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公开(公告)号:US20240091803A1
公开(公告)日:2024-03-21
申请号:US18066293
申请日:2022-12-15
Applicant: Sichuan Huili Industry Co., Ltd
Inventor: Shicai Xiao , Wanling Lan , Daiguo Zhao , Yan Jiang , Daiqun Yuan , Jinzhi Bai
CPC classification number: B05B13/0207 , B05B15/50 , B05C9/14 , B05C13/02 , B05D3/067
Abstract: The present invention discloses a process and device for preparing laser PVC. The device includes an upper transmission roller, a support mechanism, a spraying mechanism, an impurity removal mechanism, and a lower transmission roller; the upper transmission roller is disposed above the lower transmission roller, and the two are configured to implement delivery of a PVC film at a station for preparing a laser layer by spraying; the support mechanism is disposed between the upper transmission roller and the lower transmission roller and is in contact with a back surface of the PVC film, and the spraying mechanism is disposed opposite to the support mechanism; and a curing mechanism is disposed in a fitting manner at the coating position; and the impurity removal mechanism is disposed at a front end of the spraying mechanism.
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公开(公告)号:US20240058832A1
公开(公告)日:2024-02-22
申请号:US18372945
申请日:2023-09-26
Applicant: Apeel Technology, Inc.
Inventor: Ronald C. Bakus , Matthew Kahlscheuer , Gregory Faust , Louis Perez , Anuj Purohit , Krishnan Chari , Benjamin Gordon , Nicholas Feringa , Doug Gotthard
IPC: B05C1/02 , B05C11/10 , C09D5/14 , A23B7/015 , A23B7/16 , A23L3/28 , A23P20/18 , A61L2/10 , A61L2/18 , B05D3/06
CPC classification number: B05C1/02 , B05C11/10 , C09D5/14 , A23B7/015 , A23B7/16 , A23L3/28 , A23P20/18 , A61L2/10 , A61L2/18 , B05D3/062 , A61L2101/30
Abstract: A treatment system, including a conveyor bed configured to transport a plurality of products; a brushing device located along the conveyor bed and having one or more brushes that include a first antimicrobial compound; a surface treatment device including a lamp configured to emit light of a peak wavelength directed toward a portion of the conveyor bed; and a coating device configured to deliver a coating mixture onto the plurality of products on the conveyor bed.
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公开(公告)号:US11884786B2
公开(公告)日:2024-01-30
申请号:US17493834
申请日:2021-10-04
Applicant: SPECIALTY COATING SYSTEMS, INC.
Inventor: Andreas Greiner , Tobias Moss , Rakesh Kumar
CPC classification number: C08J5/18 , B05D1/60 , B05D3/067 , B05D2518/00 , C08J2365/04
Abstract: Elastic Parylene films produced via chemical vapor deposition polymerization (CVDP) on a substrate are disclosed.
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公开(公告)号:US11873429B2
公开(公告)日:2024-01-16
申请号:US16905976
申请日:2020-06-19
Applicant: BOSTIK SA
Inventor: Guillaume Michaud , Aurelien Wiegand , Stephane Fouquay
IPC: C09J7/38 , B05D3/06 , B05D5/10 , C09J175/12 , C08K5/105 , C08K5/01 , C09J7/35 , C09J175/08 , C08K5/00 , C09J175/16
CPC classification number: C09J7/38 , B05D3/067 , B05D3/068 , B05D5/10 , C08K5/005 , C08K5/01 , C08K5/105 , C09J7/35 , C09J175/08 , C09J175/12 , C09J175/16 , C09J2301/302 , C09J2301/304 , C09J2301/312 , C09J2475/00
Abstract: A hot-melt pressure-sensitive adhesive composition comprises:
a) at least one polyurethane comprising at least two end functional groups T of following formula (I):
—X—(C═O)—CH(RV)═CH2 (I)
b) at least one tackifying resin chosen from the following resins:
(b1) terpene/phenolic resins;
(b2) the resins resulting from the polymerization of α-methylstyrene, optionally followed by a reaction with at least one phenol;
(b3) the polymeric resins (optionally at least partially hydrogenated) resulting from mainly C9 aromatic fractions; and
c) at least one polymerization inhibitor.
The polyurethane(s) (a): tackifying resin(s) (b) ratio by weight ranges from 4:6 to 6:4. The said polyurethane (a) has a mean functionality of functional groups of formula (I) strictly of greater than 1.9.-
公开(公告)号:US20240012349A1
公开(公告)日:2024-01-11
申请号:US18219164
申请日:2023-07-07
Applicant: CANON KABUSHIKI KAISHA
Inventor: SHINGO HIROTA , YOSHIRO TSUKADA , MASAMI HANO , TOSHIYUKI YAMADA , KYOHEI KIKUCHI , DAISUKE KATAYAMA , TARO HANAZATO
IPC: G03G15/20 , G03G9/09 , G03G15/043 , G03G15/00 , B05D3/06
CPC classification number: G03G15/2007 , G03G9/0904 , G03G15/043 , G03G15/5008 , B05D3/061 , B05D2501/00 , G03G2215/209
Abstract: An image forming system includes an image forming unit, a varnish applying unit, a conveying unit, an irradiation unit, and a controller. The controller controls conveyance of a recording material so that a conveying speed of the recording material in a case that varnish is applied to the recording material with a toner image is formed is slower than a conveying speed of the recording material in a case that varnish is applied to the recording material with no toner image. The controller controls irradiation of the varnish with light so that intensity of the light with which the varnish is irradiated in a case that the varnish is applied to the recording material with the toner image is lower than intensity of the light with which the varnish is irradiated in a case that the varnish is applied to the recording material with no toner image.
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公开(公告)号:US11866335B2
公开(公告)日:2024-01-09
申请号:US16928459
申请日:2020-07-14
Inventor: Heping Zeng , Yanwei Huang , Jiayang He
IPC: C01B32/198 , C01B32/194 , B01J13/00 , B05D1/00 , B05D3/06
CPC classification number: C01B32/198 , B01J13/0008 , B05D1/005 , B05D3/066 , C01B32/194 , B05D2202/25 , C01P2006/90
Abstract: A method for preparing a graphene based composite wave-absorbing material includes: dissolving a water soluble barium salt and a water soluble iron salt into deionized water, respectively; mixing barium salt solution and iron salt solution according to a molar ratio of Ba:Fe of 1:12 to obtain a precursor solution; dispersing a graphene material in deionized water to form a graphene dispersion; adding citric acid, nitric acid and the graphene dispersion into the precursor solution in sequence to form a mixture solution; stirring the mixture solution at a temperature of 50 to 75° C. to obtain a sol; coating and drying aged sol on a substrate to obtain a coating layer; and sintering the coating layer by a laser irradiation.
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公开(公告)号:US11857997B2
公开(公告)日:2024-01-02
申请号:US16905463
申请日:2020-06-18
Applicant: International Business Machines Corporation
Inventor: Ali Afzali-Ardakani , David L. Rath , Sarunya Bangsaruntip , George Gabriel Totir
CPC classification number: B05D1/18 , B05D1/005 , B05D1/02 , B05D3/005 , B05D3/062 , B05D3/102 , B05D3/142 , B05D2202/00 , B05D2518/00
Abstract: Techniques regarding methods and/or apparatuses for protecting metal substrates during one or more lithography processes are provided. For example, one or more embodiments described herein can comprise a method that can include coating a metal substrate with a polymer film that self-assembles on a metal oxide positioned on a surface of the metal substrate. The method can also include covalently bonding the polymer film to the metal oxide.
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公开(公告)号:US20230415195A1
公开(公告)日:2023-12-28
申请号:US17809414
申请日:2022-06-28
Applicant: CANON KABUSHIKI KAISHA
Inventor: Niyaz KHUSNATDINOV , Weijun Liu , James W. Irving
IPC: B05D7/00 , H01L21/3105 , B05D3/06
CPC classification number: B05D7/58 , H01L21/31058 , B05D3/06
Abstract: A superstrate can include a body, a first layer, and a second layer, wherein the first layer is disposed between the body and the second layer. Each of the first and second layers has a proximal surface and a distal surface opposite the proximal surface, wherein the body is closer to the proximal surface than to the distal surface. An Ra of the distal surface of the second layer is less than an Ra of the distal surface of the first layer. In a method of making the superstrate, the relatively high Ra of the distal surface of the first layer may be related to the process or equipment used in forming the first layer. The second layer can be formed using another superstrate, where the Ra of the distal surface of the second layer is substantially the same as the contact surface of the other superstrate.
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公开(公告)号:US20230411150A1
公开(公告)日:2023-12-21
申请号:US18362136
申请日:2023-07-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Je-Ming Kuo , Yen-Chun Huang , Chih-Tang Peng , Tien-I Bao
IPC: H01L21/02 , H01L29/06 , B05D7/00 , H01L21/8234 , H01L21/311 , H01L21/762 , B05D3/06 , B05D1/38 , H01L21/768 , B05D1/00 , G03F7/16
CPC classification number: H01L21/02282 , H01L21/76828 , B05D7/546 , H01L21/823481 , H01L21/31111 , H01L21/02126 , H01L21/76224 , H01L21/0223 , H01L21/02164 , H01L21/02348 , H01L21/02323 , B05D3/067 , B05D1/38 , H01L21/76825 , B05D1/005 , H01L21/02255 , H01L21/76832 , H01L21/76826 , G03F7/162 , H01L29/0649
Abstract: The present disclosure is generally related to semiconductor devices, and more particularly to a dielectric material formed in semiconductor devices. The present disclosure provides methods for forming a dielectric material layer by a cyclic spin-on coating process. In an embodiment, a method of forming a dielectric material on a substrate includes spin-coating a first portion of a dielectric material on a substrate, curing the first portion of the dielectric material on the substrate, spin-coating a second portion of the dielectric material on the substrate, and thermal annealing the dielectric material to form an annealed dielectric material on the substrate.
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公开(公告)号:US11834585B2
公开(公告)日:2023-12-05
申请号:US17566494
申请日:2021-12-30
Applicant: SWIMC LLC
Inventor: Richard D. Joslin , Charles I. Skillman , Joseph Desousa
IPC: B05D1/38 , C09D5/03 , C09D133/04 , C09D123/00 , C09D167/00 , B65D23/08 , C09D171/00 , B05D1/00 , B05D1/12 , B05D3/06 , B05D3/02
CPC classification number: C09D5/031 , B05D1/007 , B05D1/38 , B65D23/0821 , C09D5/034 , C09D5/037 , C09D123/00 , C09D133/04 , C09D167/00 , C09D171/00 , B05D1/12 , B05D3/0272 , B05D3/067 , B05D2401/32
Abstract: Powder coating compositions, particularly metal packaging powder coating compositions, coated metal substrates, and methods; wherein the powder coating compositions include powder polymer particles comprising a polymer having a number average molecular weight of at least 2000 Daltons, wherein the powder polymer particles have a particle size distribution having a D50 of less than 25 microns; and, in certain embodiments, one or more charge control agents in contact with the powder polymer particles.
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