公开(公告)号：US20120300424A1

公开(公告)日：2012-11-29

申请号：US13577447

申请日：2010-11-16

Applicant: Fei Lv ,  Hu Ge ,  Jie Song

Inventor： Fei Lv ,  Hu Ge ,  Jie Song

IPC: H05K7/00 ,  H05K3/00

CPC classification number: H05K3/3426 ,  H03H9/1007 ,  H05K3/3494 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10462 ,  Y02P70/613 ,  Y10T29/49124

Abstract: The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.

Abstract translation: 本发明公开了一种没有外部封装的晶体器件，其包括：晶体（21）和两个引脚（22），其中晶体（21）是具有外部封装（15）的晶体的圆柱形主体端口，以及 冗余引脚（12,13）被去除，并且被水平布置在印刷电路板（PCB）上。 两个销（22）连接到晶体（21）的底端。 两个销（22）的延伸部分朝向PCB倾斜，并且当它们到达PCB并且被焊接到PCB时变得水平，并且两个销（22）之间的间隔逐渐增加。 本公开还公开了一种用于制造没有封装的晶体器件的方法。 该装置和方法可以降低成本，使焊接更方便。

公开(公告)号：US08212626B2

公开(公告)日：2012-07-03

申请号：US12721130

申请日：2010-03-10

Applicant: Junichi Arai

Inventor： Junichi Arai

IPC: H03B5/32

CPC classification number: H03B1/02 ,  H05K1/0201 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2203/165

Abstract: A constant-temperature type crystal oscillator includes: a surface-mount crystal unit, in which a crystal element is housed in a case main body to hermetically encapsulate the crystal element with a metal cover, and which includes a crystal terminal serving as a mounting terminal that is electrically connected to at least the crystal element on an outer bottom face of the case main body; a thermistor that detects an operational temperature of the surface-mount crystal unit; and a circuit substrate, on which elements forming an oscillator circuit and elements forming a temperature control circuit along with the thermistor are installed. The thermistor includes a first and second terminal electrode and a temperature detecting electrode that is electrically independent of the first and second terminal electrode. The temperature detecting electrode is electrically connected to the crystal terminal of the surface-mount crystal unit through a circuit pattern formed on the circuit substrate.

Abstract translation: 恒温型晶体振荡器包括：表面安装晶体单元，其中晶体元件容纳在壳体主体中，以用金属盖密封晶体元件，并且包括用作安装端子的晶体端子 其至少与壳体主体的外底面上的晶体元件电连接; 检测表面安装晶体单元的工作温度的热敏电阻; 以及电路基板，其上安装有形成振荡器电路的元件和与热敏电阻一起形成温度控制电路的元件。 该热敏电阻包括与第一和第二端子电极电独立的第一和第二端子电极和温度检测电极。 温度检测电极通过形成在电路基板上的电路图案与表面安装晶体单元的晶体端子电连接。

公开(公告)号：US08085105B2

公开(公告)日：2011-12-27

申请号：US12618315

申请日：2009-11-13

Applicant: Kenji Kasahara

Inventor： Kenji Kasahara

IPC: H03L1/00

CPC classification number: H03B1/02 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H03L1/023 ,  H03L1/028 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2203/165 ,  H01L2224/0401

Abstract: A constant-temperature type crystal oscillator includes: a crystal unit including a case main body including a first power source terminal on an outer bottom surface thereof; a surface-mounted oscillator; a temperature control circuit including a heating resistor and a temperature sensor; and a circuit substrate including a second power source terminal. One ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal. The first power source terminal of the surface-mounted oscillator and the one ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal of the circuit substrate. The first power source terminal of the surface-mounted oscillator is directly and electrically connected to, at least, the one end of the temperature sensor via an electrically-conducting path.

Abstract translation: 恒温型晶体振荡器包括：晶体单元，包括壳主体，其在其外底表面上包括第一电源端子; 表面安装的振荡器; 温度控制电路，包括加热电阻器和温度传感器; 以及包括第二电源端子的电路基板。 加热电阻器和温度传感器的一端电连接到第二电源端子。 表面安装的振荡器的第一电源端子和加热电阻器的一端和温度传感器电连接到电路基板的第二电源端子。 表面安装振荡器的第一电源端子至少通过导电路径电连接到温度传感器的一端。

公开(公告)号：US08013683B2

公开(公告)日：2011-09-06

申请号：US12584192

申请日：2009-09-01

Applicant: Junichi Arai

Inventor： Junichi Arai

IPC: H03L1/00

CPC classification number: H03L1/04 ,  H05K1/0206 ,  H05K1/0212 ,  H05K2201/09781 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2203/165

Abstract: A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.

Abstract translation: 恒温型晶体振荡器包括：安装在电路基板的一个主表面上的晶体单元和用作加热元件的片式电阻器，并且安装在电路基板的另一个主表面上，以便 面对晶体单元的主表面，芯片电阻加热晶体单元以保持晶体单元的工作温度恒定。 在电路基板的一个主表面上设置面对晶体单元的主表面的加热金属膜。 导热材料插入在晶体单元的主表面和加热金属膜之间，以在它们之间进行热耦合。 加热金属膜通过多个电极通孔热耦合到芯片电阻器的电极端子。

公开(公告)号：US20110114353A1

公开(公告)日：2011-05-19

申请号：US12674505

申请日：2008-08-21

Applicant: Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

Inventor： Minoru Iizuka ,  Koichi Kishimoto ,  Kozo Shibutani ,  Kentaro Nakanishi

IPC: H05K5/06 ,  H05K1/11 ,  H05K1/03

CPC classification number: H01L23/49838 ,  H01L23/053 ,  H01L23/49822 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/16195 ,  H03H9/1021 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic component package has a base in the shape of a rectangle as viewed from the top, and a metal lid. A terminal electrode on a base bottom surface and a circuit substrate are joined using a conductive adhesive material. In the electronic component package, a first terminal electrode group including two or more terminal electrodes formed in parallel is formed eccentrically to one corner position of the base bottom surface, and a single second terminal electrode, or a second terminal electrode group including two or more terminal electrodes formed in parallel, is formed eccentrically only to a first diagonal position diagonally opposite the one corner position. Also, no-electrode regions in which no terminal electrode is formed along a short side of the base are provided at another corner position facing the one corner position in a short side direction of the base, and a second diagonal position diagonally opposite the other corner position. At least one of the terminal electrodes is a ground terminal electrode connected to the metal lid.

Abstract translation: 电子部件封装具有从顶部观察为矩形形状的基部和金属盖。 使用导电性粘合剂材料将基底面上的端子电极和电路基板接合。 在电子部件封装中，包括形成为平行的两个以上的端子电极的第一端子电极组偏心地形成在底部底面的一个拐角位置，单个第二端子电极或包括两个以上的第二端子电极组 形成为平行的端子电极偏心地形成为与一个角位置对角地相对的第一对角线位置。 此外，在基部的短边方向上的与一个角位置相对的另一个角位置设置有沿着基部的短边没有形成端子电极的无电极区域，并且与另一个角部对角地相对的第二对角线位置 位置。 至少一个端子电极是连接到金属盖的接地端子电极。

公开(公告)号：US20090261912A1

公开(公告)日：2009-10-22

申请号：US12384514

申请日：2009-04-06

Applicant: Shigeyoshi Murase ,  Chisato Ishimaru

Inventor： Shigeyoshi Murase ,  Chisato Ishimaru

IPC: H03B1/00

CPC classification number: H05K3/3442 ,  H03H9/0547 ,  H03H9/1021 ,  H05K2201/09181 ,  H05K2201/10075 ,  Y02P70/613

Abstract: A surface-mounted device includes a ceramic case, which has a concave portion formed by a bottom wall layer, a frame wall intermediate layer and a frame wall upper layer, and which houses at least a crystal element inside the concave portion. The ceramic case includes: arc-formed notched parts at outer circumference four corners thereof; and mounting terminals, which are extended to notched parts in the bottom wall layer among the notched parts, on an outer bottom face thereof. A radius of curvature of the notched parts in the frame wall intermediate layer is made identical to or greater than a radius of curvature of the notched parts in the bottom wall layer, and a radius of curvature of the notched parts in the frame wall upper layer is less than the radii of curvature of the notched parts in the bottom wall layer and the frame wall intermediate layer.

Abstract translation: 表面安装装置包括陶瓷壳体，其具有由底壁层形成的凹部，框架壁中间层和框架壁上层，并且在凹部内容有至少一个晶体元件。 陶瓷外壳包括：外圆四角的弧形切口部分; 以及安装端子，其延伸到缺口部分中的底壁层中的切口部分的外底面上。 框架壁中间层中的切口部分的曲率半径与底壁层中的凹口部分的曲率半径相同或更大，并且框架壁上层中的凹口部分的曲率半径 小于底壁层和框架壁中间层中的切口部分的曲率半径。

公开(公告)号：US20090154121A1

公开(公告)日：2009-06-18

申请号：US12000861

申请日：2007-12-18

Applicant: Chih-Chien Lee

Inventor： Chih-Chien Lee

IPC: H02B1/00

CPC classification number: H05K1/0243 ,  H05K1/162 ,  H05K1/181 ,  H05K2201/09672 ,  H05K2201/10075

Abstract: A clock generator includes a printed circuit board, a resonant circuit and a pair of compensating capacitors. The resonant circuit is disposed on the printed circuit board. The compensating capacitors are embedded in the printed circuit board and electrically connected to both terminals of the resonant circuit respectively.

Abstract translation: 时钟发生器包括印刷电路板，谐振电路和一对补偿电容器。 谐振电路设置在印刷电路板上。 补偿电容器嵌入印刷电路板中，分别电连接到谐振电路的两端。

公开(公告)号：US20070046312A1

公开(公告)日：2007-03-01

申请号：US11506905

申请日：2006-08-21

Applicant: Yasuo Funato

Inventor： Yasuo Funato

IPC: G01R31/26

CPC classification number: H05K1/0224 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10015 ,  H05K2201/10075 ,  H05K2201/10196

Abstract: According to one embodiment, a printed circuit board for a real-time clock IC includes a plurality of wiring layers sequentially laminated to form one substrata and including at least one layer which forms an oscillator circuit pattern having a crystal oscillator generating a reference signal and an oscillation stabilizing portion which stabilizes and oscillates the reference signal and adjusts the oscillation frequency to a target frequency, and a power supply layer arranged in at least one of a position between the plurality of wiring layers and front and rear surfaces of the substrate, and forming a power supply circuit pattern which supplies electric power to a circuit on the substrate and removing a portion of the power supply circuit pattern which has width not smaller than width of the oscillator circuit pattern in a portion of the power supply circuit pattern which overlaps with the oscillator circuit pattern.

Abstract translation: 根据一个实施例，用于实时时钟IC的印刷电路板包括顺序地层叠以形成一个基底的多个布线层，并且包括形成具有产生参考信号的晶体振荡器的振荡器电路图案的至少一个层，以及 稳定振荡基准信号并将振荡频率调整为目标频率的振荡稳定部，以及布置在多个布线层之间的位置和基板的前后表面之中的至少一个中的电源层，以及形成 电源电路图案，其向所述基板上的电路供电，并且在所述电源电路图案的与所述电源电路图案重叠的部分中去除所述电源电路图案的宽度不小于所述振荡器电路图案的宽度的部分 振荡电路图案。

公开(公告)号：US07106085B2

公开(公告)日：2006-09-12

申请号：US10932953

申请日：2004-09-02

Applicant: Masaaki Endo ,  Toshiro Furuta ,  Wataru Saitoh ,  Tadaomi Yamano

Inventor： Masaaki Endo ,  Toshiro Furuta ,  Wataru Saitoh ,  Tadaomi Yamano

IPC: G01R31/26 ,  G01R31/28

CPC classification number: H05K9/002 ,  H05K1/0243 ,  H05K1/18 ,  H05K2201/10075 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/2018

Abstract: An electronic circuit unit includes a circuit board mounted within a frame member, an electronic component with a cover mounted on the circuit board, and linear terminals passing through and being mounted in the circuit board. The terminals include first and second terminal groups arranged at an interval between the respective terminals in a line. The terminal groups are arranged in a line in the vicinity of one side of the circuit board. An opening portion is provided between the first and second terminal groups, and the electronic component with the cover is mounted on the circuit board while being disposed in the opening portion. As a result, a space factor for the arrangement of the electronic component with the cover is very good, and thus it is possible to reduce a widthwise dimension of the circuit board.

Abstract translation: 电子电路单元包括安装在框架构件内的电路板，安装在电路板上的盖子的电子部件和通过并安装在电路板中的线性端子。 这些端子包括以一行的各个端子间隔布置的第一和第二端子组。 端子组在电路板的一侧附近排成一行。 开口部分设置在第一和第二端子组之间，并且具有盖的电子部件安装在电路板上同时设置在开口部分中。 结果，电子部件与盖的布置的空间因子非常好，因此可以减小电路板的宽度尺寸。

公开(公告)号：US06796807B2

公开(公告)日：2004-09-28

申请号：US10431915

申请日：2003-05-07

Applicant: Richard A. Olzak ,  Tehmosp Khan

Inventor： Richard A. Olzak ,  Tehmosp Khan

IPC: H01R1200

CPC classification number: H05K1/141 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/049 ,  H05K2201/09418 ,  H05K2201/096 ,  H05K2201/09954 ,  H05K2201/10075 ,  H05K2201/10689

Abstract: An electrical adapter formed of a printed wiring board having opposing primary and secondary sides and at least one printed circuit having a plurality of solder pads arranged to interconnect with input/output signal pins of a surface mount technology (SMT) device and a plurality of plated vias arranged to interconnect with input/output signal pins of one or more discrete electrical components; one or more plated through holes extending between the primary and secondary sides of the board and electrically coupled to the printed circuit, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board; and a plurality of input/output signal interconnect pins mechanically and electrically coupled to the plated holes and extending a distance beyond the secondary side of the board.

Abstract translation: 由具有相对的一次侧和次侧的印刷线路板形成的电适配器和至少一个印刷电路，所述印刷电路具有布置成与表面贴装技术（SMT）器件的输入/输出信号引脚相互连接的多个焊盘，以及多个电镀 布置成与一个或多个分立电气部件的输入/输出信号引脚互连的通孔; 一个或多个电镀通孔，其延伸在所述基板的所述主侧和次侧之间并且电耦合到所述印刷电路，所述电镀通孔以构造成与母电路板中的电镀通孔匹配的图案定位; 以及多个输入/输出信号互连引脚，其机械地和电耦合到所述电镀孔并且延伸超过所述板的次级侧的距离。