公开(公告)号：US6028772A

公开(公告)日：2000-02-22

申请号：US133606

申请日：1998-08-13

Applicant: Ephraim Suhir

Inventor： Ephraim Suhir

IPC: H01L23/373 ,  H01L23/538 ,  H05K3/00 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H01L23/3735 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K2201/09154

Abstract: An electronic assembly having a first component, a second component, and a layer of adhesive bonding the first and second components together, one or both of the first and second components includes thinned or tapered peripheral edges. The layer of adhesive includes a thickened portion which is adjacent to the thinned or tapered peripheral edges, the thickened portion having a thickness which is greater than the thickness of the remaining portion of the layer.

Abstract translation: 具有第一部件，第二部件和粘合第一和第二部件的粘合剂层的电子组件包括一个或多个第一和第二部件中的一个或两个，这些部件包括减薄或锥形的周边边缘。 粘合剂层包括与薄化的或锥形的周边边缘相邻的加厚部分，该加厚部分的厚度大于该层的剩余部分的厚度。

公开(公告)号：US5486657A

公开(公告)日：1996-01-23

申请号：US257755

申请日：1994-06-09

Applicant: James S. Bell ,  Patricia L. Herman ,  Richard I. Phillips

Inventor： James S. Bell ,  Patricia L. Herman ,  Richard I. Phillips

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/02

CPC classification number: H05K3/3405 ,  H05K1/117 ,  H05K3/3452 ,  H05K2201/09154 ,  H05K2201/09381 ,  H05K2201/09709 ,  H05K2201/09736 ,  H05K2201/099 ,  H05K2201/10189 ,  H05K2203/0545 ,  H05K2203/0594 ,  H05K2203/167 ,  H05K3/3484

Abstract: A printed circuit board is provided having a beveled edge for ease of insertion into a receptor. The beveled edge is extended onto the solder mask to present a contiguous beveled surface. Moreover, the PCB includes bonding pads which can be surface mounted with pins extending from the receptor. Each bonding pad includes a forward portion and a rearward portion. The forward portion is covered with the solder mask layer to present a smooth surface channeled inward in a V-shaped configuration. The forward portion channels or directs the pin along a central axis near the apex of the V-shaped forward portion onto the upper surface of the bonding pad rearward portion. Accordingly, the pin is channeled to an area absent solder paste along the central axis such that during subsequent reflow operation the solder paste is reliably extended over and around the centrally placed pin.

Abstract translation: 提供了一种印刷电路板，其具有倾斜边缘，以便于插入到受体中。 斜边缘延伸到焊接掩模上以呈现相邻的斜面。 此外，PCB包括可以从接收器延伸的针表面安装的接合焊盘。 每个焊盘包括前部和后部。 前面部分被焊接掩模层覆盖，以呈现呈V形构造向内的光滑表面。 前部部分将销钉沿着V形前部的顶点附近的中心轴线引导到接合垫后部的上表面上。 因此，引脚沿着中心轴被引导到没有焊膏的区域，使得在随后的回流操作期间，焊膏被可靠地延伸到中心放置的引脚上方和周围。

公开(公告)号：US4804428A

公开(公告)日：1989-02-14

申请号：US92232

申请日：1987-09-02

Applicant: Kurt Held

Inventor： Kurt Held

IPC: B32B15/08 ,  B23C1/00 ,  B23D45/20 ,  B23D47/00 ,  B23D59/00 ,  B23D61/02 ,  B26D7/01 ,  B27B33/20 ,  B27G19/10 ,  B32B43/00 ,  H05K3/00 ,  B26D1/22

CPC classification number: B27G19/10 ,  B23D45/20 ,  B23D47/005 ,  B23D59/006 ,  B23D59/008 ,  B23D61/026 ,  B27B33/20 ,  H05K3/0052 ,  H05K2201/09154 ,  H05K2203/0228 ,  H05K2203/068 ,  H05K2203/1545 ,  H05K3/0097 ,  Y10T156/108 ,  Y10T156/1084 ,  Y10T156/1741 ,  Y10T83/7507 ,  Y10T83/7863

Abstract: A process and device for subdivision of a continuously fabricated metal backed laminate web into individual panels of any size, uses a computer and a numerically controlled saw. A contour path is controlled by the computer. A saw blade of the saw located in the saw head has a side support at the severance edges to be cut. This side support contains small cutter plates which are applied with one of their side faces against the saw blade with slight pressure. Each support has an additional narrow edge surface which is held against the metal backed laminate web. For trimming pressed edges of the web that are cured without pressure, fixed circular saws with their own side supports are arranged at the edge of the metal backed laminate web, upstream of the saw head.

Abstract translation: 用于将连续制造的金属背衬层压材料纤维网细分成任何尺寸的单独面板的方法和装置，使用计算机和数控锯。 轮廓路径由计算机控制。 位于锯头中的锯的锯片在待切割的切割边缘处具有侧支撑。 该侧支撑件包含小的切割板，它们的一个侧面以轻微的压力抵靠着锯片。 每个支撑件具有另外的窄边缘表面，其保持抵靠金属背衬层压板。 为了修剪没有压力固化的幅材的压制边缘，具有它们自己的侧面支撑件的固定圆锯被布置在金属背衬层压板的边缘处，在锯头的上游。

公开(公告)号：US4095866A

公开(公告)日：1978-06-20

申请号：US798505

申请日：1977-05-19

Applicant: Peter S. Merrill

Inventor： Peter S. Merrill

IPC: H01R12/72 ,  H05K1/00 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H05K1/07

CPC classification number: H05K1/117 ,  H01R12/721 ,  H05K1/0298 ,  H05K2201/09154 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09536 ,  H05K3/403 ,  H05K3/429 ,  H05K3/4623

Abstract: A high density printed circuit board carrying integrated circuits or the like is provided with two parallel rows of terminals along one edge on both sides of the board. The terminals in the outer row of terminals closest to the edge of the board are connected to printed circuits on inner layers of the multiple layer printed circuit board by plated-through holes or other suitable techniques; and the printed circuits on the outer layer or layers are connected to the inner row of terminals spaced just inside the outer row of terminals. A circuit board connector is provided with spring contacts which are electrically insulated from one another but which are designed to engage the multiple layer printed circuit board at the position of the first and second rows of terminals. The spring contacts engaging the inner row of terminals on the circuit board are longer in length than those engaging the outer row of terminals, and are thus easily deflected so that the P.C. board may be inserted or removed from the connector without excessive force.

Abstract translation: 承载集成电路等的高密度印刷电路板在板的两侧沿着一个边缘设置有两条平行的端子排。 最靠近板边缘的端子的端子中的端子通过电镀通孔或其它合适的技术连接到多层印刷电路板的内层上的印刷电路; 并且外层上的印刷电路连接到与外排端子间隔开的内排端子。 电路板连接器设置有彼此电绝缘但是被设计成在第一和第二行端子的位置处接合多层印刷电路板的弹簧触点。 接合电路板上的内排端子的弹簧触点的长度比接合外排端子的长度长，因此容易偏转，使得P.C. 板可以从连接器插入或移除，而不会有过大的力。

公开(公告)号：US2959758A

公开(公告)日：1960-11-08

申请号：US55634255

申请日：1955-12-29

Applicant: WESTERN ELECTRIC CO

Inventor： GESHNER ROBERT A ,  KEHL LAWRENCE J

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/117 ,  H05K3/107 ,  H05K2201/0376 ,  H05K2201/0382 ,  H05K2201/09036 ,  H05K2201/09154 ,  H05K2201/098 ,  H05K2201/10863 ,  H05K2203/0278 ,  Y10S439/951

公开(公告)号：US12096566B2

公开(公告)日：2024-09-17

申请号：US16157185

申请日：2018-10-11

Applicant: Intel Corporation

Inventor： Tyler Leuten

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K3/0097 ,  H05K1/117 ,  H05K1/181 ,  H05K3/0026 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09972 ,  H05K2201/10522 ,  H05K2203/308

Abstract: Embodiments disclosed herein include a printed circuit board (PCB) with a non-uniform thickness and methods of fabricating such PCBs. In an embodiment, the PCB comprises a connector region with a top surface and a bottom surface, and a component region with a top surface and a bottom surface. In an embodiment, the bottom surface of the connector region is coplanar with the bottom surface of the component region. In an embodiment the top surface of the connector region is not coplanar with the top surface of the component region.

公开(公告)号：US20240188221A1

公开(公告)日：2024-06-06

申请号：US18089609

申请日：2022-12-28

Applicant: AUO Corporation

Inventor： Chun-Yueh Hou ,  Hao-An Chuang

IPC: H05K3/10 ,  H05K1/02 ,  H05K3/06

CPC classification number: H05K3/10 ,  H05K1/0298 ,  H05K3/061 ,  H05K2201/09154

Abstract: A device substrate includes a circuit substrate and a side wiring structure. The circuit substrate includes a substrate and a front circuit structure on a front side of the substrate. The side wiring structure is electrically connected to the front circuit structure and extends from the front circuit structure to a back side of the circuit substrate. A cross-sectional structure of the side wiring structure includes a first portion, a second portion, and a third portion respectively located above a front side, a side surface, and the back side of the circuit substrate. The first, second, and third portions each include streaks. A ratio of a maximum thickness of the first portion to a maximum thickness of the second portion is A. A ratio of a maximum thickness of the third portion to the maximum thickness of the second portion is B. Each of A and B is 0.25-0.6.

公开(公告)号：US20190172780A1

公开(公告)日：2019-06-06

申请号：US16266203

申请日：2019-02-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Satoru KURAMOCHI ,  Sumio KOIWA ,  Hidenori YOSHIOKA

IPC: H01L23/498 ,  H01L25/18 ,  H05K1/11 ,  H01L23/48 ,  H01L25/065 ,  H05K3/28 ,  H05K3/44

CPC classification number: H01L23/49827 ,  H01L23/13 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/065 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13109 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16165 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81805 ,  H01L2224/8385 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H05K1/115 ,  H05K3/28 ,  H05K3/445 ,  H05K2201/09154 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2203/0594 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0665 ,  H01L2924/07025

Abstract: A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

公开(公告)号：US20190006335A1

公开(公告)日：2019-01-03

申请号：US16020145

申请日：2018-06-27

Applicant: LG Display Co., Ltd.

Inventor： Seungchul LEE ,  Changho LEE ,  Hanseok KIM ,  Mira YUN

IPC: H01L25/16 ,  G09G3/32 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H01L33/60 ,  H01L23/60

CPC classification number: H01L25/167 ,  G09G3/32 ,  G09G2300/02 ,  G09G2310/0259 ,  G09G2310/0272 ,  G09G2380/02 ,  H01L23/49805 ,  H01L23/49833 ,  H01L23/4985 ,  H01L23/60 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/82 ,  H01L25/162 ,  H01L27/124 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73217 ,  H01L2224/82103 ,  H01L2224/82214 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: Disclosed herein are a display device with a reduced bezel area and a method for fabricating the same. A wiring electrode disposed on a substrate is electrically connected to a connection electrode disposed on an inclined surface of a circuit board in contact with the substrate, and the connection electrode is electrically connected to a circuit wiring disposed on the circuit board. Therefore, an inactive area such as a pad portion for connecting the substrate with the circuit board is not required, such that the bezel area can be reduced.

公开(公告)号：US10056239B2

公开(公告)日：2018-08-21

申请号：US14443913

申请日：2013-11-19

Applicant: Particle Physics Inside Products B.V.

Inventor： Dirk-Jan Spaanderdam ,  Julia Helga Jungmann ,  Ronald Martinus Alexander Heeren

IPC: H05K1/11 ,  H01J49/00 ,  H05K1/02 ,  H01J49/02 ,  H01J49/24 ,  H05K3/46

CPC classification number: H01J49/0004 ,  H01J49/022 ,  H01J49/025 ,  H01J49/24 ,  H05K1/02 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2203/1147

Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure, the feedthrough structure comprising a printed circuit board (PCB) for carrying one or more detectors, wherein said PCB comprises a top surface covered with a first UHV sealing layer and one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, a back surface comprising one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, wherein one or more conductive wires are embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, wherein one or more thermally conductive vias are embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.