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    CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES
    31.
    发明申请
    CIRCUIT ASSEMBLIES INCLUDING THERMOELECTRIC MODULES 有权
    包括热电模块的电路组件

    公开(公告)号：US20140150839A1

    公开(公告)日：2014-06-05

    申请号：US14176388

    申请日：2014-02-10

    Applicant: Laird Technologies, Inc.

    Inventor： Jeffrey Gerard Hershberger ,  Richard F. Hill ,  Robert Michael Smythe ,  Michael G. Sutsko

    IPC: F25B21/02 ,  H01L35/30

    CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/30 ,  H01L35/32 ,  H01L2224/48091 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0061 ,  H05K7/205 ,  H05K2201/10219 ,  Y10T29/4913 ,  H01L2924/00014

    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.

    Abstract translation: 电路组件通常包括电路板和被配置为将热电模块耦合到电路板的至少一个电路径。 当热电模块经由至少一个电路径耦合到电路板时，电路板和至少一个电路径形成热电模块的一部分。 包括构成热电模块的一部分的电路板的部分的热电模块限定了小于电路板的覆盖区的覆盖区。 因此，电路板能够在由热电模块限定的覆盖区以外的位置支撑电路板上的电气部件。

    FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME
    36.
    发明申请
    FLEXIBLE INTERCONNECT STRUCTURES FOR ELECTRICAL DEVICES AND LIGHT SOURCES INCORPORATING THE SAME 审中-公开
    电气设备的柔性互连结构及其相关的光源

    公开(公告)号：US20060292722A1

    公开(公告)日：2006-12-28

    申请号：US11468709

    申请日：2006-08-30

    Applicant: Charles Becker ,  Stanton Weaver ,  Thomas Stecher

    Inventor： Charles Becker ,  Stanton Weaver ,  Thomas Stecher

    IPC: H01L21/00 ,  H01L33/00

    CPC classification number: H05K1/0204 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2201/10416 ,  H01L2924/00

    Abstract: A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith.

    Abstract translation: 灵活的互连结构允许从包括诸如发光二极管（“LED”）和/或激光二极管的发光元件的电气设备产生的热量的快速散热。 柔性互连结构包括：（1）至少一个柔性电介质膜，电路迹线和任选的电路部件形成在其上，其至少一部分通过其厚度去除; 和（2）至少一个附着在与形成电路迹线的表面相对的柔性电介质膜的一个表面上的散热片。 柔性互连结构可以包括多个这样的柔性介电膜，每个支撑电路迹线和/或电路部件，并且每个通过电绝缘层附接到另一个。 具有复杂形状的电气设备或光源由这种柔性互连结构和附接到散热器的发光元件形成为与其热接触。

    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD
    40.
    发明公开
    OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL DEVICE AND OPTICAL TRANSCEIVER MODULE TEMPERATURE CONTROL METHOD 审中-公开

    公开(公告)号：US20240134136A1

    公开(公告)日：2024-04-25

    申请号：US18493097

    申请日：2023-10-23

    Applicant: Formerica Optoelectronics, Inc.

    Inventor： Yun-Cheng HUANG ,  Yi-Nan SHIH ,  Chih-Chung LIN ,  Yun-Chin TSAI

    IPC: G02B6/42 ,  H05K1/02

    CPC classification number: G02B6/4271 ,  G02B6/4246 ,  G02B6/428 ,  H05K1/0203 ,  H05K2201/10151 ,  H05K2201/10219

    Abstract: An optical transceiver module temperature control device includes a processor, a printed circuit board assembly, an optical transceiver module and a temperature adjustment element. The processor is configured to measure an ambient temperature. The printed circuit board assembly includes a first side and a second side. The first side is opposite to the second side. The optical transceiver module is disposed on the first side of the printed circuit board assembly. The temperature adjustment element is coupled to the processor and disposed on the second side of the printed circuit board assembly. The processor is configured to generate a temperature adjustment signal according to the ambient temperature and an operating temperature range. The temperature adjustment element is configured to perform heat exchange with the printed circuit board assembly according to the temperature adjustment signal to adjust a temperature of the optical transceiver module into the operating temperature range.

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