公开(公告)号：US20060033517A1

公开(公告)日：2006-02-16

申请号：US11256514

申请日：2005-10-19

Applicant: Igor Khandros ,  Gaetan Mathieu

Inventor： Igor Khandros ,  Gaetan Mathieu

IPC: G01R31/02

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06716 ,  G01R1/06744 ,  G01R1/07378 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/328 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/049 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49179 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/72

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。

公开(公告)号：US06992376B2

公开(公告)日：2006-01-31

申请号：US10623073

申请日：2003-07-17

Applicant: Edward W. Jaeck

Inventor： Edward W. Jaeck

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/52 ,  H01L23/34 ,  H05K7/06

CPC classification number: H05K1/0281 ,  H01L23/5387 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/189 ,  H05K2201/0311 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/2009 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic package of the kind having a folded substrate is provided. The substrate is configured so that a stress concentration is created where folding is desired. In the present example, the stress concentration is created with first a resilient metal ground layer that resists bending and has an edge that promotes the creation of a stress concentration in a flexible layer at or near the edge. A second metal ground layer resists bending in another portion of the substrate, and also has an edge creating a stress concentration in a different area of the flexible layer. The portions of the substrate having the first and second resilient metal ground layers can be folded over one another with substantially no bending in these portions, while a fold portion between the edges bends to allow for folding of the substrate.

公开(公告)号：US20050266703A1

公开(公告)日：2005-12-01

申请号：US11140195

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过柔性非导电膜保持在适当的位置，其中形成有H形的切口并且插入导电环。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20050056684A1

公开(公告)日：2005-03-17

申请号：US10667008

申请日：2003-09-17

Applicant: Ee Wong ,  Ranjan Rajoo ,  Wai Wong ,  Mahadevan Iyer

Inventor： Ee Wong ,  Ranjan Rajoo ,  Wai Wong ,  Mahadevan Iyer

IPC: B23K31/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/303 ,  B23K31/02 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/0129 ,  H05K2201/0311 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/0465 ,  H05K2203/1105 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2224/81

Abstract: A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

Abstract translation: 提供了一种延长焊点的方法和装置。 该方法开始于在第一基底上形成延伸器。 伸长器包括膨胀器和密封剂以封装膨胀器。 形成焊接接头以将第一基板连接到第二基板。 此后，密封剂被软化以将膨胀器从压缩状态释放以拉长焊接接头。 用于拉长焊接接头的装置包括其上形成有延伸器的基板。 伸长器包括处于压缩状态的膨胀器和用于封装膨胀器的密封剂。

公开(公告)号：US20050018352A1

公开(公告)日：2005-01-27

申请号：US10878044

申请日：2004-06-29

Applicant: Min-pyo Hong ,  Yong-kyu Byun ,  Jeong-seok Koh

Inventor： Min-pyo Hong ,  Yong-kyu Byun ,  Jeong-seok Koh

IPC: G11B33/12 ,  G11B5/54 ,  G11B21/02 ,  G11B25/04 ,  H02K11/00 ,  H05K1/02 ,  H05K1/05 ,  H05K3/36

CPC classification number: H05K3/365 ,  H05K1/056 ,  H05K2201/0311

Abstract: A flexible printed circuit (FPC), electrically connecting a spindle motor on a base of a disk drive with a printed circuit board (PCB) outside of the base, and a disk drive including the FPC, are provided. The FPC includes a wiring portion having one end connected to the spindle motor; a bonded portion connected to the other end of the wiring portion and attached to the base; electrode supports, each having a predetermined elasticity and extending from an outside edge of the bonded portion; a wiring disposed along the wiring portion and the bonded portion; and first electrodes disposed on the electrode supports and connected to the wiring. The first electrodes contact second electrodes disposed on the PCB due to the elasticities of the electrode supports. The disk drive allows the spindle motor to be electrically connected to the PCB using only the FPC, i.e., without using a separate connector.

Abstract translation: 提供了将磁盘驱动器的基座上的主轴电机与基座外部的印刷电路板（PCB）电连接的柔性印刷电路（FPC）以及包括FPC的磁盘驱动器。 FPC包括具有连接到主轴电机的一端的布线部分; 接合部，其与所述配线部的另一端连接并安装于所述基座; 每个电极支撑件具有预定的弹性并且从接合部分的外边缘延伸; 沿着布线部分和接合部分布置的布线; 以及设置在所述电极支架上并连接到所述布线的第一电极。 由于电极支撑件的弹性，第一电极接触设置在PCB上的第二电极。 磁盘驱动器允许主轴电机仅使用FPC电连接到PCB，即不使用单独的连接器。

公开(公告)号：US20030164244A1

公开(公告)日：2003-09-04

申请号：US10373067

申请日：2003-02-26

Applicant: RYOWA ELECTRONICS CO., LTD.

Inventor： Yasunori Miyazawa ,  Katsuji Kaminishi

IPC: H01L023/02

CPC classification number: H05K1/0251 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01P1/047 ,  H01P5/02 ,  H01P5/085 ,  H01R9/0515 ,  H01R24/50 ,  H05K1/0222 ,  H05K1/0298 ,  H05K3/0052 ,  H05K3/325 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0715 ,  H05K2201/09618 ,  H05K2201/09809 ,  H05K2201/10303 ,  H05K2201/10356 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A cut via is formed in an end of a multilayer circuit board of the first transmission line, and a clearance is provided between the cut via and a ground pattern for achieving an impedance matching between the first and second transmission lines. The cut via of a first transmission line which may be a stripline or a microstrip line, and an electrode of the second transmission line are connected to each other, and ground patterns of the first and second transmission lines are connected to each other. The first and second transmission lines have respective signal lines positioned substantially coaxially with each other.

Abstract translation: 切割通孔形成在第一传输线的多层电路板的端部，并且在切割通孔和接地图案之间设置间隙，以实现第一和第二传输线之间的阻抗匹配。 可以是带状线或微带线的第一传输线的切断通路和第二传输线的电极彼此连接，并且第一和第二传输线的接地图形彼此连接。 第一和第二传输线具有彼此基本同轴地定位的各个信号线。

公开(公告)号：US06564450B2

公开(公告)日：2003-05-20

申请号：US09728336

申请日：2000-12-01

Applicant: Jürgen Engbring ,  Ulrich Grzesik ,  Guido Renner ,  Jean-Francois Soule-Noulibos ,  Jacques Gerome ,  Jean-Michel Huot

Inventor： Jürgen Engbring ,  Ulrich Grzesik ,  Guido Renner ,  Jean-Francois Soule-Noulibos ,  Jacques Gerome ,  Jean-Michel Huot

IPC: H05K336

CPC classification number: H05K3/36 ,  H01R12/52 ,  H01R12/714 ,  H05K1/145 ,  H05K3/325 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/097 ,  H05K2203/0557 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/53174 ,  Y10T29/532

Abstract: In a printed circuit board pair, each of the printed circuit boards having a contact region with contact elements, a contact-making system includes a first circuit board having three-dimensionally structured contact elements and a second circuit board also having three-dimensionally structured contact elements structured complementarily with respect to the contact elements of the first circuit board for positioning the two boards together. The contact elements of the first board reciprocally electrically contact the contact elements of the second board. The configuration ensures a high positioning accuracy of the two contact regions with respect to one another. A mask having cutouts for contact elements of the two boards can be provided. Such contact element positioning using the conductor track pattern and being independent of a contact-making housing has the advantage that the positioning accuracy is unaffected by tolerances between the conductor track pattern and the contact-making housing.

Abstract translation: 在印刷电路板对中，每个印刷电路板具有与接触元件的接触区域，接触制造系统包括具有三维结构的接触元件的第一电路板和还具有三维结构的接触的第二电路板 与第一电路板的接触元件互补地构成用于将两个板定位在一起的元件。 第一板的接触元件相互电接触第二板的接触元件。 该配置确保了两个接触区域相对于彼此的高定位精度。 可以提供具有用于两个板的接触元件的切口的掩模。 使用导体轨道图案并且独立于接触形成壳体的这种接触元件定位具有的优点是定位精度不受导体轨迹图案和接触形成壳体之间的公差的影响。

公开(公告)号：US20010037561A1

公开(公告)日：2001-11-08

申请号：US09728336

申请日：2001-04-05

Inventor： Jurgen Engbring ,  Ulrich Grzesik ,  Guido Renner ,  Jean-Francois Soule-Noulibos ,  Jacques Gerome ,  Jean-Michel Huot

IPC: B23P019/00 ,  H05K003/36

CPC classification number: H05K3/36 ,  H01R12/52 ,  H01R12/714 ,  H05K1/145 ,  H05K3/325 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/097 ,  H05K2203/0557 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/53174 ,  Y10T29/532

Abstract: In order, in the context of making contact between two printed circuit boards (2, 4), to ensure a high positioning accuracy of their two contact regions (8) with respect to one another, the two contact regions (8) are three-dimensionally structured complementarily with respect to one another. A mask (12) having cutouts (14) for contact elements (10) of the two printed circuit boards (2, 4) is preferably provided. This positioning using the conductor track pattern and independently of a contact-making housing (26) has the advantage that the positioning accuracy is unaffected by tolerances between the conductor track pattern and the contact-making housing (26).

Abstract translation: 为了在两个印刷电路板（2,4）之间进行接触的情况下，为了确保它们的两个接触区域（8）相对于彼此的高定位精度，两个接触区域（8） 相互之间互补地尺寸构造。 优选地，设置具有用于两个印刷电路板（2,4）的接触元件（10）的切口（14）的掩模（12）。 使用导体轨迹图案并且独立于接触形成壳体（26）的定位具有这样的优点：定位精度不受导体轨迹图案和接触形成壳体（26）之间的公差的影响。

公开(公告)号：US20010012723A1

公开(公告)日：2001-08-09

申请号：US09837173

申请日：2001-04-19

Applicant: KYOSHIN KOGYO CO., LTD.

Inventor： Ryoji Tanaka

IPC: H01R031/08

CPC classification number: H01R13/2435 ,  H01R13/2492 ,  H05K3/325 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09663 ,  H05K2201/1031 ,  H05K2201/2036 ,  Y02P70/611 ,  Y10S439/94

Abstract: A connecting terminal assembly, including a covering tape heat-sealed to a mount base so as to cover a number of connecting terminals received in recessed portions of the mount base, is mounted to a surface mounter. Each connecting terminal has two fixed-contact sections, and a central section thereof having leg portions vertically extending from inner ends of the fixed-contact sections and a major portion extending between upper ends of the leg portions. Free-contact sections extend from outer ends of the fixed-contact sections vertically of and longitudinally in an inward direction of the connecting terminal. While the covering tape is being peeled off, each of the connecting terminals received in the recessed portions of the mount base is picked up at its major portion by suction and transferred to be positioned on a first printed circuit board at a desired position and with a desired orientation, by mean of a suction nozzle of the mounter. The connecting terminal having its fixed-contact sections separated by the central section is electrically connected to conductor portions of the circuit board, without being displaced on molten solder. By pressing a second printed circuit board against the free-contact sections to flex them, electrical connection is established therebetween with a sufficient contact pressure.

Abstract translation: 连接端子组件，其包括热封到安装基座的覆盖带，以覆盖容纳在安装基座的凹部中的多个连接端子，安装到表面安装机。 每个连接端子具有两个固定接触部分，其中心部分具有从固定接触部分的内端垂直延伸的腿部和在腿部的上端之间延伸的主要部分。 自由接触部分在固定接触部分的外端部从连接端子的向内方向垂直延伸。 当覆盖带被剥离时，容纳在安装基座的凹陷部分中的每个连接端子通过抽吸在其主要部分被拾取并转移到位于期望位置的第一印刷电路板上，并且具有 通过安装器的吸嘴的平均取向。 具有由中央部分隔开的固定接触部分的连接端子电连接到电路板的导体部分，而不会在熔融焊料上移位。 通过将第二印刷电路板压靠在自由接触部分上以使它们挠曲，在它们之间建立电连接并具有足够的接触压力。

公开(公告)号：US09888562B2

公开(公告)日：2018-02-06

申请号：US13726509

申请日：2012-12-24

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/36

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.