公开(公告)号：US09545007B2

公开(公告)日：2017-01-10

申请号：US14354997

申请日：2013-08-10

Applicant: INCO INNOVATION

Inventor： Jan Berglund

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

Abstract translation: 一种动力链，包括链条，该链条包括以至少两层安装在电路板上的导电元件的链接，并且使得包括在动力链中的元件被组合移位和重叠并且彼此电接触。

公开(公告)号：US09173298B2

公开(公告)日：2015-10-27

申请号：US14097251

申请日：2013-12-05

Applicant: Zhen Ding Technology Co., Ltd.

Inventor： Yong Ha Woo ,  E-Tung Chou ,  Wen-Lun Lo

IPC: H01L21/48 ,  H01L21/44 ,  H05K3/00 ,  H01L23/498 ,  H01L25/10 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L25/105 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/09 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/181 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0347 ,  H05K2201/0379 ,  H05K2201/09836 ,  H05K2201/10674 ,  H05K2203/0384 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract translation: 封装基板包括电路板，多个第一导电柱和多个第二导电柱。 电路板包括形成在第一基底的第一表面上的第一基底和第一导电图案层。 第一导电柱从第一导电图案层延伸并电连接到第一导电图案层。 第二导电柱从第一导电图案层延伸并与之电连接。 每个第二导电柱的高度大于每个第一导电柱的高度。

公开(公告)号：US09078371B2

公开(公告)日：2015-07-07

申请号：US13651789

申请日：2012-10-15

Applicant: Raytheon Company

Inventor： Andrew K. Brown ,  Thomas L. Obert ,  Michael J. Sotelo ,  Darin M. Gritters ,  Kenneth W. Brown

IPC: H05K1/16 ,  H05K3/06 ,  H05K1/02

CPC classification number: H05K1/167 ,  H05K1/0234 ,  H05K1/0242 ,  H05K3/06 ,  H05K2201/0379 ,  H05K2201/09263 ,  H05K2201/09727 ,  H05K2201/09781

Abstract: An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.

Abstract translation: 用于传送电信号的装置包括：具有导电材料的导电路径。 导电材料具有第一边缘和第二边缘，并且被配置为传送电信号。 该装置还包括与导电路径的至少一部分接触的电阻材料，覆盖导电路径的边缘并且延伸超过边缘。 电阻材料的导电率小于导电材料的导电率。

公开(公告)号：US09030007B2

公开(公告)日：2015-05-12

申请号：US12903403

申请日：2010-10-13

Applicant: Daisuke Mizutani

Inventor： Daisuke Mizutani

IPC: H01L23/48 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01L21/768 ,  H05K1/02 ,  H05K3/22

CPC classification number: H05K1/147 ,  H01L21/76898 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/222 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/092 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2924/00

Abstract: A semiconductor device includes a first circuit base member including a surface having multiple first electrodes formed thereon, a second circuit base member being provided above the first circuit base member and having first through holes and second through holes formed respectively above the first electrodes, a semiconductor package provided above the second circuit base member, and multiple first bumps provided inside the first through holes and the second through holes to connect the first electrodes to the semiconductor package.

Abstract translation: 半导体器件包括：第一电路基体部件，其包括形成有多个第一电极的表面;第二电路基体部件，设置在第一电路基体的上方，并具有分别形成在第一电极上方的第一通孔和第二通孔; 设置在第二电路基体上方的封装，以及设置在第一通孔内的多个第一凸起和第二通孔，以将第一电极连接到半导体封装。

公开(公告)号：US20150060125A1

公开(公告)日：2015-03-05

申请号：US14476756

申请日：2014-09-04

Applicant: WINTEK CORPORATION

Inventor： David E. Stevenson ,  Siang-Lin Huang ,  Chia-Chi Chen ,  Kuo-Chang Su

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K3/0023 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111 ,  H05K1/162 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0379 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: A touch panel includes a substrate, a plurality of first axis electrodes, a plurality of second axis electrodes and a first insulation layer. Each first axis electrode includes a plurality of first sub-electrodes and a plurality of first connection parts disposed between two adjacent first sub-electrodes. The first sub-electrodes and the first connection parts are monolithically formed. Each second axis electrode includes a plurality of second sub-electrodes and a plurality of second connection parts disposed between two adjacent second sub-electrodes. The second sub-electrodes and the second connection parts are monolithically formed. The first sub-electrodes and the second sub-electrodes are disposed on an identical surface. The first insulation layer is disposed on and completely covers the first axis electrodes. The first insulation layer is partially disposed between the first connection part and the second connection part. The first axis electrodes are disposed between the first insulation layer and the substrate.

Abstract translation: 触摸面板包括基板，多个第一轴电极，多个第二轴电极和第一绝缘层。 每个第一轴电极包括多个第一子电极和设置在两个相邻的第一子电极之间的多个第一连接部分。 第一子电极和第一连接部分是单片形成的。 每个第二轴电极包括多个第二子电极和设置在两个相邻的第二子电极之间的多个第二连接部分。 第二子电极和第二连接部分是单片形成的。 第一子电极和第二子电极设置在相同的表面上。 第一绝缘层设置在第一轴电极上并完全覆盖第一轴电极。 第一绝缘层部分地设置在第一连接部和第二连接部之间。 第一轴电极设置在第一绝缘层和基板之间。

公开(公告)号：US08510938B2

公开(公告)日：2013-08-20

申请号：US12951245

申请日：2010-11-22

Applicant: Chien-Nan Yu ,  Chung-Feng Tsao ,  Hang-Kau Khor ,  Wen-Chi Shih ,  Ying-Chieh Chen ,  Yu-Hsiao Li

Inventor： Chien-Nan Yu ,  Chung-Feng Tsao ,  Hang-Kau Khor ,  Wen-Chi Shih ,  Ying-Chieh Chen ,  Yu-Hsiao Li

IPC: H01R9/00 ,  H05K3/00

CPC classification number: H05K3/305 ,  H01L27/14618 ,  H01L2224/16245 ,  H04N5/2253 ,  H04N5/2257 ,  H05K3/4015 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/09072 ,  H05K2201/10151 ,  H05K2203/0278 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49151

Abstract: The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.

Abstract translation: 本发明公开了一种组装相机模块的方法。 该方法包括将多个导电凸块放置在基板的导电接触件上，使得形成大的导电凸块，并将基板和图像芯片压在一起，使得导电触点与形成在图像芯片上的焊盘通过大导电 撞击组合导电触点和焊盘。 由于基板和图像芯片之间没有接触，而是大的导电凸块，所以该方法降低了基板和图像芯片之间的断裂概率，并提高了相机模块的质量。

公开(公告)号：US08476773B2

公开(公告)日：2013-07-02

申请号：US12787485

申请日：2010-05-26

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H01L23/52

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电结构，包括包括第一导电焊盘的第一基板，包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US20130161823A1

公开(公告)日：2013-06-27

申请号：US13777670

申请日：2013-02-26

Applicant: Panasonic Corporation

Inventor： Yoshiaki Shimizu ,  Yuichiro Yamada ,  Toshiyuki Fukuda

IPC: H01L23/00

CPC classification number: H05K3/38 ,  B29C43/18 ,  B29C45/02 ,  B29C45/14655 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/27 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L25/105 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3511 ,  H05K3/3457 ,  H05K2201/0379 ,  H05K2201/10515 ,  H05K2201/10977 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/0635 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2924/0695

Abstract: A semiconductor device capable of realizing highly reliable three-dimensional mounting, and a method of manufacturing the same, are provided. A projected electrode 9 is formed in a region outside of an element mounting region of a substrate 5. The projected electrode 9 includes a protruding portion that protrudes from the front face of a molding resin portion 10. The distal end of the protruding portion is a flat face 13. In addition, a portion of the projected electrode 9 whose cross section is larger than the protruding portion is positioned inside the molding resin portion 10.

Abstract translation: 提供能够实现高度可靠的三维安装的半导体器件及其制造方法。 突起电极9形成在基板5的元件安装区域的外侧的区域中。突出电极9包括从模制树脂部分10的前表面突出的突出部分。突出部分的远端是 另外，突出电极9的横截面大于突出部分的部分位于模制树脂部分10的内部。

公开(公告)号：US08450753B2

公开(公告)日：2013-05-28

申请号：US13063983

申请日：2009-06-02

Applicant: Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

Inventor： Motoji Shiota ,  Gen Nagaoka ,  Ichiro Umekawa ,  Yasuhiro Hida ,  Yukio Shimizu

IPC: H01L29/18

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H01L2224/73204 ,  H01L2924/07811 ,  H05K1/0231 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/0379 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.

Abstract translation: 液晶显示装置（100）具有安装有LSI芯片（130）的玻璃基板（110）和FPC基板（140）。 使用由单片制成的部件ACF（150a），以进一步将诸如稳定电容器（150）的分立电子部件安装在玻璃基板（110）上。 部件ACF（150a）的尺寸不仅覆盖要安装分立电子部件的区域，而且覆盖首先安装的LSI芯片（130）和FPC基板（140）的顶表面。 通过这样使用大分量ACF（150a），消除了将部件ACF（150a）粘附到玻璃基板（110）上的位置约束，减小了安装分立电子部件的区域的面积。 由此，提供了通过减小​​安装有分立电子部件的区域的面积而小型化的板模块。

公开(公告)号：US08410610B2

公开(公告)日：2013-04-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。