公开(公告)号：US09620394B2

公开(公告)日：2017-04-11

申请号：US14211625

申请日：2014-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Naofumi Kishita ,  Yuji Sakai

IPC: B05C11/08 ,  H01L21/67 ,  H01L21/687 ,  G03F7/16

CPC classification number: H01L21/67051 ,  B05C11/08 ,  G03F7/162 ,  H01L21/68714 ,  H01L21/68735 ,  H01L21/68785

Abstract: In one embodiment, a cleaning member has an annular part and an opening positioned radially inside the annular part, and can be moved up and down between a first position and a second position relative to a cleaning nozzle. For cleaning of the back surface of the wafer, the cleaning member is placed at its first position that allows a cleaning liquid to reach the back surface of the substrate through the opening of the cleaning member. For cleaning of the cup structure, the cleaning member placed at its second position higher than the first position is being rotated, and a cleaning liquid discharged from the cleaning nozzle collides with an annular part of the cleaning member and is guided to the inner surface of a cup structure.

公开(公告)号：US09573144B2

公开(公告)日：2017-02-21

申请号：US14291575

申请日：2014-05-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Lan-Hai Wang ,  Yong-Hung Yang ,  Ding-I Liu ,  Si-Wen Liao ,  Po-Hsiung Leu ,  Mao-Cheng Lin

IPC: H01L21/31 ,  H01L21/469 ,  B05B1/30 ,  B05B1/18 ,  B05C11/08 ,  C23C18/00 ,  H01L21/67 ,  H01L31/18

CPC classification number: B05B1/14 ,  B05B1/185 ,  B05B1/30 ,  B05B15/60 ,  B05C11/08 ,  C23C18/00 ,  H01L21/67051 ,  H01L21/6715 ,  H01L31/18

Abstract: A method of forming a coating film over a substrate is provided. The method includes spinning the substrate. The method further includes providing a central coating liquid spray over a central portion of the substrate. The method also includes providing first coating liquid sprays over the substrate. The first coating liquid sprays surround the central coating liquid spray and are spaced apart from the central coating liquid spray by a same first distance.

Abstract translation: 提供了在基板上形成涂膜的方法。 该方法包括旋转衬底。 该方法还包括在基底的中心部分上提供中心涂覆液体喷雾。 该方法还包括在衬底上提供第一涂覆液体喷雾。 第一次涂布液体喷雾包围中央喷涂液体喷雾，并与中心喷涂液体喷雾间隔相同的第一距离。

公开(公告)号：US20170001165A1

公开(公告)日：2017-01-05

申请号：US15200408

申请日：2016-07-01

Applicant: Centrillion Technology Holdings Corporation

Inventor： Filip CRNOGORAC ,  Glenn MCGALL ,  Bolan LI

IPC: B01J19/00 ,  B05C13/00 ,  B05C11/02 ,  B05C11/10 ,  B05D1/00 ,  B05C11/08

CPC classification number: B01J19/0046 ,  B01J2219/00333 ,  B01J2219/0036 ,  B01J2219/00421 ,  B01J2219/00443 ,  B01J2219/00529 ,  B01J2219/00536 ,  B01J2219/00596 ,  B01J2219/00608 ,  B01J2219/00612 ,  B01J2219/00659 ,  B01J2219/00675 ,  B01J2219/00691 ,  B01J2219/00722 ,  B05C11/023 ,  B05C11/08 ,  B05C11/1039 ,  B05C13/00 ,  B05D1/005 ,  C40B50/18 ,  C40B60/14 ,  G03F7/162 ,  G03F7/30 ,  G03F7/3014

Abstract: The present disclosure provides methods, device, and system for wafer processing. The wafer processing apparatus uses lid dispenser to disperse at least one reagent to the surface of the wafer. Further, the wafer is positioned on top of a rotatable vacuum chuck configured to spread at least one reagent over the surface of the wafer via a centrifugal force or surface tension, thereby permitting the at least one reagent to react with an additional reagent. Further, when dispensing the at least one reagent, a separation gap between the lid dispenser and the wafer is at a predetermined distance, for example, from 50 μm to 2 mm.

Abstract translation: 本公开提供了用于晶片处理的方法，装置和系统。 晶片处理装置使用盖分配器将至少一种试剂分散到晶片的表面。 此外，晶片位于可旋转真空卡盘的顶部，该卡盘构造成经由离心力或表面张力将至少一种试剂扩散到晶片的表面上，从而允许至少一种试剂与另外的试剂反应。 此外，当分配至少一种试剂时，盖分配器和晶片之间的间隔距离为例如50μm至2mm的预定距离。

公开(公告)号：US09355871B2

公开(公告)日：2016-05-31

申请号：US13541831

申请日：2012-07-05

Applicant: Jiro Higashijima ,  Norihiro Ito ,  Nobuhiro Ogata ,  Shuichi Nagamine

Inventor： Jiro Higashijima ,  Norihiro Ito ,  Nobuhiro Ogata ,  Shuichi Nagamine

IPC: H01L21/67 ,  H01L21/00 ,  B08B3/00 ,  B08B3/04 ,  B05B15/04 ,  B05C11/08 ,  B08B15/02 ,  B08B3/08 ,  G03F7/40

CPC classification number: H01L21/67017 ,  B05B14/00 ,  B05C11/08 ,  B08B3/04 ,  B08B3/08 ,  B08B15/02 ,  G03F7/40 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6715

Abstract: A substrate liquid processing apparatus is provided, in which a processing solution and an atmosphere can be separated from each other within a collection cup. The substrate liquid processing apparatus includes: a substrate rotation unit; a processing solution supply unit; a collection cup configured to collect the processing solutions; liquid collection regions formed at the collection cup; a liquid drain opening formed at a bottom portion of the collection cup; an exhaust opening formed above the liquid drain opening; a fixed cover configured to cover an upper portion of the exhaust opening with a space therebetween; an elevating cup provided above the fixed cover and configured to guide the processing solutions into the liquid collection regions; and a cup elevating unit configured to move up and down the elevating cup depending on the kinds of the processing solutions.

Abstract translation: 提供了一种基板液体处理装置，其中处理溶液和气氛可以在收集杯内彼此分离。 基板液体处理装置包括：基板旋转单元; 处理液供应单元; 收集杯，其被配置为收集处理溶液; 在收集杯处形成的液体收集区域; 形成在收集杯的底部的液体排出口; 形成在排液口上方的排气口; 固定盖，其被构造成在其间具有空间覆盖所述排气口的上部; 提升杯，其设置在所述固定盖的上方并且被构造成将所述处理溶液引导到所述液体收集区域中; 以及杯升降单元，其配置为根据处理溶液的种类上下移动升降杯。

公开(公告)号：US20150228512A1

公开(公告)日：2015-08-13

申请号：US14430574

申请日：2013-09-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Makoto Muramatsu ,  Takahiro Kitano ,  Tadatoshi Tomita ,  Keiji Tanouchi ,  Kazutoshi Yano ,  Kenichi Shigetomi ,  Akihiro Toyozawa

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/687 ,  B05C11/08 ,  B05C9/14 ,  H01L21/3105 ,  H01J37/32

CPC classification number: H01L21/67098 ,  B05C9/14 ,  B05C11/08 ,  G03F7/0002 ,  H01J37/32889 ,  H01J2237/334 ,  H01L21/0271 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31138 ,  H01L21/67023 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67173 ,  H01L21/67225 ,  H01L21/67748 ,  H01L21/68757 ,  H01L21/68764

Abstract: The present invention is a method of treating a substrate using a block copolymer containing a first polymer and a second polymer, the method including: a block copolymer coating step of applying the block copolymer onto a substrate or a base film applied on the substrate; and a polymer separation step of phase-separating the block copolymer into the first polymer and the second polymer by thermally treating the block copolymer on the substrate in a non-oxidizing gas atmosphere.

Abstract translation: 本发明是一种使用含有第一聚合物和第二聚合物的嵌段共聚物处理基材的方法，该方法包括：将嵌段共聚物涂布在涂布在基材上的基材或基膜上的嵌段共聚物涂布步骤; 以及聚合物分离步骤，通过在非氧化性气体气氛中对基材上的嵌段共聚物进行热处理，将嵌段共聚物相分离成第一聚合物和第二聚合物。

公开(公告)号：US20150083038A1

公开(公告)日：2015-03-26

申请号：US14491065

申请日：2014-09-19

Applicant: Shibaura Mechatronics Corporation

Inventor： Masaaki FURUYA

IPC: B05C11/08 ,  B05C9/08 ,  B05C13/00

CPC classification number: G03F7/162 ,  G03F7/3021 ,  G03F7/42 ,  H01L21/68728

Abstract: A spin treatment apparatus according to an embodiment performs a treatment while rotating a substrate and includes: at least three clamp pins configured to contact an outer peripheral surface of the substrate and clamp the substrate; rotatable pin rotators provided for the respective clamp pins and each configured to retain the corresponding clamp pin at a position offset from a rotation axis of the pin rotator parallel with a rotation axis of the substrate; magnet gears provided for the respective pin rotators around outer peripheral surfaces thereof and each having a magnetic-pole part formed spirally about the rotation axis of the pin rotator; rotation magnets provided for the respective magnet gears and positioned to attract and be attracted by the magnetic-pole part of the corresponding magnet gear; and a movement mechanism configured to move the rotation magnets along the rotation axes of the pin rotators.

Abstract translation: 根据实施例的旋转处理装置在旋转基板的同时执行处理，并且包括：至少三个夹持销，其构造成接触基板的外周表面并夹持基板; 为相应的夹紧销提供的可旋转的针式转子，并且每个构造成将相应的夹紧销保持在与转子的旋转轴线偏置的位置，该位置与衬底的旋转轴线平行; 磁轮齿轮围绕其外周表面设置用于相应的销转子，并且每个具有围绕销转子的旋转轴线螺旋形成的磁极部分; 设置在各磁铁上的旋转磁铁，定位成吸引并被相应磁齿轮的磁极部吸引; 以及移动机构，其构造成沿着所述销转子的旋转轴线移动所述旋转磁体。

公开(公告)号：US20150037499A1

公开(公告)日：2015-02-05

申请号：US14445736

申请日：2014-07-29

Applicant: Solid State Equipment LLC

Inventor： William Gilbert Breingan ,  James K. Anders ,  Herman Itzkowitz

IPC: H01L21/683 ,  B05C11/08 ,  B05C13/00 ,  B05D1/00

CPC classification number: B05C13/00 ,  B05C1/08 ,  B05D1/005 ,  C23C14/505 ,  C23C16/4585 ,  C23C16/4588 ,  H01L21/6838 ,  H01L21/68792

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer,

Abstract translation: 提供了根据本发明的旋转卡盘，并且被配置为消除化学品在晶片边缘上的包裹。 双速晶片旋转卡盘装置用于防止液体在加工期间影响晶片的背面。 在晶片周围放置一个外环，其间具有窄的间隙，使得当晶片表面移动到晶片的最外边缘时，晶片表面上的液滴将接触外环。 通过高速旋转该外圈，离心力使这些液滴从晶片上拉出并径向向外排出，从而防止液体影响晶片的背面，

公开(公告)号：US08887657B2

公开(公告)日：2014-11-18

申请号：US12795259

申请日：2010-06-07

Applicant: Kenichi Ooshiro ,  Tsuyoshi Sato ,  Takao Tokumoto ,  Sadao Natsu ,  Souichirou Iwasaki

Inventor： Kenichi Ooshiro ,  Tsuyoshi Sato ,  Takao Tokumoto ,  Sadao Natsu ,  Souichirou Iwasaki

IPC: B05C11/08 ,  B05B5/00 ,  B05B3/04 ,  H01L21/67 ,  B05B15/02 ,  B05B12/08 ,  B41J2/165 ,  B05C5/02 ,  B05D1/00

CPC classification number: H01L21/6715 ,  B05B12/08 ,  B05B12/084 ,  B05B15/52 ,  B05B15/555 ,  B05B15/557 ,  B05C5/0216 ,  B05C5/0291 ,  B05C11/08 ,  B05D1/005 ,  B41J2/165 ,  B41J2/16579 ,  H01L21/67051

Abstract: According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Abstract translation: 根据一个实施例，一种成膜系统包括：包括放置表面的载物台，放置被涂物体; 旋转机构沿着所述放置面沿旋转方向旋转所述平台; 一种施加喷嘴，将材料排放到放置在载物台上的物体上以供施用; 沿与所述旋转方向交叉的方向沿所述放置面相对移动所述台和所述施加喷嘴的移动机构; 所述控制器通过所述移动机构使所述台架和所述施加喷嘴沿着所述布置表面沿所述横向方向相对移动，并且将所述材料施加到所述台架上的物体上，同时通过所述旋转机构旋转放置所述物体的台阶， 应用喷嘴; 以及清洁施加喷嘴的清洁装置。

公开(公告)号：US20140137796A1

公开(公告)日：2014-05-22

申请号：US14162855

申请日：2014-01-24

Applicant: Kabushiki Kaisha Toshiba

Inventor： Keisuke Nakazawa

IPC: B05C11/08

CPC classification number: B05C11/08 ,  B05D1/005 ,  G03F7/162 ,  H01L21/6715

Abstract: A spin coating apparatus that supplies a coating liquid to a substrate and rotating the substrate to form a coating film, has a holding part that holds the substrate mounted thereon in a horizontal position; a rotationally driving source that rotationally drives the holding part about a rotational axis parallel with the vertical direction, thereby rotating the substrate; and a coating liquid supplying part that supplies the coating liquid to the substrate held by the holding part.

Abstract translation: 将涂布液供给到基板并旋转基板以形成涂膜的旋涂装置具有将安装在其上的基板保持在水平位置的保持部; 旋转驱动源，其围绕与所述垂直方向平行的旋转轴旋转地驱动所述保持部，从而旋转所述基板; 以及将涂布液供给到由保持部保持的基板的涂布液供给部。

公开(公告)号：US08616152B2

公开(公告)日：2013-12-31

申请号：US13567920

申请日：2012-08-06

Applicant: Yung Ming Chen

Inventor： Yung Ming Chen

IPC: B05C19/06 ,  B05C19/04 ,  B05C19/00 ,  B05C5/02 ,  B05C5/00 ,  B05C11/08 ,  B05C11/02 ,  B05C11/10 ,  B05C11/00

CPC classification number: B05B17/0615 ,  B05B1/14 ,  B05B12/004 ,  B05B12/122 ,  B05B13/0207 ,  B05B13/0228 ,  B05D1/02

Abstract: An apparatus for coating a stent comprises a coating solution reservoir, a stent support for carrying a stent adjacent the reservoir, transducers for generating waves through the coating solution, and a controller that controls timing at which the transducers are powered in order to eject a droplet of the coating solution.

Abstract translation: 用于涂覆支架的装置包括涂层溶液储存器，用于承载邻近储存器的支架的支架支架，用于通过涂布溶液产生波的换能器，以及控制器，其控制换能器被加电的定时以喷射液滴 的涂层溶液。