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公开(公告)号：US09980380B2
公开(公告)日：2018-05-22
申请号：US15331987
申请日：2016-10-24
Inventor： Rainer Pludra , Dietmar Drofenik , Johannes Stahr , Siegfried Götzinger , Ljubomir Mareljic
CPC classification number: H05K1/142 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/225 , H05K3/368 , H05K3/4691 , H05K3/4694 , H05K2201/0187 , H05K2201/09163 , H05K2201/09845 , H05K2203/1461 , Y10T29/49155
Abstract: In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.
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公开(公告)号：US20180024411A1
公开(公告)日：2018-01-25
申请号：US15657222
申请日：2017-07-24
Applicant: SUMITOMO OSAKA CEMENT CO., LTD.
Inventor： Norikazu MIYAZAKI , Toru SUGAMATA
CPC classification number: G02F1/2255 , G02F1/0121 , G02F2001/212 , H05K1/0206 , H05K1/0274 , H05K1/028 , H05K1/113 , H05K1/118 , H05K3/306 , H05K3/363 , H05K2201/0338 , H05K2201/09036 , H05K2201/09163 , H05K2201/09181 , H05K2201/09481 , H05K2201/10121
Abstract: An optical modulator including a flexible printed circuit performing an electrical connection with an external circuit substrate, in which the flexible printed circuit includes a plurality of first pads and the like provided on one surface of the flexible printed circuit along one side of the flexible printed circuit, a plurality of second pads and the like provided on the other surface of the flexible printed circuit at locations that respectively correspond to the plurality of first pads, and a plurality of metal films and the like provided at locations that respectively correspond to the first pads on a side surface of the flexible printed circuit along the one side of the flexible printed circuit.
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公开(公告)号：US09652049B2
公开(公告)日：2017-05-16
申请号：US14640313
申请日：2015-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyunghoon Song , Jungje Bang , Kicheol Bae , Kwangsub Lee , Seyoung Jang
CPC classification number: G06F3/0202 , H01H13/48 , H01H2215/004 , H01H2215/036 , H01H2221/05 , H01R13/703 , H01R24/62 , H05K1/184 , H05K2201/09163 , H05K2201/10053 , H05K2201/10189 , H05K2201/10446 , H05K2201/10537
Abstract: An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.
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公开(公告)号：US09618564B2
公开(公告)日：2017-04-11
申请号：US14164769
申请日：2014-01-27
Applicant: Apple Inc.
Inventor： Sean A. Mayo , Shankar S. Pennathur
CPC classification number: G01R31/2818 , H05K1/0268 , H05K1/147 , H05K2201/09036 , H05K2201/09163
Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.
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45.发明申请公开(公告)号：US20170042028A1
公开(公告)日：2017-02-09
申请号：US15331987
申请日：2016-10-24
Inventor： Rainer PLUDRA , Dietmar DROFENIK , Johannes STAHR , Siegfried GÖTZINGER , Ljubomir MARELJIC
CPC classification number: H05K1/142 , H05K1/115 , H05K1/185 , H05K1/189 , H05K3/225 , H05K3/368 , H05K3/4691 , H05K3/4694 , H05K2201/0187 , H05K2201/09163 , H05K2201/09845 , H05K2203/1461 , Y10T29/49155
Abstract: In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.
Abstract translation: 在制造由至少两个印刷电路区域组成的印刷电路板的方法中，其中印刷电路板区域各自损害至少一个导电层和/或至少一个器件或一次导电部件，其中印刷电路板区域为 连接到另一个，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过联接或连接彼此连接，并且其中在印刷电路板区域的耦合或连接之后，至少一个 印刷电路板的附加层或层被施加在印刷电路板区域上，附加层被实施为导电层，其通过电镀通孔与导电层或集成在印刷电路中的器件或部件接触连接 董事会区域。
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Patent Agency Ranking
公开(公告)号：US20160163610A1
公开(公告)日：2016-06-09
申请号：US14428376
申请日：2013-08-28
Applicant: Shimon PODVAL , QUBEICON LTD.
Inventor： Shimon Podval
IPC: H01L23/13 , H05K1/11 , H05K1/02 , H01L25/065 , H01L23/498 , H05K1/14
CPC classification number: H01L23/13 , H01L23/49838 , H01L23/49855 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/81 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48465 , H01L2224/48471 , H01L2224/48472 , H01L2224/49113 , H01L2224/49177 , H01L2224/73265 , H01L2224/81203 , H01L2224/81205 , H01L2224/81385 , H01L2924/00014 , H01L2924/15162 , H01L2924/15192 , H05K1/0204 , H05K1/117 , H05K1/141 , H05K3/3415 , H05K3/3442 , H05K2201/041 , H05K2201/09063 , H05K2201/09154 , H05K2201/09163 , H05K2201/0939 , H05K2201/09472 , Y02P70/613 , H01L2924/014 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207
Abstract: A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess.
Abstract translation: 一种用于将半导体器件连接到外部电路的基座，所述基座包括：平面基板，由绝缘材料形成并且具有相对窄的边缘表面和第一和第二相对大的表面; 沿着边缘表面形成的至少一个凹部; 形成在所述至少一个凹部中的每一个的表面上的导电材料层; 所述第一表面上的第一多个焊盘被配置为与半导体器件电接触; 以及导电连接，每个导电连接将所述第一多个焊盘中的焊盘电连接到所述至少一个凹部的凹部的导电材料层。
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公开(公告)号：US20150349446A1
公开(公告)日：2015-12-03
申请号：US14290328
申请日：2014-05-29
Applicant: Ideal Industries, Inc.
Inventor： Alan E. Zantout
CPC classification number: H01R12/732 , H01R4/4818 , H01R11/01 , H01R12/53 , H01R12/7023 , H01R12/7029 , H01R12/7052 , H01R12/714 , H05K1/142 , H05K3/368 , H05K2201/09163 , H05K2201/10189 , H05K2201/10265 , H05K2201/1031 , H05K2201/10424 , Y02P70/611
Abstract: An electrical connector has one or more body portions in which is disposed an electrical terminal having at least one contact pad interface for coupling to a contact pad of at least one printed circuit board (PCB). The body has an associated fastening device which is used to mechanically and electrically couple the electrical connector to the at least one PCB. The electrical connector may be provided with a full or partial hourglass-like shape, when viewed from the side and/or from above, to facilitate its use with a PCB that carries a source of light, such as an LED.
Abstract translation: 电连接器具有一个或多个主体部分，其中设置有具有至少一个接触垫接口的电端子，用于耦合到至少一个印刷电路板（PCB）的接触焊盘。 主体具有相关联的紧固装置，其用于将电连接器机械地和电耦合到至少一个PCB。 当从侧面和/或从上方观察时，电连接器可以设置有全部或部分沙漏形状，以便于其与携带诸如LED的光源的PCB一起使用。
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公开(公告)号：US20150244465A1
公开(公告)日：2015-08-27
申请号：US14624766
申请日：2015-02-18
Applicant: OptoMedia Technology Inc.
Inventor： Hui-Tsuo Chou , Tung Lou Lin , Hsieh Yi Chou
CPC classification number: H04B10/501 , G02B6/0066 , G02B6/0083 , G02B6/4249 , G02B6/426 , G02B6/428 , G02B6/4292 , G11B7/0933 , G11B7/0935 , G11B7/13925 , H04B10/60 , H05K3/301 , H05K3/303 , H05K3/3405 , H05K2201/09163 , H05K2201/10121 , H05K2201/10151 , H05K2201/10303
Abstract: An optical signal emitter includes a transmitting lens; a lens supporting portion, extending from an edge of the transmitting lens to defined a containing space surrounded by the transmitting lens and the lens supporting portion; a lens carrier, for carrying the transmitting lens and the lens supporting portion, wherein a coupling surface is defined on the lens carrier and at least a part of the lens supporting portion is coplanar with the lens carrier with respect to the coupling surface; a light transmitter, disposed in the containing space and coaxially with the transmitting lens, so as to define an light transmission path for light passing through coupling surface by an alignment between the light transmitter and the transmitting lens; at least one engagement portion, disposed on the coupling surface; at least one magnet, disposed on the lens carrier.
Abstract translation: 光信号发射器包括发射透镜; 透镜支撑部分，其从所述透射透镜的边缘延伸以限定由所述透射透镜和所述透镜支撑部分包围的容纳空间; 透镜载体，用于承载透镜和透镜支撑部分，其中耦合表面限定在透镜载体上，并且透镜支撑部分的至少一部分与透镜支架相对于耦合表面共面; 光传输器，设置在容纳空间中并与发射透镜同轴，以便通过光发射器和发射透镜之间的对准来限定通过耦合表面的光的光传输路径; 设置在所述联接面上的至少一个接合部; 设置在透镜载体上的至少一个磁体。
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公开(公告)号：US20150212114A1
公开(公告)日：2015-07-30
申请号：US14164769
申请日：2014-01-27
Applicant: Apple Inc.
Inventor： Sean A. Mayo , Shankar S. Penathur
CPC classification number: G01R31/2818 , H05K1/0268 , H05K1/147 , H05K2201/09036 , H05K2201/09163
Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.
Abstract translation: 电气部件可以焊接到印刷电路。 印刷电路可以具有带开口的边缘。 开口中的印刷电路触点可以被配置为与柔性印刷电路或其它外部结构上的配合触点形成电连接。 测试人员可以通过传送信号通过触点来测试电气元件。 在测试之后，外部结构可以从开口移除。 然后可以用绝缘体填充开口以隔离印刷电路触点。 印刷电路可以具有在印刷电路表面上在地下延伸的迹线，可以具有由去除印刷电路的部分时切成两半的接触形成的边缘测试点，或者可以具有形成的通孔模具 通过电气元件上的密封剂。
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公开(公告)号：US20150157862A1
公开(公告)日：2015-06-11
申请号：US14563778
申请日：2014-12-08
Applicant: Second Sight Medical Products, Inc.
Inventor： Robert J. Greenberg , Neil H. Talbot , James S. Little
CPC classification number: H05K3/282 , A61B5/0006 , A61B5/0478 , A61B5/4836 , A61B5/6868 , A61B2562/0209 , A61B2562/046 , A61B2562/125 , A61N1/0529 , A61N1/0531 , A61N1/0534 , A61N1/3606 , A61N1/36071 , A61N1/36082 , A61N1/36139 , A61N1/375 , A61N1/3752 , A61N1/3754 , H01L23/055 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H05K1/02 , H05K1/0271 , H05K1/028 , H05K1/0281 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K1/111 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/0044 , H05K3/005 , H05K3/0058 , H05K3/28 , H05K3/321 , H05K3/363 , H05K3/4015 , H05K3/4061 , H05K2201/0245 , H05K2201/053 , H05K2201/055 , H05K2201/09063 , H05K2201/09145 , H05K2201/09163 , H05K2201/097 , H05K2201/09981 , H05K2201/10303 , H05K2201/10318 , H05K2201/10674 , H05K2201/10795 , H05K2201/10931 , H05K2201/2009 , H05K2203/0195 , H05K2203/025 , H05K2203/0278 , H05K2203/0307 , H05K2203/068 , H05K2203/082 , H05K2203/1322 , H05K2203/1327 , H05K2203/1394 , H05K2203/1461 , H05K2203/1476 , H05K2203/162 , H05K2203/304 , H01L2924/00014 , H01L2924/00
Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.
Abstract translation: 本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录 的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。 该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。 大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。 该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。 本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。
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