公开(公告)号：US08979394B2

公开(公告)日：2015-03-17

申请号：US13906725

申请日：2013-05-31

Applicant: Corning Cable Systems LLC

Inventor： John Phillip Ertel

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/46 ,  H05K1/02

CPC classification number: G02B6/4204 ,  G02B6/4214 ,  G02B6/4257 ,  G02B6/428 ,  G02B6/46 ,  H05K1/0274 ,  H05K2201/09063 ,  H05K2201/09918 ,  H05K2201/10121 ,  H05K2201/10545 ,  H05K2203/167 ,  Y10T29/49004 ,  Y10T29/4913

Abstract: A total internal reflection sub-assembly includes a body defining at least a portion of an optical path, a lens supported by the body and positioned in the optical path, and an optical turning member supported by the body and configured to change the direction of the optical path. The total internal reflection sub-assembly also includes a carrier having a first surface coupled to the body and a second surface opposite the first surface. An active device is supported on the first surface of the carrier, which is coupled to the body on opposite sides of the active device. The body and carrier are shaped so that a space is maintained between the active device and an underside surface of the body. The lens is positioned on the underside surface and aligned with the active device.

Abstract translation: 全内反射子组件包括限定光路的至少一部分的主体，由主体支撑并定位在光路中的透镜以及由主体支撑并被配置为改变光路的方向的光学旋转部件 光路。 全内反射子组件还包括具有联接到主体的第一表面和与第一表面相对的第二表面的载体。 有源器件被支撑在载体的第一表面上，其在有源器件的相对侧耦合到主体。 主体和托架被成形为使得在主动装置和主体的下表面之间保持空间。 透镜位于下表面并与有源器件对准。

公开(公告)号：US20150072195A1

公开(公告)日：2015-03-12

申请号：US14230678

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Mikhail S. Balk ,  Lisa L. Winders ,  Richard M. DeKeuster ,  John P. Dinkelman

IPC: H01M10/48 ,  H01M10/04

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module and a method of manufacture are provided. The battery module may include a printed circuit board (PCB) assembly. The PCB assembly may include a PCB designed to be disposed in a battery module for controlling operations of the battery module. The PCB may also include voltage sensing circuitry. In addition, the PCB assembly may include a bus bar cell interconnect. The bus bar cell interconnect may electrically couple batteries of the battery module. The PCB assembly may also include a voltage sense connection tab. The voltage sense connection tab may carry a voltage between a bus bar cell interconnect of the battery module and the voltage sensing circuitry on the PCB.

Abstract translation: 提供电池模块和制造方法。 电池模块可以包括印刷电路板（PCB）组件。 PCB组件可以包括设计成设置在电池模块中以控制电池模块的操作的PCB。 PCB还可以包括电压感测电路。 此外，PCB组件可以包括汇流条单元互连。 母线电池互连可以电连接电池模块的电池。 PCB组件还可以包括电压感测连接片。 电压感测连接片可以在电池模块的汇流条单元互连和PCB上的电压感测电路之间承载电压。

公开(公告)号：US08966747B2

公开(公告)日：2015-03-03

申请号：US13105696

申请日：2011-05-11

Applicant: Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

Inventor： Patrizio Vinciarelli ,  Michael B. Lafleur ,  Sean Timothy Fleming ,  Rudolph Mutter ,  Andrew T. D'Amico

IPC: H05K3/30 ,  H05K7/20 ,  H01R43/24 ,  H05K5/06 ,  B29C45/14 ,  B29C45/00

CPC classification number: H05K3/284 ,  B23P15/007 ,  B29C45/0055 ,  B29C45/14639 ,  B29C45/1679 ,  B29C2045/0058 ,  B29C2045/169 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K5/0004 ,  H05K5/0065 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/04 ,  H05K5/064 ,  H05K7/1427 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.

Abstract translation: 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在形成成品的一部分的模具包封之后被切割成一个或多个单独的部件。 提供散热鳍片或表面安装可焊接表面。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征，例如将电路板精确地定位在模腔内的配准特征，用于单个模块的结构完整性的互锁轮廓，用于匹配部件形状的轮廓和增加从内部部件散热的尺寸，以及减小所需体积 密封剂，间隙通道为互连提供安全机构间距和挫折。 封装之后可以在模具中形成宽切削，从而降低热应力并减小在随后的切割过程中要切割的材料的厚度。 外部模具特征可以包括用于散热器的各种翅片配置，用于表面安装或焊接的平坦表面等。可以加工空白模具面板以在按需制造系统中提供部分或全部上述特征。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。 互连可以被电镀以提供可插入到配合连接器中的连接器化模块。

公开(公告)号：US20140355218A1

公开(公告)日：2014-12-04

申请号：US14116642

申请日：2012-05-11

Applicant: Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

Inventor： Patrizio Vinciarelli ,  Michael B. LaFleur ,  Sean Timothy Fleming ,  Rudolph F. Mutter ,  Andrew T. D'Amico

IPC: H05K3/28 ,  B29C45/14 ,  B29C45/00 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K3/284 ,  B29C45/0055 ,  B29C45/14639 ,  B29C2045/0058 ,  B29C2793/0009 ,  B29C2793/0027 ,  B29C2793/009 ,  H01R27/02 ,  H01R43/205 ,  H01R43/24 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/186 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/007 ,  H05K5/064 ,  H05K5/065 ,  H05K7/209 ,  H05K2201/0183 ,  H05K2201/066 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/167

Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation. The mold may be used to form part of the finished product. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features. Wide cuts may be made in the molds after encapsulation reducing thermal stresses. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations.

Abstract translation: 封装诸如功率转换器之类的电子部件的面板的方法减少了浪费的印刷电路板面积。 可以包括多个部件的面板可以在封装之后切割成一个或多个单独的部件。 模具可用于形成成品的一部分。 在分离过程中，单独电路边界处提供的互连特征暴露于提供与组件的电连接，而不浪费有价值的PCB表面积。 模具可以包括各种内部特征。 封装后可以在模具中进行宽切削，减少热应力。 空白模具面板可以被加工以在按需制造系统中提供上述特征中的一些或全部。 可以提供连接适配器，以在连接器，通孔，表面贴装焊料变化中的垂直或水平安装位置使用模块。

公开(公告)号：US20140254120A1

公开(公告)日：2014-09-11

申请号：US14282693

申请日：2014-05-20

Applicant: FUJIKURA LTD.

Inventor： Satoshi YAMAMOTO ,  Hiroyuki HIRANO ,  Takanao SUZUKI

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0094 ,  H01L21/486 ,  H01L23/473 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15184 ,  H05K1/113 ,  H05K2201/09836 ,  H05K2201/10378 ,  H05K2201/10545 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface.

Abstract translation: 本发明提供一种器件封装结构，其特征在于，包括：内插基板，具有基板和形成在从第一主面朝向第二主面的贯穿基板的多个通孔内形成的多个通孔布线，所述第一主面 作为基板的一个主表面，第二主表面是其另一个主表面; 第一装置，其包括多个电极，并且被布置成使得这些电极面对第一主表面; 以及第二装置，其包括多个电极，其布置与第一装置的每个电极的布置不同，并且被布置成使得这些电极面对第二主表面。

公开(公告)号：US20140083754A1

公开(公告)日：2014-03-27

申请号：US13628532

申请日：2012-09-27

Applicant: DELL PRODUCTS L.P.

Inventor： Kevin W. Mundt ,  Jason D. Adrian

IPC: H05K1/11 ,  H05K3/36 ,  H05K1/00

CPC classification number: H05K1/115 ,  H01R12/585 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/306 ,  H05K3/421 ,  H05K3/4611 ,  H05K2201/09509 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/10545 ,  H05K2203/1476 ,  Y10T29/49126

Abstract: An information handling system circuit board interfaces storage device surface connectors and storage device controllers disposed on opposing sides by coupling a first circuit board portion having a controller press in connector to a second circuit board portion having plural surface connectors. The first and second circuit board portions couple to each other with an adhesive activated by curing. Resistant ink is printed over openings of the first circuit board portion where adhesive is applied in order to prevent the adhesive from flowing into the openings at or before the curing of the adhesive.

Abstract translation: 信息处理系统电路板通过将具有连接器中的控制器压力的第一电路板部分耦合到具有多个表面连接器的第二电路板部分，将设置在相对侧上的存储装置表面连接器和存储装置控制器接合。 第一和第二电路板部分通过固化而激活的粘合剂彼此连接。 在第一电路板部分的开口上印刷耐油墨，其中施加粘合剂以防止粘合剂在粘合剂固化期间或之前流入开口。

公开(公告)号：US08669475B2

公开(公告)日：2014-03-11

申请号：US13219815

申请日：2011-08-29

Applicant: Masao Ohnuki

Inventor： Masao Ohnuki

IPC: H05K1/00

CPC classification number: G11B5/4826 ,  G11B5/486 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/11 ,  H05K1/111 ,  H05K1/184 ,  H05K2201/10545

Abstract: A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.

公开(公告)号：US20140068539A1

公开(公告)日：2014-03-06

申请号：US13800276

申请日：2013-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-yeol JUNG ,  Sang-ho LEE ,  Jeong-nam CHEON ,  Seung-hun PARK

IPC: G06F17/50 ,  H05K1/18

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  G06F17/5063 ,  G06F17/5081 ,  G06F2217/82 ,  H01L23/50 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/10053 ,  H05K2201/10159 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic apparatus may include a circuit board, a processor disposed on an upper surface of the circuit board, and a memory disposed on a lower surface of the circuit board, such that the lower surface of the circuit board where the processor is arranged overlaps an area corresponding to where the memory is disposed.

Abstract translation: 电子设备可以包括电路板，设置在电路板的上表面上的处理器和设置在电路板的下表面上的存储器，使得处理器布置的电路板的下表面与 区域对应于存储器的位置。

公开(公告)号：US08659909B2

公开(公告)日：2014-02-25

申请号：US11588682

申请日：2006-10-27

Applicant: Damion Searls ,  Edward Osburn

Inventor： Damion Searls ,  Edward Osburn

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01L23/49844 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/1531 ,  H01L2924/19106 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/1006 ,  H05K2201/10166 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10704 ,  Y10T29/4913 ,  Y10T29/49147 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

Abstract: In one embodiment, the present invention includes a method of mounting a semiconductor device to a first side of a circuit board; and mounting at least one voltage regulator device to a second side of the circuit board, the second side opposite to the first side. The voltage regulator devices may be output filters, inductors, capacitors, and the like. In certain embodiments, the devices may be located directly underneath the semiconductor device.

Abstract translation: 在一个实施例中，本发明包括将半导体器件安装到电路板的第一侧的方法; 以及将至少一个电压调节器装置安装到所述电路板的第二侧，所述第二侧与所述第一侧相对。 电压调节器装置可以是输出滤波器，电感器，电容器等。 在某些实施例中，器件可以位于半导体器件的正下方。

公开(公告)号：US08659142B2

公开(公告)日：2014-02-25

申请号：US13440290

申请日：2012-04-05

Applicant: Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

Inventor： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC: H01L23/52 ,  H01L23/02 ,  H01L23/48 ,  H01L29/40 ,  H01L23/04 ,  H05K7/00 ,  H05K1/18 ,  H01L21/82

CPC classification number: H01L25/0657 ,  G06F1/18 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/525 ,  H01L23/5385 ,  H01L24/24 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically interconnect terminals of the first package with corresponding terminals of the second package. Each package can include a substrate having first and second surfaces, a microelectronic element, conductive structure extending above a front face of the microelectronic element, and parallel columns of terminals at the second surface. The terminals of each package can include first terminals in a central region of the respective second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the respective microelectronic element. Each central region can have a width within three and one-half times a minimum pitch between adjacent terminals.

Abstract translation: 微电子组件可以包括具有在每个表面处的第一和第二表面和面板触点的电路板，以及分别在第一表面和第二表面处安装到面板触点的端子的第一和第二微电子封装。 电路板可以将第一封装的端子与第二封装的相应端子电互连。 每个封装可以包括具有第一表面和第二表面的基底，微电子元件，在微电子元件的前表面上方延伸的导电结构，以及在第二表面处的平行的端子列。 每个封装的端子可以包括在相应的第二表面的中心区域中的第一端子，并且被配置为承载可由封装内的电路使用的地址信息，以确定相应微电子元件内的可寻址存储器位置。 每个中心区域可以具有在相邻端子之间的最小间距的三倍和五倍的宽度。