公开(公告)号：US07952365B2

公开(公告)日：2011-05-31

申请号：US11817280

申请日：2006-03-22

Applicant: Kaoru Narita ,  Taras Kushta

Inventor： Kaoru Narita ,  Taras Kushta

IPC: G01R27/04 ,  G01R27/28 ,  G01J3/00

CPC classification number: H05K1/0268 ,  G01R27/2617 ,  G01R31/2805 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10068

Abstract: A plurality of through-hole vias connected to conductor layers is disposed with gaps left between these vias around opening parts disposed in the conductor layers in a printed board in which these conductor layers are disposed parallel to each other so as to sandwich a dielectric layer in between. Furthermore, through-hole vias used for excitation are disposed in the opening parts of the conductor layers and regions of the dielectric layer matching these opening parts in a non-contact manner with the conductor layers. When the complex dielectric constant is measured, a high-frequency power is applied to the through-hole vias, and the power loss between the through-hole vias and the conductor layers is measured by the S parameter method. As a result, the complex dielectric constant and the frequency dependency of this complex dielectric constant can be measured with a high precision in a frequency range extending from several gigahertzes to 20 GHz, and there is no electrical interference with other parts even when this resonator is mounted on a board.

Abstract translation: 连接到导体层的多个通孔过孔被布置成在印刷电路板的布置在导体层中的开口部分周围的这些通孔之间留有间隙，其中这些导体层彼此平行设置，以将电介质层夹在 之间。 此外，用于激励的通孔过孔以与导体层非接触的方式设置在导体层的开口部分和与这些开口部分匹配的电介质层的区域。 当测量复介电常数时，对通孔通孔施加高频功率，通过S参数法测量通孔和导体层之间的功率损耗。 结果，可以在从几千兆赫到20GHz的频率范围内以高精度测量该复合介电常数的复介电常数和频率依赖性，即使该谐振器是 安装在板上。

公开(公告)号：US07619496B2

公开(公告)日：2009-11-17

申请号：US11977276

申请日：2007-10-24

Applicant: Alexandre Rogozine

Inventor： Alexandre Rogozine

IPC: H01P1/205 ,  H01P1/213

CPC classification number: H01P1/2056 ,  H01P1/2136 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/10068 ,  H05K2201/10666

Abstract: A resonator/filter adapted for direct surface mounting to the surface of a printed circuit board. The resonator/filter comprises a block of dielectric material including at least one resonator through-hole extending therethrough and respective top, bottom and side surfaces defining respective regions of dielectric material covered with conductive material. The top block surface defines at least a first conductive region. A second conductive region on the bottom surface of the block defines an input/output contact which allows the filter to be mounted on the board with the bottom filter surface seated thereon, thus providing a direct ground contact between the board and the resonator through-hole for improved attenuation performance particularly at higher frequencies. A plurality of transmission line embodiments electrically interconnect the first and second conductive regions.

Abstract translation: 适用于直接表面安装到印刷电路板表面的谐振器/滤波器。 谐振器/滤波器包括介电材料块，其包括延伸穿过其中的至少一个谐振器通孔以及限定用导电材料覆盖的介电材料的相应区域的相应顶部，底部和侧面。 顶部块表面限定至少第一导电区域。 块的底表面上的第二导电区域限定了输入/输出触点，其允许滤波器安装在板上，底部滤波器表面位于其上，从而在板和谐振器通孔之间提供直接接地 用于改善衰减性能，特别是在较高频率下。 多个传输线实施例将第一和第二导电区域电互连。

公开(公告)号：US20090051446A1

公开(公告)日：2009-02-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US20080122547A1

公开(公告)日：2008-05-29

申请号：US12009406

申请日：2008-01-18

Applicant: Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

Inventor： Manabu Ito ,  Minoru Fukuda ,  Tetuo Kudo ,  Takeshi Uchida

IPC: H03L1/04 ,  H03B5/04 ,  H03B5/32

CPC classification number: H03B5/36 ,  H03B5/04 ,  H03L1/04 ,  H05K1/0212 ,  H05K1/0243 ,  H05K3/306 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/2036

Abstract: A lead wire led-out type crystal oscillator of constant temperature type for high stability is disclosed, which includes a heat supply body that supplies heat to a crystal resonator from which a plurality of lead wires are led out, to maintain the temperature constant. The heat supply body includes a heat conducting plate which has through-holes for the lead wires and is mounted on the circuit board, and which faces, and is directly thermally joined to, the crystal resonator and a chip resistor for heating which is mounted on the circuit board adjacent to the heat conducting plate, and is thermally joined to the heat conducting plate.

Abstract translation: 公开了一种用于高稳定性的恒温型引线引出型晶体振荡器，其包括向多个引线从其引出的晶体谐振器供热，以保持温度恒定的供热体。 供热体包括：导热板，其具有用于引线的通孔并且安装在电路板上，并且面向并直接热连接到晶体谐振器和用于加热的片状电阻器 电路板与导热板相邻，并且热连接到导热板。

公开(公告)号：US20080116981A1

公开(公告)日：2008-05-22

申请号：US11985132

申请日：2007-11-14

Applicant: Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

Inventor： Robert A. Jacobson ,  Elisio C. Das Neves ,  Glen Reeser ,  Thomas A. Knecht

IPC: H03L7/085 ,  H03B5/30 ,  H03B1/00 ,  H03L7/08

CPC classification number: H03B5/1847 ,  H03B2200/0008 ,  H03B2200/0034 ,  H03B2200/004 ,  H05K1/0243 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10734

Abstract: A voltage controlled oscillator (VCO) assembly and module incorporating a ball grid array resonator as part of the tank circuit of the voltage controlled oscillator. The VCO module preferably incorporates at least an oscillator circuit, the tank circuit, and an output buffer stage circuit all defined by a plurality of interconnected electrical/electronic components including the ball grid array resonator which are mounted to a printed circuit board. In another embodiment, the oscillator assembly also includes a phase-locked loop circuit defined at least in part by an integrated circuit mounted to the printed circuit board.

Abstract translation: 压控振荡器（VCO）组件和模块结合有球栅阵列谐振器作为压控振荡器的电路的一部分。 VCO模块优选地至少包括振荡器电路，振荡电路和输出缓冲级电路，其全部由包括安装到印刷电路板的球栅阵列谐振器的多个互连的电气/电子部件限定。 在另一个实施例中，振荡器组件还包括至少部分地由安装到印刷电路板的集成电路限定的锁相环电路。

公开(公告)号：US06835601B2

公开(公告)日：2004-12-28

申请号：US10409972

申请日：2003-04-09

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01L2144

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US20030207546A1

公开(公告)日：2003-11-06

申请号：US10409972

申请日：2003-04-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaya Wajima

IPC: H01L021/44

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US5760666A

公开(公告)日：1998-06-02

申请号：US694647

申请日：1996-08-09

Applicant: Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

Inventor： Hiroshi Tada ,  Hajime Suemasa ,  Haruo Matsumoto ,  Takashi Maruyama ,  Hideyuki Kato ,  Yasuo Yamada ,  Hirohumi Miyamoto ,  Hitoshi Tada

IPC: H01P1/205 ,  H01P1/213 ,  H01P5/08 ,  H01P7/04 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H01P1/202

CPC classification number: H05K1/0243 ,  H01P1/2056 ,  H05K1/141 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10969 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/368

Abstract: A dielectric resonant component includes at least one dielectric multistage resonator including one dielectric block, a plurality of inner conductor formation holes formed in the one dielectric block, an inner conductor formed on an inner surface of each of the inner conductor formation holes, and an outer conductor covering a substantially entire outer surface of the one dielectric block, the dielectric multistage resonator constituting a plurality of dielectric resonators in the one dielectric block; and a mount substrate fixedly mounted on the dielectric multistage resonator, for transmitting a signal transmission between each of the dielectric resonators of the dielectric multistage resonator and an external circuit board, when the dielectric resonant component is mounted on the external circuit board. The dielectric multistage resonator further includes a pair of input/output electrodes, and the mount substrate includes a unit for connecting the input/output electrodes of the dielectric multistage resonator to a pair of input/output electrodes formed on the circuit board.

Abstract translation: 电介质谐振元件包括至少一个电介质多级谐振器，其包括一个介质块，形成在一个介质块中的多个内导体形成孔，形成在每个内导体形成孔的内表面上的内导体， 导电体覆盖一个介质块的基本上整个的外表面，电介质多级谐振器在该介电块中构成多个介质谐振器; 以及固定地安装在电介质多级谐振器上的安装基板，用于在电介质多级谐振器的每个介质谐振器和外部电路板之间传输信号，当介质谐振元件安装在外部电路板上时。 电介质多级谐振器还包括一对输入/输出电极，并且安装基板包括用于将电介质多级谐振器的输入/输出电极连接到形成在电路板上的一对输入/输出电极的单元。

公开(公告)号：US5724728A

公开(公告)日：1998-03-10

申请号：US552917

申请日：1995-11-03

Applicant: Robert H. Bond ,  Harry M. Siegel

Inventor： Robert H. Bond ,  Harry M. Siegel

IPC: H01L23/58 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/10 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01L23/58 ,  H05K1/181 ,  H05K7/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K2201/10037 ,  H05K2201/10068 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/325 ,  Y02P70/611 ,  Y10T29/49144

Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Abstract translation: 一种用于封装集成电路部件的系统，包括具有耦合到所述衬底的多个焊球的球栅阵列衬底。 半导体器件安装在衬底上并电耦合到焊球。 一个或多个端子耦合到基板并电耦合到所述半导体器件。 可拆卸模块包含辅助部件。 该模块包括用于容纳部件的主体部分和用于与相应端子配合的一个或多个电连接器，以将模块保持在基板上并将部件与半导体器件电耦合。 端子也可以连接到焊球，使得部件可以可选地设置在电路板上或可拆卸模块中。

公开(公告)号：US5661441A

公开(公告)日：1997-08-26

申请号：US509533

申请日：1995-07-31

Applicant: Takayoshi Morino ,  Yukiro Kashima

Inventor： Takayoshi Morino ,  Yukiro Kashima

IPC: H05K9/00 ,  H01P7/10 ,  H01P11/00 ,  H03B5/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01P7/10 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K3/0061 ,  H05K3/341

Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.

Abstract translation: 微波振荡器包括在顶表面上具有电路图案的基板，覆盖底表面的薄铜箔和一个孔。 电子部件安装到基板的顶表面。 金属板附着到基板的底面，从而封闭孔的底部。 介质谐振器通过孔附着到金属板上。 由于介质谐振器通过焊接附接到金属板，所以介质谐振器和金属板之间的结合比通过使用常规粘合剂所实现的更坚固和更稳定。 这增强了对温度变化的可靠性; 机械冲击或湿度。