公开(公告)号：US09865310B2

公开(公告)日：2018-01-09

申请号：US13404995

申请日：2012-02-24

Applicant: Allan Cantle ,  Patrick Weber ,  Mark Gilliam ,  Prashant Joshi

Inventor： Allan Cantle ,  Patrick Weber ,  Mark Gilliam ,  Prashant Joshi

IPC: H05K1/11 ,  H05K1/14 ,  G11C5/04 ,  H05K3/34 ,  H01L25/065

CPC classification number: G11C5/04 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/2036 ,  H01L2924/00

Abstract: Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (μP), or application-specific integrated circuit (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.

公开(公告)号：US20180006391A1

公开(公告)日：2018-01-04

申请号：US15543193

申请日：2015-01-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Byron A Alcorn ,  Shane Ward ,  Peter Andrew Seiler

IPC: H01R12/77 ,  H01R12/70 ,  H01R13/35 ,  H05K1/14 ,  G06F1/18 ,  H05K7/14 ,  H01R12/79 ,  H05K1/11

CPC classification number: H01R12/778 ,  G06F1/185 ,  G06F13/409 ,  H01R12/7047 ,  H01R12/79 ,  H01R13/35 ,  H05K1/117 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K7/142 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10378 ,  H05K2201/2036

Abstract: An interposer for connecting a module to an M.2 socket includes a different form factor connector. The interposer includes an M.2 connector to couple the interposer to the M.2 socket. The M.2 connector is formed to mate with the M.2 socket. The interposer includes a different form factor socket to couple the interposer to the module including the different form factor connector. The different form factor socket is formed to mate with the different form factor connector.

公开(公告)号：US09816691B2

公开(公告)日：2017-11-14

申请号：US15228924

申请日：2016-08-04

Applicant: LedEngin, Inc.

Inventor： Xiantao Yan

IPC: H01L25/075 ,  H01L33/64 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/00 ,  F21V19/00 ,  H01L33/08 ,  H01L33/48 ,  F21K9/90 ,  F21V5/00 ,  F21V5/04 ,  F21V23/00 ,  F21V29/70 ,  F21V9/16 ,  F21V21/14 ,  H01L33/58 ,  H05K3/46 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.

公开(公告)号：US09807899B2

公开(公告)日：2017-10-31

申请号：US15049232

申请日：2016-02-22

Applicant: Toshiba Memory Corporation

Inventor： Yoshiharu Matsuda ,  Akitoshi Suzuki

IPC: H05K7/14 ,  H05K7/20

CPC classification number: H05K7/142 ,  H05K1/0203 ,  H05K1/144 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.

公开(公告)号：US09807890B2

公开(公告)日：2017-10-31

申请号：US13906892

申请日：2013-05-31

Applicant: RF Micro Devices, Inc.

Inventor： Thong Dang ,  Mohsen Haji-Rahim ,  Joseph Byron Bullis

IPC: H05K3/40 ,  H05K1/14 ,  H01L23/31 ,  H01L23/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4007 ,  H01L23/3135 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48229 ,  H01L2224/48235 ,  H01L2224/48465 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/0367 ,  H05K2201/042 ,  H05K2201/10371 ,  Y10T29/4902 ,  Y10T29/49146 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present disclosure is related to electronic modules for electronic components and methods for manufacturing the same. In one embodiment, an electronic module is formed using a first substrate having a first component area and a second substrate having a second component area. One or more electronic components may be attached to both the first component area and the second component area. The second substrate is mounted over the first substrate such that the second component area faces the first component area. An overmold covers the first component area and the second component area so as to cover the electronic components on both the first component area and the second component area. In this manner, the number of electronic components within the electronic module that can be mounted on an area of a printed circuit board (PCB) is increased.

公开(公告)号：US20170305346A1

公开(公告)日：2017-10-26

申请号：US15520371

申请日：2015-10-20

Applicant: CONNAUGHT ELECTRONICS LTD.

Inventor： Martin Oliver COLEMAN

IPC: B60R1/00 ,  H01R13/66 ,  H04N5/225 ,  H05K1/14 ,  H05K1/02 ,  H01R13/658

CPC classification number: B60R1/00 ,  H01R13/658 ,  H01R13/66 ,  H01R13/6625 ,  H01R2201/26 ,  H04N5/225 ,  H04N5/2257 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/10121

Abstract: The invention relates to a camera (2) for a motor vehicle (1), which includes a printed circuit board (16), on which a current connector (29) and a communication bus connector (30) and a video interface connector (31) each for connecting to the motor vehicle (1) are disposed, wherein the video interface connector (31) is connected to a capacitor (25) and a parallel-to-serial converter (26), wherein the video interface connector (31) and/or the capacitor (25) and/or the parallel-to-serial converter (26) are surrounded by a device (32) shielding electromagnetic radiation.

公开(公告)号：US09793887B2

公开(公告)日：2017-10-17

申请号：US14217179

申请日：2014-03-17

Applicant: Zonit Structured Solutions, LLC

Inventor： Steve Chapel ,  William Pachoud

IPC: H03K17/13 ,  H03K17/687 ,  H05K3/30 ,  H05K1/18 ,  H05K5/00 ,  H05K1/02

CPC classification number: H03K17/133 ,  H03K17/687 ,  H05K1/0204 ,  H05K3/306 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10363 ,  H05K2201/2036 ,  Y10T29/4913 ,  Y10T307/937

Abstract: A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

公开(公告)号：US09788428B2

公开(公告)日：2017-10-10

申请号：US15135248

申请日：2016-04-21

Applicant: Innodisk Corporation

Inventor： Chih-Hsing Chen ,  Hsiao-Yu Wang

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

公开(公告)号：US09788412B2

公开(公告)日：2017-10-10

申请号：US14726263

申请日：2015-05-29

Applicant: Trane International Inc.

Inventor： Steven K. Klingemann ,  Alejandro Jimenez

IPC: G02F1/1333 ,  H05K1/02 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/0215 ,  G02F1/133308 ,  G02F2001/133334 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/042

Abstract: Techniques and arrangements for forming ground bonds between a plurality of components are provided. In one form, a grounding arrangement includes a first circuit board including a first ground plane and a flange member electrically coupled to the first ground plane. The arrangement also includes a second circuit board including a second ground plane, and a polymeric member including an electrically conductive coating. The polymeric member forms a bond between the first ground plane, the flange member, and the second ground plane. In one particular but non-limiting aspect of this form, the grounding arrangement is utilized in a human machine interface having a liquid crystal display. Further embodiments, forms, objects, features, advantages, aspects, and benefits shall become apparent from the description and drawings.

公开(公告)号：US20170290158A1

公开(公告)日：2017-10-05

申请号：US15085080

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Jeffrey A. Pihlman ,  John C. Tomlin

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/498 ,  H05K3/40 ,  H05K3/10 ,  H05K3/34 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/50 ,  H01R12/727 ,  H05K1/0262 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/113 ,  H05K1/14 ,  H05K1/141 ,  H05K1/144 ,  H05K3/10 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10037 ,  H05K2201/10734 ,  H05K2201/2036

Abstract: IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers.