Abstract:
A bolometer circuit may include an active bolometer configured to receive external infrared (IR) radiation and a resistive load, which are configured to be connected in series in a bolometer conduction path from a supply voltage node to a common voltage node. A node in the bolometer conduction path between the resistive load and the active bolometer is coupled to a first input of an op-amp. A variable voltage source is coupled to a second input of the op-amp to provide a reference voltage level. The op-amp maintains the reference voltage level at the first input to generate a current flow in response to a resistance change of the active bolometer due to the external IR radiation. The amplifier circuit may be configured as a feedback amplifier or an integrating amplifier. The bolometer circuit may be configured to enable a low-power mode of operation.
Abstract:
A camera, computer program, and method for determining and displaying temperature rates of change for regions within the camera's field of view. More specifically, the embodiments provide for the continuous, real-time temperature measurement and display of a region within the camera's field of view, and further for the real-time processing and display of the temperature rates of change for the region.
Abstract:
A solid-state image sensing device has a plurality of detection units periodically arranged as a two-dimensional array on a substrate. Each of the detection units includes a visible light detector and an infrared light detector arranged on the same optical axis in a vertical direction so that the visible light detector and the infrared light detector overlap with each other. Each of the detection units also includes a signal readout circuit provided in the substrate so as to output signals of the visible light detector and the infrared light detector as time-series signals.
Abstract:
The infrared detecting element has a first base plate that has a first front surface, a first back surface, a first recessed portion, and an infrared detecting section for detecting infrared rays provided in an area of the first front surface that opposes the first recessed portion; a second base plate that has a second front surface, a second back surface on the opposite side of the second front surface, and a second recessed portion provided in an area of the second back surface that faces the first recessed portion; and an adhesion film that bonds the first back surface and the second back surface, wherein a second outer peripheral portion where the second recessed portion intersects with the second back surface surrounds a first outer peripheral portion where the first recessed portion intersects with the first back surface.
Abstract:
A pyrometry imaging system for monitoring a high-temperature asset which includes at least one component is provided. The system includes a lens element in optical communication with the at least one component. The lens element is configured to receive at least a portion of thermal radiation emitted from the at least one component. The system also includes a view limiting device positioned between the lens element and a dispersive element. The dispersive element is configured to split the at least a portion of thermal radiation emitted into a plurality of wavelengths. The system further includes at least one camera device in optical communication with the dispersive element. The at least one camera device is configured to receive at least one wavelength from the dispersive element.
Abstract:
A signal detecting circuit of an infrared sensor includes: a cell array in which bolometers sensing infrared rays and outputting signal currents are arranged in an N×M format; a level generator that outputs a plurality of bias voltages corresponding to a plurality of bias levels; N resistor non-uniformity correcting circuits that are located in a column direction of the cell array and supply different bias voltages to each of the bolometers; M resistor non-uniformity correcting circuits that are located in a row direction of the cell array and supply different bias voltages to each of the bolometers; a control unit that sets a bias voltage level of each resistor non-uniformity correcting circuit to correct the resistor non-uniformity of the cell array; and N integrators that integrate the signal currents output from the cell array.
Abstract:
A terahertz imager includes an array of pixel circuits. Each pixel circuit has an antenna and a detector. The detector is coupled to differential output terminals of the antenna. A frequency oscillator is configured to generate a frequency signal on an output line. The output line is coupled to an input terminal of the antenna of at least one of the pixel circuits.
Abstract:
An apparatus for detecting electromagnetic radiation within a target frequency range is provided. The apparatus includes a substrate and one or more resonator structures disposed on the substrate. The substrate can be a dielectric or semiconductor material. Each of the one or more resonator structures has at least one dimension that is less than the wavelength of target electromagnetic radiation within the target frequency range, and each of the resonator structures includes at least two conductive structures separated by a spacing. Charge carriers are induced in the substrate near the spacing when the resonator structures are exposed to the target electromagnetic radiation. A measure of the change in conductivity of the substrate due to the induced charge carriers provides an indication of the presence of the target electromagnetic radiation.
Abstract:
A solid-state image sensing device has a plurality of detection units periodically arranged as a two-dimensional array on a substrate. Each of the detection units includes a visible light detector and an infrared light detector arranged on the same optical axis in a vertical direction so that the visible light detector and the infrared light detector overlap with each other. Each of the detection units also includes a signal readout circuit provided in the substrate so as to output signals of the visible light detector and the infrared light detector as time-series signals.
Abstract:
On-board non-uniformity correction calibration methods for a microbolometer focal plane array in a thermal camera are disclosed. The methods include performing first calculations in the processor unit of the thermal camera to generate and apply a set of coarse correction bias voltages to the detector elements. The method also includes performing calculations in the external computer based on image data collected by the thermal camera with the coarse correction bias voltages applied to the detector elements to generate a set of fine correction bias voltages. The method also includes downloading the fine correction bias voltages to the thermal camera and applying the fine correction voltages to the detector elements to establish a fine calibration of the microbolometer focal plane array.