公开(公告)号：US09655238B2

公开(公告)日：2017-05-16

申请号：US14698276

申请日：2015-04-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazutaka Kobayashi

IPC: H05K1/05 ,  H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K1/0256 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/181 ,  H05K7/205 ,  H05K2201/0195 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10969

Abstract: A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.

公开(公告)号：US09605983B2

公开(公告)日：2017-03-28

申请号：US14299563

申请日：2014-06-09

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/02 ,  G01D11/30 ,  G01D5/14 ,  G01D5/244 ,  H05K1/18

CPC classification number: G01R33/09 ,  G01D5/142 ,  G01D5/24442 ,  G01D11/305 ,  G01R33/0023 ,  G01R33/0047 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48245 ,  H01L2924/00014 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10522 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

公开(公告)号：US20160295684A1

公开(公告)日：2016-10-06

申请号：US15184511

申请日：2016-06-16

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Seok Cho ,  Chang Sung Kim

IPC: H05K1/02

CPC classification number: H05K1/0203 ,  H05K1/0209 ,  H05K1/0227 ,  H05K1/09 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/0376 ,  H05K2201/09227 ,  H05K2201/09881

Abstract: Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.

公开(公告)号：US20160270222A1

公开(公告)日：2016-09-15

申请号：US15160203

申请日：2016-05-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Takayuki Tsukizawa

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0298 ,  H05K1/115 ,  H05K3/4682 ,  H05K2201/09227 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: A multilayer wiring board includes: a multilayer body including a plurality of insulating layers; a lower outer electrode provided on a lower surface of the multilayer body; a first via conductor connected at one end to the lower outer electrode; a first in-plane conductor connected to another end of the first via conductor; a second via conductor provided within the multilayer body on a surface of the first in-plane conductor on the opposite side from a surface of the first in-plane conductor in a position distanced from the first via conductor viewed in a direction orthogonal to a layering direction of the multilayer body, one end of the second via conductor being connected to the first in-plane conductor; and a second in-plane conductor connected to another end of the second via conductor. A line width of the first in-plane conductor is narrower than that of the second in-plane conductor.

Abstract translation: 多层布线基板包括：多层绝缘层，包括多个绝缘层; 设置在所述多层体的下表面上的下外电极; 第一通孔导体，其一端连接到下部外部电极; 连接到第一通孔导体的另一端的第一面内导体; 第二通孔导体，其设置在所述第一面内导体的表面上，所述第二通孔导体在所述第一面内导体的与所述第一面内导体的表面相反的一侧的表面上，在远离所述第一通孔导体的位置， 所述多层体的方向，所述第二通路导体的一端与所述第一面内导体连接; 以及连接到第二通孔导体的另一端的第二面内导体。 第一面内导体的线宽比第二面内导体窄。

公开(公告)号：US09398686B2

公开(公告)日：2016-07-19

申请号：US14454850

申请日：2014-08-08

Applicant: Samsung Display Co., LTD.

Inventor： Ki-Hae Shin ,  Jeong-Hun Go ,  Hee-Un Ku ,  Young-Sun Kim ,  Hoe-Seok Na

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.

Abstract translation: 一种带包装，包括：基底基板，包括信号传输区域和从信号传输区域突出的突出区域;安装在基底基板上的集成电路芯片;以及设置在基底基板上的引线， 集成电路芯片，与第一部分电连接并沿第一方向延伸的第二部分，以及与第二部分电连接并沿与​​第一方向交叉的第二方向延伸的第三部分。

公开(公告)号：US20160124550A1

公开(公告)日：2016-05-05

申请号：US14992429

申请日：2016-01-11

Applicant: FUJIFILM Corporation

Inventor： Nobuyuki Tada ,  Yasushi Endo ,  Akihiro Hashimoto ,  Tadashi Kuriki

IPC: G06F3/044 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K1/03

CPC classification number: G06F3/044 ,  G02F1/1345 ,  G02F1/13452 ,  G02F1/136286 ,  G06F3/041 ,  G06F3/045 ,  G06F2203/04107 ,  G06F2203/04112 ,  H05K1/02 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/117 ,  H05K2201/0108 ,  H05K2201/09227

Abstract: A wiring board includes a plurality of first terminal parts for electrically connecting with a control circuit and disposed corresponding to a plurality of first electrode parts, and first terminal wiring parts for electrically connecting the plurality of first electrode parts and the corresponding first terminal parts. Each of the first terminal wiring parts has, in at least a portion thereof falling in a circle with a radius of 10 mm centering around a boundary part between the first terminal wiring parts and the corresponding first terminal parts, a portion having a line width of 5 μm to 100 μm inclusive, the wiring resistance value of the first terminal wiring parts connected to the first terminal parts being 100 ohms to 10 kohms inclusive.

Abstract translation: 布线板包括多个用于与控制电路电连接并且对应于多个第一电极部分设置的第一端子部分和用于电连接多个第一电极部分和相应的第一端子部分的第一端子布线部分。 所述第一端子配线部的至少一部分在所述第一端子配线部和所述对应的第一端子部之间的边界部的周围以半径为10mm的圆为中心，具有线宽为 连接到第一端子部分的第一端子布线部分的布线电阻值为100欧姆至10千欧姆，包括5微米至100微米。

公开(公告)号：US09319092B2

公开(公告)日：2016-04-19

申请号：US13966463

申请日：2013-08-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiromichi Kitajima

IPC: H04B7/005 ,  H04B1/44 ,  H04B1/00 ,  H04B1/52 ,  H05K1/02

CPC classification number: H04B1/44 ,  H04B1/006 ,  H04B1/52 ,  H05K1/0243 ,  H05K2201/09227

Abstract: In a high frequency module, mounting lands for reception signal output side ports of SAW duplexers, respectively, on a top surface of a multilayer body are arranged so as to be superposed on reception side external connection lands on a bottom surface of the multilayer body along the layer direction and the mounting lands are directly connected to the reception side external connection lands via holes. Transmission side external connection lands are located on the bottom surface of the multilayer body. The transmission side external connection lands are connected to mounting lands for transmission signal input side ports on the top surface of the multilayer body via certain inner layer electrodes that do not come close to the via holes of the reception system and the via holes.

Abstract translation: 在高频模块中，分别在多层体的顶面上的SAW双工器的接收信号输出侧端口的安装用地面被布置成叠置在多层体的底面的接收侧外部连接台面上 层方向和安装焊盘直接连接到接收侧的外部连接焊盘通孔。 传输侧外部连接平台位于多层体的底面上。 传输侧外部连接焊盘通过不靠近接收系统和通孔的通孔的某些内层电极连接到多层体的顶表面上的透射信号输入侧端口的安装焊盘。

公开(公告)号：US20160100486A1

公开(公告)日：2016-04-07

申请号：US14860026

申请日：2015-09-21

Applicant: AU OPTRONICS CORPORATION

Inventor： YING-JI CHEN ,  MEI-CHUN CHENG ,  TENG-LIANG YU ,  CHE-HAO YANG ,  CHIA-CHU WANG

IPC: H05K1/18 ,  H05K1/02 ,  G06F3/041

CPC classification number: H05K1/189 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/09227 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: A display module is provided including a display panel and an integrated circuit unit. The display panel is curved into a curved shape around a curvature axis and has a curved side, wherein the side also curves around the curvature axis. The integrated circuit unit is formed as a long stripe shape and has a first long side extending along an extending direction of the integrated circuit unit. The integrated circuit unit is directly or indirectly connected to the side, and the first long side extends along the extending direction of the curvature axis. Since the extending direction of the integrated circuit unit is aligned with the curvature axis, the integrated circuit unit will not be easily affected by the curvature of the display panel.

Abstract translation: 提供了一种显示模块，包括显示面板和集成电路单元。 显示面板围绕曲率轴线弯曲成弯曲形状并且具有弯曲侧面，其中该侧面也围绕曲率轴线弯曲。 集成电路单元形成为长条状，并且具有沿着集成电路单元的延伸方向延伸的第一长边。 集成电路单元直接或间接地连接到侧面，并且第一长边沿曲率轴线的延伸方向延伸。 由于集成电路单元的延伸方向与曲率轴对齐，所以集成电路单元不会容易受到显示面板的曲率的影响。

公开(公告)号：US20160062172A1

公开(公告)日：2016-03-03

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract translation: 薄膜封装芯片包括基底基板，输入线，集成电路（IC）芯片和输出线。 输入线设置在基底基板上.IC芯片电连接到输入线。 输出线包括主输出和副输出线。主输出线与IC芯片电连接，并从IC芯片沿第一方向延伸。 副输出线电连接到IC芯片。 子输出线包括至少六个弯曲部分，并且沿第一方向延伸。

公开(公告)号：US20150285474A1

公开(公告)日：2015-10-08

申请号：US14435163

申请日：2013-10-09

Applicant: ZUMTOBEL LIGHTING GMBH

Inventor： Kenneth Martin ,  David Gajdos ,  Steffen Block ,  Christian Daniel

IPC: F21V21/00 ,  F21V23/06

CPC classification number: F21V21/00 ,  F21V23/06 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K3/222 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173 ,  H01L2924/00

Abstract: A printed circuit board for populating with illumination bodies, in particular LEDs, the board having population regions with connection options for the illumination bodies. A number of the population regions are connected in series by conductor tracks to form a group. The printed circuit board is further provided with additional connection options for electrical connection elements, in particular for 0-ohm resistors, via which at least some of the groups can be connected either in parallel or in series.

Abstract translation: 一种用于填充照明体，特别是LED的印刷电路板，具有用于照明体的连接选项的具有群体区域的板。 多个人口区域通过导体轨迹串联连接，形成一组。 印刷电路板还具有用于电连接元件的附加连接选项，特别是用于0欧姆电阻器，通过该连接元件，至少一些组可并联或串联连接。