公开(公告)号：US3827004A

公开(公告)日：1974-07-30

申请号：US32475573

申请日：1973-01-18

Applicant: DU PONT

Inventor： HEUVEL M ,  THELISSEN W

IPC: H01R12/58 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01R12/58 ,  H01R12/585 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10878

Abstract: A pin for mounting in a hole in a circuit board without injuring plating in the hole or connections between such plating and multi-layer circuitry in the board. The pin includes pairs of collapsible fins which are bent toward each other when inserted into the hole.

Abstract translation: 用于安装在电路板的孔中的引脚，而不会损伤孔中的电镀或板中的这种电镀和多层电路之间的连接。 销包括成对的可折叠翅片，当插入孔中时它们彼此弯曲。

公开(公告)号：US2898518A

公开(公告)日：1959-08-04

申请号：US54090255

申请日：1955-10-17

Applicant: PHILCO CORP

Inventor： LYNN RAOUL B

IPC: H01R12/70 ,  H05K3/30

CPC classification number: H01R12/7076 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2203/1446

公开(公告)号：US2352454A

公开(公告)日：1944-06-27

申请号：US40926641

申请日：1941-09-02

Applicant: CHICAGO TELEPHONE SUPPLY CO

Inventor： SCHELLENGER NEWTON C ,  BUDD WILBERT H

IPC: H01C1/014 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01C1/014 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09418 ,  H05K2201/10196 ,  H05K2201/10787 ,  H05K2201/10825 ,  H05K2201/10878 ,  H05K2203/1446 ,  Y10T29/49922 ,  Y10T403/49

公开(公告)号：US20180288878A1

公开(公告)日：2018-10-04

申请号：US15474716

申请日：2017-03-30

Applicant: Infineon Technologies Austria AG

Inventor： Fabio Brucchi

IPC: H05K1/18 ,  H05K1/11 ,  H01L23/04 ,  H01L23/488 ,  H01R12/58

CPC classification number: H05K1/184 ,  H01L23/04 ,  H01L23/488 ,  H01R12/58 ,  H01R12/585 ,  H01R12/712 ,  H05K1/115 ,  H05K3/308 ,  H05K2201/10166 ,  H05K2201/1059 ,  H05K2201/10787 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: A device includes a circuit element, a housing for the circuit element and a terminal for coupling the circuit element to an electrical circuit. The terminal includes an engagement portion and a sleeve portion. The engagement portion is configured to engage a base for the electrical circuit. The sleeve portion couples the engagement portion to the circuit element. The housing encloses the sleeve portion.

公开(公告)号：US20170133775A1

公开(公告)日：2017-05-11

申请号：US15409689

申请日：2017-01-19

Applicant: Lear Corporation

Inventor： Bert W. Eakins ,  George E. Fox

IPC: H01R12/70 ,  H01R4/02

CPC classification number: H01R12/707 ,  H01R4/02 ,  H01R4/028 ,  H01R12/585 ,  H01R43/205 ,  H05K3/3447 ,  H05K3/4015 ,  H05K2201/097 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/2072 ,  H05K2203/047 ,  H05K2203/1572

Abstract: A circuit board assembly may include a circuit board, a first electrical terminal, and a layer of solder paste. The circuit board may include a minimum thickness, a first side, and a second side opposite the first side. The first electrical terminal may include a solder tab. The layer of solder paste may be disposed on the first side of the circuit board. The solder tab of the first electrical terminal may extend into the first side of the circuit board but not beyond the second side of the circuit board.

公开(公告)号：US20170085015A1

公开(公告)日：2017-03-23

申请号：US15124519

申请日：2015-02-25

Applicant: Sumitomo Wiring Systems, Ltd

Inventor： Hideki Goto

IPC: H01R12/58 ,  H05K1/11

CPC classification number: H01R12/58 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10818

Abstract: The present invention provides a printed substrate having a novel structure in which substrate terminals can be fixed to the printed substrate without needing a base, and the substrate terminals can be press-fitted into through-holes without applying pressing force to printed wiring and a plating layer in the through-holes, and also provides a printed substrate with terminals that uses this printed substrate. A printed substrate includes through-holes into which the first end portions of substrate terminals are to be inserted. The through-holes each include press-fitting regions into which the first end portion of a substrate terminal is to be press-fitted, and conduction regions arranged so as to oppose the outer circumferential surfaces of the first end portion of the substrate terminal via gaps in directions perpendicular to the axis. Printed wiring is connected to the conduction regions, and a plating layer is adhered to the conduction regions.

公开(公告)号：US20160316564A1

公开(公告)日：2016-10-27

申请号：US15097018

申请日：2016-04-12

Applicant: Braun GmbH

Inventor： Christian ELLSAESSER

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/184 ,  H05K1/115 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/1009 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10818 ,  H05K2201/10871 ,  H05K2203/046 ,  H05K2203/1173

Abstract: A special electric component, such as a motor, an accumulator, or an electric subassembly, having at least one soldering pin for solder-joining the special electric component to a printed circuit board. The soldering pin has a connection end that comprises a front section at a free end of the soldering pin and a first section adjacent the front section. The front section has a width that is smaller than the width of the first section. A printed circuit board assembly and an electric device comprising at least one special electric component.

Abstract translation: 具有至少一个用于将特殊电气部件焊接到印刷电路板的焊接销的电动机，蓄电池或电子组件的特殊电气部件。 焊接销具有连接端，其包括在焊接销的自由端处的前部部分和与前部部分相邻的第一部分。 前部的宽度小于第一部分的宽度。 一种印刷电路板组件和包括至少一个特殊电气部件的电气装置。

公开(公告)号：US20160181710A1

公开(公告)日：2016-06-23

申请号：US14573195

申请日：2014-12-17

Applicant: LEAR CORPORATION

Inventor： Bert W. Eakins ,  George E. Fox ,  Steven F. Gawron

IPC: H01R12/58 ,  H01R43/20

CPC classification number: H01R12/585 ,  H01R13/112 ,  H01R13/428 ,  H01R43/205 ,  H05K1/14 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10295 ,  H05K2201/10787 ,  H05K2201/10871 ,  H05K2201/10878 ,  H05K2203/0195

Abstract: A printed circuit board (PCB) assembly includes a printed circuit board and first and second electrical terminals mounted thereto. The first electrical terminal comprises a body having a first end and a second end, a mounting member extending outwardly from the first end configured for insertion into an aperture formed in the PCB, shoulders defined adjacent the mounting member, and a first insertion tab extending outwardly from the body at the first end thereof. The second electrical terminal is mounted adjacent the first electrical terminal and comprises a body having a first end and a second end, a mounting portion extending outwardly from the first end configured for insertion into an aperture formed in the PCB, shoulders defined adjacent the mounting portion, and a second insertion tab extending outwardly from the body at the first end thereof. The first insertion tab and the second insertion tab are axially spaced apart.

Abstract translation: 印刷电路板（PCB）组件包括印刷电路板和安装在其上的第一和第二电气端子。 所述第一电端子包括具有第一端和第二端的主体，从所述第一端向外延伸的安装构件，所述第一端构造成用于插入形成在所述PCB中的孔中，邻近所述安装构件限定的肩部和向外延伸的第一插入突出部 从身体的第一端。 所述第二电端子被安装在所述第一电端子附近并且包括具有第一端和第二端的本体，从所述第一端向外延伸的安装部分，所述第一端被构造成用于插入到形成在所述PCB中的孔中， 以及在主体的第一端处从主体向外延伸的第二插入片。 第一插入片和第二插入片轴向间隔开。

公开(公告)号：US20150077940A1

公开(公告)日：2015-03-19

申请号：US14548805

申请日：2014-11-20

Applicant: Carmen Rapisarda

Inventor： Carmen Rapisarda

IPC: H05K1/11 ,  H05K1/18 ,  H01R12/70 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01R12/7076 ,  H05K1/0203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/284 ,  H05K3/325 ,  H05K2201/035 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10454 ,  H05K2201/10598 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/10795 ,  Y02P70/611

Abstract: An electronic circuit contains a circuit board with conducting tracks to which one or more electronic components with conducting contacts are positioned overlying portions of the conducting tracks and each such electronic component is held in place by a clamp that is in contact with the top surface of the electronic components so as to hold their conducting contacts in electrical contact with the conducting tracks of the circuit board. The clamp can include a resilient layer held between the top surface of electronic components and a rigid clamping sheet.

Abstract translation: 电子电路包含具有导电轨道的电路板，一个或多个具有导电触点的电子部件定位在导电轨道的上部，并且每个这样的电子部件通过夹具保持在适当的位置，所述夹具与 电子部件，以便将其导电触点保持与电路板的导电轨道电接触。 夹具可以包括保持在电子部件的顶表面和刚性夹紧片之间的弹性层。

公开(公告)号：US08866300B1

公开(公告)日：2014-10-21

申请号：US13488991

申请日：2012-06-05

Applicant: David W. Sherrer ,  James R. Reid, Jr.

Inventor： David W. Sherrer ,  James R. Reid, Jr.

IPC: H01L23/48 ,  H02G15/00

CPC classification number: H05K3/341 ,  B81C1/00357 ,  B81C2201/019 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/291 ,  H01L2224/3015 ,  H01L2224/32227 ,  H01L2224/83191 ,  H01L2224/83815 ,  H01L2924/12042 ,  H05K1/111 ,  H05K1/181 ,  H05K3/321 ,  H05K3/34 ,  H05K3/4007 ,  H05K2201/10674 ,  H05K2201/10787 ,  H05K2201/10984 ,  H05K2203/0465 ,  H05K2203/1173 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: Structures, materials, and methods to control the spread of a solder material or other flowable conductive material in electronic and/or electromagnetic devices are provided.

Abstract translation: 提供了用于控制电子和/或电磁装置中焊料或其它可流动的导电材料的扩散的结构，材料和方法。