Abstract:
Provided herein is an apparatus, including a patterned resist overlying a substrate; a number of features of the patterned resist, wherein the number of features respectively includes a number of sidewalls; and a sidewall-protecting material disposed about the number of sidewalls, wherein the sidewall-protecting material is characteristic of a conformal, thin-film deposition, and wherein the sidewall-protecting material facilitates a high-fidelity pattern transfer of the patterned resist to the substrate during etching.
Abstract:
Provided herein is an apparatus, including a patterned resist overlying a substrate; a number of features of the patterned resist, wherein the number of features respectively includes a number of sidewalls; and a sidewall-protecting material disposed about the number of sidewalls, wherein the sidewall-protecting material is characteristic of a conformal, thin-film deposition, and wherein the sidewall-protecting material facilitates a high-fidelity pattern transfer of the patterned resist to the substrate during etching.
Abstract:
Disclosed is a surge protection system for use with an ion source assembly. The system comprises a high voltage power source coupled in series with a thermionic diode and an ion source assembly. The high voltage power supply is enclosed in the pressure tank and drives the ion source assembly. The thermionic diode is comprised of an insulating tube disposed between the ion source assembly enclosure and the output of the high voltage power supply and makes use of existing ion source assembly components to limit damage to the power supply during arc failures of the ion source assembly.
Abstract:
An x-ray analyser for a transmission electron microscope is described. The analyser has a silicon drift detector moveable in use between an analysis position and a retracted position. The analyser has a housing having an end portion within which the silicon drift detector is retained. The end portion is formed from a material with a relative magnetic permeability of less than 1.004. The analyser also has an automatic retraction system adapted to move the silicon drift detector from the analysis position to the retracted position upon receipt of a trigger signal indicative of a condition in which the power level received by the silicon drift detector from impinging x-rays or electrons is above a predetermined threshold.
Abstract:
In a charged particle accelerator, voltage of several tens of kV is applied between accelerating electrodes. In such a case, electric discharge is sometimes generated between the accelerating electrodes. In the charged particle accelerator, part or entirety of the accelerating electrodes is coated with an electric discharge suppressing layer made of ceramics or alloy having a high melting point as compared with metal. When impurity fine particles are accelerated by an electric field and collide with the electrodes, the electric discharge suppressing layer made of ceramics or alloy prevents metal vapor from being easily generated from the electrodes and an ionized plasma from being easily produced, thus suppressing electric discharge between the electrodes.
Abstract:
Method for operating a processing system and refurbishing a ceramic substrate holder within a process chamber of the processing system are described. The method includes plasma processing one or more substrates on the ceramic substrate holder, where the processing causes erosion of a nitride material of the ceramic substrate holder. The method further includes refurbishing the ceramic substrate holder in-situ without a substrate residing on the ceramic substrate holder, where the refurbishing includes exposing the ceramic substrate holder to a plasma-excited nitrogen-containing gas in the process chamber to at least partially reverse the erosion of the nitride material.
Abstract:
The invention relates to a high voltage shielding arrangement comprising a first metal part and a second metal part positioned in close vicinity to said first metal part. Said second metal part included in said arrangement to be set at an electrical potential that is lower than the electric potential of the first metal part. Said second metal part having comprising one or more edges and an insulator. The second metal part is at least partially encapsulated by the insulator facing the first metal part.
Abstract:
Disclosed is a method for limiting the voltage applied to a component in a radio frequency path (RF path) of a radio frequency excitation system. According to the method, a radio frequency signal (RF signal) is tapped at a first random point of the RF path, and energy is withdrawn from the RF path when the RF signal tapped at the first point or a value proportional to the tapped RF signal exceeds a reference value, resulting in the component being protected against excess voltages due to disturbances.
Abstract:
An electron beam apparatus prevents a rapid increase of dosage caused by stoppage or deceleration of movement and protects the specimen when the specimen is irradiated with the electron beam while the specimen and the electron beam are being relatively moved. An electron beam source outputs the electron beam. The dosage of election beam irradiated per unit area of the specimen is measured. A storage section stores a predetermined dosage per unit area in memory for the specimen. A detector detects over exposure of the electron beam when the measured dosage per unit area is greater than the dosage per unit area stored in the storage section. A controller controls the electron beam source to reduce the dosage per unit area of the electron beam lower than the dosage per unit area stored in the storage section.
Abstract:
A wafer support for an ion implanter includes a wafer holder and a support arm for the holder in the implant chamber. A portion of the support arm adjacent the wafer holder is at least intermittently exposed to the ion beam during implantation, as a result of the relative scanning of the ion beam and the wafer holder. An arm shield mechanism has a plurality of shielding surfaces which can be selectively disposed to receive the ion beam to protect the exposed portion of the support arm. The shielding surfaces may form a sleeve arranged over the arm which may be rotatable above the arm to present selected surfaces to the ion beam. Cross contamination when successively implanting different species can be reduced by presenting different shield surfaces to the beam.