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公开(公告)号：US20160247974A1
公开(公告)日：2016-08-25
申请号：US15045279
申请日：2016-02-17
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Tung-Lin Chuang , Yan-Ting Lan , Sheng-Tsung Hsu , Chih-Ming Shen , Jing-En Huang , Teng-Hsien Lai , Hung-Chuan Mai , Kuan-Chieh Huang , Shao-Ying Ting
Abstract: A light emitting diode including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, and a Bragg reflector structure. The emitting layer is configured to emit a light beam and is located between the first-type semiconductor layer and the second-type semiconductor layer. The light beam has a peak wavelength in a light emitting wavelength range. The first-type semiconductor layer, the emitting layer, and the second-type semiconductor layer are located on a same side of the Bragg reflector structure. A reflectance of the Bragg reflector structure is greater than or equal to 95% in a reflective wavelength range at least covering 0.8X nm to 1.8X nm, and X is the peak wavelength of the light emitting wavelength range.
Abstract translation: 包括第一类型半导体层，发光层，第二类型半导体层，第一电极，第二电极和布拉格反射器结构的发光二极管。 发光层被配置为发射光束并且位于第一类型半导体层和第二类型半导体层之间。 光束在发光波长范围内具有峰值波长。 第一型半导体层，发光层和第二类型半导体层位于布拉格反射器结构的同一侧。 至少覆盖0.8X〜1.8Xnm的反射波长范围内，布拉格反射体结构的反射率大于或等于95％，X是发光波长范围的峰值波长。
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62.发明申请LIGHT EMITTING DIODE HAVING DISTRIBUTED BRAGG REFLECTORS (DBR) AND MANUFACTURING METHOD THEREOF 有权具有分布式布拉格反射器（DBR）的发光二极管及其制造方法公开(公告)号：US20160240744A1
公开(公告)日：2016-08-18
申请号：US15045488
申请日：2016-02-17
Applicant: Genesis Photonics Inc.
Inventor： Yi-Ru Huang , Kuan-Chieh Huang , Chih-Ming Shen , Tung-Lin Chuang , Hung-Chuan Mai , Jing-En Huang , Shao-Ying Ting
CPC classification number: H01L33/46 , H01L33/10 , H01L33/44 , H01L33/50 , H01L33/62 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2933/0025 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting diode (LED) having distributed Bragg reflector (DBR) and a manufacturing method thereof are provided. The distributed Bragg reflector is used as a reflective element for reflecting the light generated by the light emitting layer to an ideal direction of light output. The distributed Bragg reflector has a plurality of through holes, such that the metal layer and the transparent conductive layer disposed on two sides of the distributed Bragg reflector may contact each other to conduct the current. Due to the distribution properties of the through holes, the current may be more uniformly diffused, and the light may be more uniformly emitted from the light emitting layer.
Abstract translation: 提供了具有分布式布拉格反射器（DBR）的发光二极管（LED）及其制造方法。 分布式布拉格反射器用作将由发光层产生的光反射到理想光输出方向的反射元件。 分布布拉格反射器具有多个通孔，使得设置在分布式布拉格反射器两侧的金属层和透明导电层可以彼此接触以导通电流。 由于通孔的分布特性，电流可以更均匀地扩散，并且光可以从发光层更均匀地发射。
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公开(公告)号：USD763805S1
公开(公告)日：2016-08-16
申请号：US29528298
申请日：2015-05-28
Applicant: Genesis Photonics Inc.
Designer： Jing-En Huang , Kuan-Chieh Huang , Shao-Ying Ting , Yi-Ru Huang
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公开(公告)号：US20160079496A1
公开(公告)日：2016-03-17
申请号：US14943036
申请日：2015-11-17
Applicant: Genesis Photonics Inc.
Inventor： Jing-En Huang , Shao-Ying Ting , Kuan-Yung Liao , Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo
Abstract: A light-emitting diode package structure includes a package carrier, a light guiding component and a light emitting unit. The light guiding component is disposed on the package carrier. The light emitting unit is disposed on an upper surface of light guiding component relatively distant from the package carrier. A horizontal projection area of the light guiding component is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding component and emits from the upper surface of the light guiding component. An included angle existing between the light beam and a normal direction of the upper surface ranges from 0 degree to 75 degrees.
Abstract translation: 发光二极管封装结构包括封装载体，导光部件和发光单元。 导光部件设置在封装载体上。 发光单元设置在相对远离封装载体的导光部件的上表面上。 导光部件的水平投影面积大于发光部件的水平投影面积。 发光单元适于发射光束，并且光束的一部分进入导光部件并从导光部件的上表面发射。 存在于光束与上表面的法线方向之间的夹角为0度〜75度。
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公开(公告)号：US20160079494A1
公开(公告)日：2016-03-17
申请号：US14582195
申请日：2014-12-24
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang
CPC classification number: H01L33/58 , H01L33/50 , H01L2933/0083
Abstract: A light emitting element structure includes a light emitting unit configured to emit light; a package unit configured to cover the light emitting unit; a transparent light guide structure arranged on the package unit; and a first periodic sub-wavelength microstructure formed on the transparent light guide structure, wherein a plurality of holes of the first periodic sub-wavelength microstructure form a periodic pattern, and a distance between two adjacent holes of the first periodic sub-wavelength microstructure is smaller than λ/n, λ is a peak wavelength of light passing through the package unit from the light emitting unit, and n is a refractive index of the first periodic sub-wavelength microstructure.
Abstract translation: 发光元件结构包括配置为发光的发光单元; 被配置为覆盖所述发光单元的封装单元; 布置在所述封装单元上的透明导光结构; 以及形成在所述透明导光体结构上的第一周期性亚波长微结构，其中所述第一周期性亚波长微结构的多个孔形成周期性图案，并且所述第一周期性亚波长微结构的两个相邻孔之间的距离为 小于λ/ n，λ是从发光单元通过封装单元的光的峰值波长，n是第一周期性亚波长微结构的折射率。
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Patent Agency Ranking
公开(公告)号：US20160043281A1
公开(公告)日：2016-02-11
申请号：US14919693
申请日：2015-10-21
Applicant: Genesis Photonics Inc.
Inventor： Yu-Yun Lo , Yi-Ru Huang , Chih-Ling Wu , Tzu-Yang Lin , Yun-Li Li
CPC classification number: H01L33/42 , H01L33/38 , H01L33/405 , H01L33/46 , H01L2224/14 , H01L2933/0016
Abstract: The present invention relates to a light emitting diode (LED) and a flip-chip packaged LED device. The present invention provides an LED device. The LED device is flipped on and connected electrically with a packaging substrate and thus forming the flip-chip packaged LED device. The LED device mainly has an Ohmic-contact layer and a planarized buffer layer between a second-type doping layer and a reflection layer. The Ohmic-contact layer improves the Ohmic-contact characteristics between the second-type doping layer and the reflection layer without affecting the light emitting efficiency of the LED device and the flip-chip packaged LED device. The planarized buffer layer id disposed between the Ohmic-contact layer and the reflection layer for smoothening the Ohmic-contact layer and hence enabling the reflection layer to adhere to the planarized buffer layer smoothly. Thereby, the reflection layer can have the effect of mirror reflection and the scattering phenomenon on the reflected light can be reduced as well.
Abstract translation: 本发明涉及发光二极管（LED）和倒装芯片封装的LED器件。 本发明提供一种LED装置。 LED装置被翻转并与封装基板电连接，从而形成倒装芯片封装的LED器件。 LED装置主要在第二种掺杂层和反射层之间具有欧姆接触层和平坦化缓冲层。 欧姆接触层改善了第二型掺杂层和反射层之间的欧姆接触特性，而不影响LED器件和倒装芯片封装的LED器件的发光效率。 设置在欧姆接触层和反射层之间的平坦化缓冲层id，用于使欧姆接触层平滑，从而使反射层平滑地粘附到平坦化缓冲层。 因此，反射层可以具有镜面反射的效果，并且也可以减小反射光上的散射现象。
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公开(公告)号：US20160013381A1
公开(公告)日：2016-01-14
申请号：US14542657
申请日：2014-11-17
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang
Abstract: A light emitting device structure includes a light emitting device, a molding compound, a transparent substrate and a reflective layer. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper and lower surfaces, and a first pad and a second pad located on the lower surface and separated from each other. The molding compound at least encapsulates the upper surface and the side surface, and exposes the first pad and the second pad. The transparent substrate is disposed above the upper surface of the light emitting device, and the molding compound is located between the transparent substrate and the light emitting device. The reflective layer directly covers the side surface of the light emitting device, wherein the molding compound encapsulates the reflective layer and exposes a bottom surface of the reflective layer.
Abstract translation: 发光器件结构包括发光器件，模塑料，透明衬底和反射层。 发光器件具有彼此相对的上表面和下表面，连接上表面和下表面的侧表面，以及位于下表面上并彼此分离的第一焊盘和第二焊盘。 成型化合物至少封装上表面和侧表面，并暴露第一垫和第二垫。 透明基板设置在发光器件的上表面之上，并且模塑料位于透明基板和发光器件之间。 反射层直接覆盖发光器件的侧表面，其中模制化合物封装反射层并暴露反射层的底表面。
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公开(公告)号：US09219211B1
公开(公告)日：2015-12-22
申请号：US14474283
申请日：2014-09-01
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Kuan-Chieh Huang , Jing-En Huang , Yi-Ru Huang , Sie-Jhan Wu , Long-Lin Ke
CPC classification number: H01L33/0095 , H01L25/0753 , H01L27/15 , H01L33/005 , H01L33/08 , H01L33/486 , H01L33/50 , H01L33/502 , H01L33/507 , H01L33/52 , H01L33/62 , H01L33/64 , H01L2224/04105 , H01L2224/18 , H01L2224/19 , H01L2224/24137 , H01L2924/0002 , H01L2933/0016 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H05B33/0803 , H05B33/0806 , H05B33/0827 , H01L2924/00
Abstract: A method for manufacturing a light emitting unit is provided. A semiconductor structure including a plurality of light emitting dice separated from each other is provided. A molding compound is formed to encapsulate the light emitting dice. Each of the light emitting dice includes a light emitting element, a first electrode and a second electrode. A patterned metal layer is formed on the first electrodes and the second electrodes of the light emitting dice. A substrate is provided, where the molding compound is located between the substrate and the light emitting elements of the light emitting dice. A cutting process is performed to cut the semiconductor structure, the patterned metal layer, the molding compound and the substrate so as to define a light emitting unit with a series connection loop, a parallel connection loop or a series-parallel connection loop.
Abstract translation: 提供一种制造发光单元的方法。 提供包括彼此分离的多个发光骰子的半导体结构。 形成模塑料以封装发光管芯。 每个发光管芯包括发光元件，第一电极和第二电极。 在第一电极和发光管芯的第二电极上形成图案化的金属层。 提供了一种基板，其中模塑料位于基板和发光芯片的发光元件之间。 执行切割处理以切割半导体结构，图案化金属层，模制化合物和基板，以便限定具有串联连接环路，并联连接环路或串联 - 并联连接环路的发光单元。
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公开(公告)号：US20150103556A1
公开(公告)日：2015-04-16
申请号：US14513210
申请日：2014-10-14
Applicant: Genesis Photonics Inc.
Inventor： Shao-Ying Ting , Jing-En Huang , Pei-Hsin Chen , Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo
IPC: F21V8/00
CPC classification number: F21K9/61 , F21Y2115/10
Abstract: A package carrier is suitable for carrying at least one light emitting unit. The package carrier includes an annular shell and a transparent light guiding stage. The annular shell has a cavity. The transparent light guiding stage is disposed in the cavity of the annular shell. The light emitting unit is adapted to be disposed on the transparent light guiding stage, and a horizontal projection area of the transparent light guiding stage is greater than that of the light emitting unit. The light emitting unit emits a light beam to enter the transparent light guiding stage, and the light beam emits from a surface of the transparent light guiding stage relatively distant from the cavity.
Abstract translation: 包装载体适用于承载至少一个发光单元。 包装载体包括环形壳和透明导光级。 环形壳体具有空腔。 透明导光台设置在环形壳体的空腔中。 发光单元适于设置在透明导光台上，并且透明导光台的水平投影区域大于发光单元的水平投影区域。 发光单元发射光束进入透明光引导台，并且光束从相对远离空腔的透明导光台的表面发射。
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公开(公告)号：US20150102379A1
公开(公告)日：2015-04-16
申请号：US14513228
申请日：2014-10-14
Applicant: Genesis Photonics Inc.
Inventor： Yun-Li Li , Jing-En Huang , Shao-Ying Ting , Chih-Ling Wu , Yi-Ru Huang , Yu-Yun Lo
Abstract: A light emitting diode structure includes a substrate and a light emitting unit. The substrate has a protrusion portion and a light guiding portion. The protrusion portion and the light guiding portion have a seamless connection therebetween, and a horizontal projection area of the protrusion portion is smaller than that of the light guiding portion. The light emitting unit is disposed on the protrusion portion of the substrate. The light emitting unit is adapted to emit a light beam, and a portion of the light beam enters the light guiding portion from the protrusion portion and emits from an upper surface of the light guiding portion uncovered by the protrusion portion.
Abstract translation: 发光二极管结构包括基板和发光单元。 基板具有突出部和导光部。 突出部和导光部之间具有无缝连接，突出部的水平投影面积小于导光部的水平投影面积。 发光单元设置在基板的突出部分上。 发光单元适于发射光束，并且光束的一部分从突出部分进入导光部分，并且从未被突出部分覆盖的导光部分的上表面发射。
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