公开(公告)号：US20080100402A1

公开(公告)日：2008-05-01

申请号：US11977276

申请日：2007-10-24

Applicant: Alexandre Rogozine

Inventor： Alexandre Rogozine

IPC: H01P1/205

CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

Abstract: A resonator/filter adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material including at least one resonator through-hole extending therethrough and respective top, bottom and side surfaces defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments electrically interconnect the first and second conductive regions.

Abstract translation: 适用于直接表面安装到印刷电路板表面的谐振器/滤波器。 谐振器/滤波器包括介电材料块，其包括延伸穿过其中的至少一个谐振器通孔以及限定用导电材料覆盖的介电材料的相应区域的相应顶部，底部和侧面。 顶部块表面限定至少第一导电区域。 块的底表面上的第二导电区域限定了输入/输出触点，其允许滤波器安装在板上，底部滤波器表面位于其上，从而在板和谐振器通孔之间提供直接接地 用于改善衰减性能，特别是在较高频率下。 多个传输线实施例将第一和第二导电区域电互连。

公开(公告)号：US07023291B2

公开(公告)日：2006-04-04

申请号：US10946890

申请日：2004-09-22

Applicant: Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B5/32

CPC classification number: H05K1/0201 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10606

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.

Abstract translation: 提供具有增加的热效率的高度稳定的晶体振荡器。 高度稳定的晶体振荡器包括： 恒温器主机，其保持包括用于密封晶体片的谐振器容器的晶体谐振器的温度，与所述晶体谐振器一起构成振荡电路的振荡元件，控制所述恒温器主机内部的温度的温度控制元件， 以及安装有所述恒温器主机，所述振荡元件和所述温度控制元件的电路板。 该结构使得在所述振荡元件和所述温度控制元件之中具有较高温度依赖性的发热芯片电阻器和高热敏元件被布置在所述电路板的一个主平面上，并且所述发热芯片电阻器， 所述高热敏元件，并且所述恒温器主机通过热导材料直接热粘合。

公开(公告)号：US06683790B1

公开(公告)日：2004-01-27

申请号：US09606963

申请日：2000-06-29

Applicant: Hajime Suemasa ,  Takashi Maruyama

Inventor： Hajime Suemasa ,  Takashi Maruyama

IPC: H05K702

CPC classification number: H05K3/3442 ,  H01P1/2053 ,  H01P1/2136 ,  H05K1/0237 ,  H05K1/141 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09736 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2203/0353 ,  Y02P70/613

Abstract: An electronic part comprising: a printed circuit board including a first major surface and a second major surface; a circuit element disposed on the first major surface of the printed circuit board; a terminal electrode disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; a soldering-resistant film disposed on the second major surface of the printed circuit board and including a major surface opposed to the second major surface of the printed circuit board; wherein the distance between the major surface of the terminal electrode and the second major surface of the printed circuit board is substantially equal to or larger than the distance between the major surface of the soldering-resistant film in the vicinity of the terminal electrode and the second major surface of the printed circuit board.

Abstract translation: 一种电子部件，包括：印刷电路板，包括第一主表面和第二主表面; 设置在印刷电路板的第一主表面上的电路元件; 端子电极，设置在印刷电路板的第二主表面上并且包括与印刷电路板的第二主表面相对的主表面; 设置在印刷电路板的第二主表面上并包括与印刷电路板的第二主表面相对的主表面的耐焊膜; 其中端子电极的主表面和印刷电路板的第二主表面之间的距离基本上等于或大于端接电极附近的耐焊膜的主表面与第二 印刷电路板的主表面。

公开(公告)号：US06570262B1

公开(公告)日：2003-05-27

申请号：US09525077

申请日：2000-03-14

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01L23544

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US5517162A

公开(公告)日：1996-05-14

申请号：US136582

申请日：1993-10-13

Applicant: Hisashi Ariyoshi

Inventor： Hisashi Ariyoshi

IPC: H01P1/205 ,  H01P11/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01P7/04

CPC classification number: H01P1/2056 ,  H05K1/0243 ,  H05K3/3436 ,  H05K3/3442 ,  H01L2224/10175 ,  H05K2201/09381 ,  H05K2201/10068 ,  H05K2201/10734 ,  H05K2201/10969 ,  H05K2201/10984 ,  H05K2201/2081 ,  H05K3/3431 ,  H05K3/3452 ,  Y02P70/613

Abstract: A dielectric resonator device includes a dielectric member, inner conductors provided in the dielectric member, an outer conductor formed on an outer surface of the dielectric member, signal input and output electrodes formed on the outer surface of the dielectric member opposing a mounting substrate and coupled with the inner conductors, and solder bumps formed on the outer conductor on its surface opposing the mounting substrate and on the signal input and output electrodes. By heating the dielectric resonator device opposing the mounting substrate, electrical and mechanical connections may be made therebetween through the solder bumps, while preventing the formation of solder bridges.

Abstract translation: 介质谐振器装置包括电介质构件，设置在电介质构件中的内导体，形成在电介质构件的外表面上的外导体，形成在与安装基板相对的电介质构件的外表面上的信号输入和输出电极， 其内部导体和形成在其表面上的外部导体上的焊料凸块相对于安装基板和信号输入和输出电极。 通过加热与安装基板相对的介质谐振器装置，可以通过焊料凸块在其间形成电气和机械连接，同时防止形成焊接桥。

公开(公告)号：US20230413422A1

公开(公告)日：2023-12-21

申请号：US18337725

申请日：2023-06-20

Applicant: ELECTRONIC DESIGN & DEVELOPMENT, CORP.

Inventor： Sergio E. Cardona, Jr.

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K1/024 ,  H05K3/341 ,  H05K1/0306 ,  H05K2201/015 ,  H05K2201/10068 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2203/041

Abstract: A hermetic glass module for wireless communication. In some embodiments, the module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.

公开(公告)号：US20180198407A1

公开(公告)日：2018-07-12

申请号：US15740738

申请日：2015-07-27

Applicant: GUANGDONG DAPU TELECOM TECHNOLOGY CO., LTD.

Inventor： Yifeng WANG ,  Chaosheng LIU

IPC: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/02

CPC classification number: H03B5/04 ,  H03B5/36 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0306 ,  H05K1/167 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10196

Abstract: The disclosure relates to the technical field of quartz crystal oscillators, in particular to a direct temperature measurement oven controlled crystal oscillator. The direct temperature measurement oven controlled crystal oscillator according to the present disclosure does not require additional components for measuring the temperature of the wafer inside the crystal oscillator. Instead, the temperature measurement device is disposed on the surface of the wafer to directly measure the temperature of the wafer itself, In order to achieve the exact temperature of the wafer itself. The oven controlled crystal oscillator according to the present disclosure has a simple in structure and is easy to be manufactured. The temperature of the wafer itself is directly measured to make temperature measurement more accurate.

公开(公告)号：US20170359906A1

公开(公告)日：2017-12-14

申请号：US15614618

申请日：2017-06-06

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Tomoyuki HOSODA ,  Junichi ARAI

IPC: H05K3/34 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02 ,  H01L23/049

CPC classification number: H05K3/3442 ,  H01L23/049 ,  H03B5/32 ,  H03H3/02 ,  H03H9/02 ,  H03H9/0538 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10303 ,  H05K2201/10318

Abstract: An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.

公开(公告)号：US20170194552A1

公开(公告)日：2017-07-06

申请号：US15379521

申请日：2016-12-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshiharu SUEMORI

IPC: H01L41/053 ,  H01L41/047

CPC classification number: H01L41/0533 ,  H01L23/3121 ,  H01L23/564 ,  H01L25/16 ,  H01L41/0472 ,  H01L41/0475 ,  H01L41/0477 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H03H9/1085 ,  H05K3/281 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10068 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/1178 ,  H05K2203/1311 ,  H05K2203/1316 ,  H05K2203/1322 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/014

Abstract: An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.

公开(公告)号：US09219218B2

公开(公告)日：2015-12-22

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki Ishigami ,  Hidefumi Nakamura ,  Yukihiko Shiohara ,  Taku Kawasaki ,  Fumiaki Akahane

IPC: H05K1/09 ,  H05K1/03 ,  H01L41/047 ,  H01L41/053 ,  H01L41/333 ,  H01L41/29 ,  B22F5/12 ,  B22F3/105

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。