H05K2201/10628 ,  H05K2201/10651 ,  H05K2203/0228 ,  H05K2203/04 ,  Y02P70/613

Abstract: A PCB adaptation for a solar lamp, characterized in that, at least one slot is set on the PCB, both sides of the slot comprises a pad, the pad connects to an inner circuit on the PCB, two leads of a leaded component is respectively soldered to the pad which is located on the both skies of the slot. By cutting a slot on the PCB in the present invention, auto surface-mount technology can be implemented to automatically solder the leaded component to the PCB. Low-cost leaded component and surface-mount technology are used in above technical solution, which can decrease the cost and increase the productivity and product quality.

公开(公告)号：US20170134870A1

公开(公告)日：2017-05-11

申请号：US15413176

申请日：2017-01-23

Applicant: Michael Helgeson ,  Jeffrey Paul Solum ,  David Tourtelotte ,  Beau Jay Polinske

Inventor： Michael Helgeson ,  Jeffrey Paul Solum ,  David Tourtelotte ,  Beau Jay Polinske

IPC: H04R25/00

CPC classification number: H04R25/65 ,  H04R25/602 ,  H04R25/608 ,  H04R2225/51 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10037

Abstract: A heating assistance device for a user comprising a housing, a three dimensional electronic substrate disposed in the housing, the substrate adapted to conform to a battery of the hearing assistance device and hearing assistance electronics mounted to the substrate. Various embodiments include a flexible antenna configured to conform around a portion of the substrate, and spring loaded electrical contacts on the substrate, the contacts configured to mechanically engage and electrically connect to the flexible antenna.

公开(公告)号：US20170133725A1

公开(公告)日：2017-05-11

申请号：US15321740

申请日：2015-06-01

Applicant: Robert Bosch GmbH

Inventor： Emilia Schwindt ,  Carsten Mueller ,  Stefan Baumann ,  Andreas Ruehle

IPC: H01M10/42 ,  H05K1/18 ,  H01M12/06 ,  H01M10/48 ,  H01M10/052

CPC classification number: H01M10/425 ,  H01L2224/48091 ,  H01L2924/19107 ,  H01M10/052 ,  H01M10/482 ,  H01M12/06 ,  H01M2010/4271 ,  H01M2010/4278 ,  H05K1/189 ,  H05K2201/10037 ,  H01L2924/00014

Abstract: Disclosed is a battery module comprising at least one battery cell and a cell monitoring unit which is connected in an electrically conducting manner to a flexible circuit board by at least one bonding wire and/or at least one bonding strip.

公开(公告)号：US09560759B2

公开(公告)日：2017-01-31

申请号：US14876116

申请日：2015-10-06

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tomoharu Fujii

IPC: H05K7/00 ,  H05K1/11 ,  H01L23/34 ,  H05K1/14 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K1/115 ,  A61B2560/0214 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/4608 ,  H05K3/4697 ,  H05K2201/10037 ,  H01L2924/00

Abstract: A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member.

Abstract translation: 封装包括金属芯基板，沿着金属芯基板的第一表面的周边形成的第一绝缘层，金属芯基板的第一表面在第一绝缘层的内侧露出，第二绝缘层 沿着金属芯基板的第二表面的至少周边形成有在金属芯基板的周边的第一部分贯穿第二绝缘层的第一贯通电极和贯穿第一绝缘层的第二贯通电极 所述金属芯基板和所述第二绝缘层在所述金属芯基板的周边的第二部分处，所述第二贯通电极经由绝缘部件与所述金属芯基板电绝缘。

公开(公告)号：US09554461B2

公开(公告)日：2017-01-24

申请号：US14305539

申请日：2014-06-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato

IPC: H05K1/00 ,  H01L23/28 ,  H05K1/02 ,  H04M1/02 ,  H05K1/14

CPC classification number: H05K1/028 ,  H04M1/026 ,  H05K1/0213 ,  H05K1/0228 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/10037

Abstract: A flexible board includes a first sheet section including a first principal surface, a second sheet section including a second principal surface and provided in a different position from the first principal surface in a normal direction to the first principal surface, at least one first bent sheet section configured to connect ends of the first and second sheet sections, the first bent sheet section including a third principal surface not parallel to the first and second principal surfaces, and at least two second bent sheet sections each including a fourth principal surface and provided in different positions from the third principal surface in a normal direction to the third principal surface. The second bent sheet sections are positioned so as to sandwich the first bent sheet section therebetween when viewed in a plan view in the normal direction to the third principal surface.

Abstract translation: 柔性基板包括：第一片段，包括第一主表面，第二片段，包括第二主表面，并且设置在与第一主表面在与第一主表面正交的方向不同的位置;至少一个第一弯曲片 所述第一弯曲片部分包括不平行于所述第一和第二主表面的第三主表面，以及至少两个第二弯曲片部分，每个所述第二弯曲片部分包括第四主表面并且设置在所述第一主表面中 从第三主表面到与第三主表面正交的方向的不同位置。 第二弯曲片部分被定位成当从与第三主表面的法线方向的平面图中观察时将第一弯曲片段夹在其间。

公开(公告)号：US09553342B2

公开(公告)日：2017-01-24

申请号：US14012980

申请日：2013-08-28

Applicant: Samsung SDI Co., Ltd.

Inventor： Kyungjae Shin ,  Kiwoong Kim

IPC: H01M10/48 ,  H01M10/42 ,  H02J7/00 ,  H02J7/04 ,  H05K1/02 ,  G06F1/26 ,  G06F1/16 ,  H05K1/14 ,  H05K1/18 ,  H01M2/10

CPC classification number: H01M10/4257 ,  G06F1/1635 ,  G06F1/26 ,  H01M2/1022 ,  H01M10/4207 ,  H01M10/48 ,  H01M10/486 ,  H01M2200/105 ,  H01M2200/106 ,  H01M2220/30 ,  H02J7/0091 ,  H02J7/047 ,  H05K1/0201 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/10037 ,  H05K2201/10151

Abstract: A battery pack includes a plurality of battery cells; a case accommodating the battery cells; a protective circuit module comprising a circuit board adjacent to the battery cells; a temperature sensitive element on the protective circuit module; and a flexible printed circuit board comprising a conductive pattern layer, wherein the conductive pattern layer is thermally connected to the temperature sensitive element.

Abstract translation: 电池组包括多个电池单元; 容纳电池单元的壳体; 保护电路模块，包括与所述电池单元相邻的电路板; 保护电路模块上的温度敏感元件; 以及包括导电图案层的柔性印刷电路板，其中导电图案层热连接到温度敏感元件。

公开(公告)号：US20160360618A1

公开(公告)日：2016-12-08

申请号：US14778027

申请日：2014-12-26

Applicant: INTEL CORPORATION

Inventor： Adel A. ELSHERBINI ,  Aleksandar ALEKSOV ,  Sasha N. Oster ,  Shawna M. LIFF

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/115 ,  H01L23/58 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/144 ,  H05K1/181 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09609 ,  H05K2201/09636 ,  H05K2201/09963 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10583 ,  H01L2924/00

Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

Abstract translation: 一种装置，包括：基板，包括第一侧和相对的第二侧; 在衬底的第一侧上的至少一个第一电路器件，在衬底的第二侧上的至少一个第二器件; 以及在所述基板的第二侧上的支撑件，所述支撑件包括连接到所述至少一个第一和第二电路装置的互连件，所述支撑件具有可操作以从所述基板限定大于所述至少一个第一和第二电路装置的厚度尺寸的尺寸的厚度尺寸 一秒电路装置。 一种方法，包括在衬底的第一侧上布置至少一个第一电路部件; 在所述基板的第二侧上布置至少一个第二电路部件; 以及将支撑件耦合到所述衬底，所述衬底限定来自所述衬底的尺寸大于所述至少一个第二电路部件的厚度尺寸。

公开(公告)号：US20160345440A1

公开(公告)日：2016-11-24

申请号：US14836875

申请日：2015-08-26

Applicant: HZO, Inc.

Inventor： Vimal Kumar Kasagani ,  Colin LaMar Loose ,  Tyler Christensen Child ,  Caleb Edward Kanavel ,  Heidi L. Popeck ,  Samuel R. Anderson ,  Cameron LaMar Loose ,  Xiaowei Shen

IPC: H05K3/28 ,  H05K3/30 ,  H05K3/36 ,  H05K1/14 ,  B05B15/04 ,  H05K13/00 ,  H04N5/225 ,  B05D1/32 ,  B05D5/00 ,  H05K5/02 ,  H05K5/00

CPC classification number: H05K3/284 ,  B05B12/24 ,  B05B12/26 ,  B05D1/32 ,  B05D5/00 ,  H01L21/56 ,  H04N5/2257 ,  H05K1/148 ,  H05K3/0079 ,  H05K3/28 ,  H05K3/285 ,  H05K3/288 ,  H05K3/30 ,  H05K3/36 ,  H05K3/361 ,  H05K5/0017 ,  H05K5/0026 ,  H05K5/0286 ,  H05K13/00 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1383

Abstract: Processes for masking electronic devices, including, but not limited to, electronic subassemblies, prior to the application of protective coatings to the electronic devices are disclosed. Such processes include the use of a plurality of different masking techniques in combination to mask the electronic device. Different masking techniques may be used to mask different features and/or components of the electronic device. Some features and/or components may be masked by way of two or more masking techniques. With one or more masks in place, an electronic device may be protectively coated. After a protective coating has been applied to the electronic device, at least a portion of the mask(s) may be removed from the electronic device. Protectively coated electronic devices may then be assembled with one another.

Abstract translation: 公开了在向电子设备施加保护涂层之前掩蔽电子设备的方法，包括但不限于电子组件。 这样的处理包括组合使用多种不同的掩蔽技术来掩蔽电子设备。 可以使用不同的掩蔽技术来掩蔽电子设备的不同特征和/或组件。 一些特征和/或组件可以通过两种或多种掩蔽技术来掩蔽。 使用一个或多个掩模就位，电子设备可以被保护地涂覆。 在对电子设备施加了保护涂层之后，可以从电子设备移除至少一部分掩模。 然后可以将保护性涂覆的电子设备彼此组装。