公开(公告)号：US20110248200A1

公开(公告)日：2011-10-13

申请号：US13119041

申请日：2009-09-18

Applicant: Paul Fathauer

Inventor： Paul Fathauer

IPC: F16K31/02 ,  H05K13/00

CPC classification number: H05K1/115 ,  F16K31/02 ,  H05K1/119 ,  H05K1/18 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10818 ,  Y10T29/49002

Abstract: A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

Abstract translation: 一种印刷电路组件（PCA），其提供重建电动自动变速器螺线管模块的方法。 PCA允许驻留在模块组件的跨度内的几个螺线管的可修复但坚固的互连。

公开(公告)号：US20110226516A1

公开(公告)日：2011-09-22

申请号：US13024897

申请日：2011-02-10

Applicant: TSUTOMU TAKEDA

Inventor： TSUTOMU TAKEDA

IPC: H05K1/16

CPC classification number: H05K1/0251 ,  H01L2924/15311 ,  H01L2924/19051 ,  H05K1/0231 ,  H05K1/162 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0355 ,  H05K2201/09809 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0207 ,  H05K2203/1572

Abstract: A wiring board includes at least one signal layer, at least one ground layer, at least one power plane, at least one power supply via that electrically conducts wiring over one substrate surface where a semiconductor device chip is mounted, wiring over another substrate surface, and the power plane, and signal wiring for performing signal transmission between a plurality of semiconductor device chips. The power plane is placed to the one substrate surface side than the signal wiring. The power supply via is composed of a large diameter aperture and a small diameter aperture. The large diameter aperture has a relatively large diameter and is formed from the one substrate surface to the power plane, and the small diameter aperture has a relatively small diameter and is formed from the power plane to the other substrate surface.

Abstract translation: 布线板包括至少一个信号层，至少一个接地层，至少一个电力平面，至少一个电源通孔，该电源通过一个衬底表面上电导线，半导体器件芯片安装在一个衬底表面上，在另一个衬底表面上布线， 以及用于在多个半导体器件芯片之间进行信号传输的信号布线。 电源平面被放置在与信号布线相对的一个基板表面侧。 电源通孔由大直径孔径和小直径孔径组成。 大直径孔径具有相对大的直径，并且由一个基板表面到动力平面形成，并且小直径孔径具有相对较小的直径并且从动力平面形成到另一个基底表面。

公开(公告)号：US07883378B2

公开(公告)日：2011-02-08

申请号：US12285893

申请日：2008-10-16

Applicant: Shiro Yamashita ,  Hideto Yoshinari

Inventor： Shiro Yamashita ,  Hideto Yoshinari

IPC: H01R13/42

CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract translation: 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。

公开(公告)号：US20100096744A1

公开(公告)日：2010-04-22

申请号：US12573395

申请日：2009-10-05

Applicant: Hiroyuki Mori ,  Kazushige Kawasaki

Inventor： Hiroyuki Mori ,  Kazushige Kawasaki

IPC: H01L23/48 ,  H05K1/11 ,  H01K3/10 ,  H01L21/60

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/205 ,  H05K3/421 ,  H05K3/4682 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0574 ,  Y10T29/49124 ,  Y10T29/49162 ,  H01L2924/00012 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2224/05671

Abstract: Embodiments of the present invention provide a printed wiring board in which solder bumps of a mounted semiconductor chip are less prone to be ruptured. The printed wiring board includes a coreless substrate which includes: a dielectric layer having a main surface and a connecting pad embedded in the dielectric layer. The connecting pad is shaped like a brimmed hat. That is, the connecting pad includes a plate portion whose diameter φ1 is about 95 μm and a contact portion whose diameter φc is about 75 μm. The main surface of the contact portion is exposed at the main surface of the dielectric layer. Since diameter φc of the contact portion is substantially the same as diameter φ2 of an under bump metal at the semiconductor chip side, even if mechanical stress is applied in a direction in which the semiconductor chip is peeled off from the coreless substrate, the stress disperses evenly to both of the connecting pad and the under bump metal, and thus rupture is less prone to occur.

Abstract translation: 本发明的实施例提供了一种印刷线路板，其中安装的半导体芯片的焊料凸块不容易破裂。 印刷电路板包括无芯基板，其包括：具有主表面的电介质层和嵌入在电介质层中的连接焊盘。 连接垫的形状像一顶帽子。 也就是说，连接焊盘包括直径为约95μm的板部分和直径为约75μm的接触部分。 接触部分的主表面在电介质层的主表面露出。 由于接触部的直径＆phcc与半导体芯片侧的凸块下部的直径＆lt; 2＆gt; 2相同，所以即使在半导体芯片从无芯基板剥离的方向上施加机械应力 ，应力均匀地分散到连接焊盘和下凸块金属两者上，因此不容易发生破裂。

公开(公告)号：US20090288859A1

公开(公告)日：2009-11-26

申请号：US12401064

申请日：2009-03-10

Applicant: Wen-Cheng Ho ,  Tzu-Shih Shen

Inventor： Wen-Cheng Ho ,  Tzu-Shih Shen

IPC: H05K7/20 ,  H01B5/00

CPC classification number: H05K1/0219 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09854

Abstract: A thermal enhanced substrate having a non-cylinder via structure includes at least a metal layer disposed on an insulating base material and a number of thermal channels respectively constituted by at least a trough pattern penetrating the insulating base material and a conductive material deposited in the trough pattern. The trough pattern serves as a non-cylinder via structure having at least an elongated hole for heat dissipations so as to reduce a working temperature of an electronic device.

Abstract translation: 具有非气缸通孔结构的热增强基板包括至少设置在绝缘基材上的金属层和分别由穿过绝缘基材的至少一个槽形图案和沉积在槽中的导电材料构成的多个热通道 模式。 槽图案用作非气缸通孔结构，其具有用于散热的至少一个细长孔，以便降低电子设备的工作温度。

公开(公告)号：US20090246615A1

公开(公告)日：2009-10-01

申请号：US12358032

申请日：2009-01-22

Applicant: Junyoung Park

Inventor： Junyoung Park

IPC: H01M6/42 ,  H01M4/02

CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

Abstract: A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.

Abstract translation: 公开了一种电池组，其防止由于电池将电池连接到保护电路板而将焊料材料向下流动，从而提高了可靠性，耦合效率，安全性和生产率。 电池组包括：具有正电极和负电极的多单元电池，多个电池单元彼此电连接; 电连接到多节电池并具有通孔的保护电路板; 一对导电片，每个导电片包括插入对应的通孔中的插入部分和从插入部分整体延伸并从插入部分弯曲的弯曲部分; 以及一对焊接部分，每个焊接部分在相应的插入部分和对应的弯曲部分的至少一些部分处形成。

公开(公告)号：US20090161324A1

公开(公告)日：2009-06-25

申请号：US12210931

申请日：2008-09-15

Applicant: Noriaki Sakamoto ,  Masahiro Kobayashi

Inventor： Noriaki Sakamoto ,  Masahiro Kobayashi

IPC: H05K9/00 ,  H05K7/00

CPC classification number: H05K9/006 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3447 ,  H05K2201/09145 ,  H05K2201/09854 ,  H05K2201/10371

Abstract: A shielding case for accommodating a wiring board includes a board mounting member with a fitting member formed at an outer frame thereof so that the wiring board is fixed and held to the board mounting member through fitting of the fitting member into a through hole formed at the wiring board.

Abstract translation: 一种用于容纳布线板的屏蔽壳体，包括：板安装部件，其具有形成在其外框架上的嵌合部件，使得所述布线板通过将所述嵌合部件嵌入到形成在所述导线板上的通孔中而固定并固定在所述板安装部件上 接线板

公开(公告)号：US20090003883A1

公开(公告)日：2009-01-01

申请号：US12103168

申请日：2008-04-15

Applicant: An-sik CHOI

Inventor： An-sik CHOI

IPC: G03G15/04

CPC classification number: H05K3/306 ,  G03G15/04072 ,  G03G15/0435 ,  G03G2215/0404 ,  H05K1/0295 ,  H05K1/119 ,  H05K3/3447 ,  H05K2201/09418 ,  H05K2201/09854 ,  H05K2201/09954 ,  H05K2201/10121

Abstract: An optical scanning unit that deflects light in a main scanning direction to radiate the light on an exposure object. The optical scanning unit includes a light source having a signal terminal, and a circuit board having a slot-shaped inserting portion into which the signal terminal is inserted.

Abstract translation: 一种光扫描单元，其将主扫描方向的光偏转，以将光照射在曝光对象上。 光学扫描单元包括具有信号端子的光源和具有插入信号端子的槽形插入部分的电路板。

公开(公告)号：US20080173476A1

公开(公告)日：2008-07-24

申请号：US11825169

申请日：2007-07-05

Applicant: Martin A. Cotton

Inventor： Martin A. Cotton

IPC: H05K9/00

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0221 ,  H05K1/115 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/4652 ,  H05K2201/09036 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2201/09981 ,  H01L2224/0401

Abstract: Construction of printed circuit boards (PCBs) containing electromagnetic shielding and conductive tubes forming signal lines and/or waveguides. The method of construction calls for forming of grooves through layers of the PCB and coating the interior surfaces of these grooves with conductive material. These conductor-coated groove walls serve as conductive surfaces between embedded conductive surfaces on different layers. The conductive surfaces thus joined form a continuous electrically conductive surface that can be configured to act as an electromagnetic shield. Such conductive surfaces may be configured with internal conductors to act as a signal line, or without internal conductors to act as a waveguide.

Abstract translation: 构造包含电磁屏蔽和形成信号线和/或波导的导电管的印刷电路板（PCB）。 施工方法要求通过PCB的层形成凹槽，并用导电材料涂覆这些凹槽的内表面。 这些导体涂覆的槽壁用作不同层上的嵌入的导电表面之间的导电表面。 这样连接的导电表面形成连续的导电表面，该表面可配置为充当电磁屏蔽。 这样的导电表面可以配置有内部导体以用作信号线，或者不具有用作波导的内部导体。

公开(公告)号：US20080060194A1

公开(公告)日：2008-03-13

申请号：US11830167

申请日：2007-07-30

Applicant: Guo-Cheng Liao

Inventor： Guo-Cheng Liao

IPC: H05K3/10 ,  H01K3/10 ,  H05K3/00 ,  B05D5/12

CPC classification number: H05K1/162 ,  H05K1/167 ,  H05K3/0044 ,  H05K3/42 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2201/09981 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for fabricating a passive circuit in a circuit substrate is provided. The circuit substrate comprising a first metallic layer, a second metallic layer, and a dielectric layer is provided firstly, and the dielectric layer is disposed between the first metallic layer and the second metallic layer. Thereafter, a strip shaped through hole through the circuit substrate is formed. Afterward, a third metallic layer is formed on a part of a wall of the strip shaped through hole, and the third metallic layer is electrically connected to the first metallic layer and/or the second metallic layer. The third metallic layer functions as the passive circuit.

Abstract translation: 提供了一种在电路基板中制造无源电路的方法。 首先提供包括第一金属层，第二金属层和电介质层的电路基板，并且介电层设置在第一金属层和第二金属层之间。 此后，形成通过电路基板的带状通孔。 之后，在带状通孔的壁的一部分上形成第三金属层，第三金属层与第一金属层和/或第二金属层电连接。 第三金属层用作无源电路。