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    Process for making a heat radiating structure for high-power LED
    62.
    发明授权
    Process for making a heat radiating structure for high-power LED 有权
    制造大功率LED散热结构的工艺

    公开(公告)号：US08757473B2

    公开(公告)日：2014-06-24

    申请号：US13989818

    申请日：2012-08-30

    Applicant: Xiaofeng Bi

    Inventor： Xiaofeng Bi

    IPC: B23K31/02

    CPC classification number: B23K31/02 ,  H01L33/64 ,  H01L2933/0075 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10416

    Abstract: A process of making a heat radiating structure for high-power LED comprises: (1) providing a PCB board, a heat conducting plate and a heat radiating plate; (2) providing a first locating hole and a first fixation hole penetrating the PCB board, and welding a copper plate to one side of the PCB board; while soldering an electrode welding leg to the other side of the PCB board; (3) providing a second locating hole and a second fixation hole penetrating the heat conducting plate; (4) using a fixation column to pierce through both of the fixation holes for connecting together the PCB board and the heat conducting plate; (5) using a heat conducting column to pierce through both of the locating holes; (6) placing the integral piece of the heat conducting plate and the PCB board on a pressing equipment to adjust the height of the heat conducting column.

    Abstract translation: 制作大功率LED散热结构的工艺包括：（1）提供PCB板，导热板和散热板; （2）提供穿过PCB板的第一定位孔和第一固定孔，并将铜板焊接到PCB板的一侧; 同时将电极焊接脚焊接到PCB板的另一侧; （3）提供穿过导热板的第二定位孔和第二固定孔; （4）使用固定柱穿过用于将PCB板和导热板连接在一起的两个固定孔; （5）使用导热柱刺穿两个定位孔; （6）将导热板和PCB板的一体放置在压制设备上以调节导热柱的高度。

    ESD Protection For USB Memory Devices
    64.
    发明申请
    ESD Protection For USB Memory Devices 审中-公开
    USB存储设备的ESD保护

    公开(公告)号：US20090190277A1

    公开(公告)日：2009-07-30

    申请号：US12419187

    申请日：2009-04-06

    Applicant: Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

    Inventor： Siew S. Hiew ,  Nan Nan ,  Abraham C. Ma

    IPC: H02H9/00

    CPC classification number: G06F1/1632 ,  H01R12/707 ,  H01R24/62 ,  H01R2107/00 ,  H05K1/0215 ,  H05K1/0259 ,  H05K3/284 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/429 ,  H05K5/0278 ,  H05K9/0067 ,  H05K2201/0311 ,  H05K2201/09318 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10401 ,  H05K2201/10969

    Abstract: ESD protection for a portable electronic device is provided by sandwiching a metal ground layer between prepreg (i.e., FR4 or other non-conductive PCB material) layers to form an ESD preventive PCB structure, where the metal ground layer is electrically connected to one or more of the integrated circuit (IC) components (e.g., at least one controller die, a non-volatile memory die, oscillator and passive components) that are mounted on the PCB by way of conductive via structures, and is accessible by way of one or more conductive anchor hole structures to external grounding structures. The one or more conductive anchor hole structures are positioned such that the metal ground layer is automatically electrically connected to the chassis ground of a host system when the portable device is coupled to a plug structure of the host system, e.g., by way of a metal connector jacket.

    Abstract translation: 通过在预浸料（即FR4或其他非导电PCB材料）层之间夹住金属接地层，形成ESD防护PCB结构，其中金属接地层电连接到一个或多个 集成电路（IC）组件（例如，至少一个控制器管芯，非易失性存储器管芯，振荡器和无源部件），其通过导电通孔结构安装在PCB上，并且可通过一个或多个 更多的导电锚孔结构到外部接地结构。 一个或多个导电锚定孔结构被定位成使得当便携式设备耦合到主机系统的插头结构时，金属接地层自动地电连接到主机系统的机箱接地，例如通过金属 连接器外套。

    Resin molded component fitted with a metal plate and molding method therefor
    65.
    发明申请
    Resin molded component fitted with a metal plate and molding method therefor 有权
    装有金属板的树脂成型部件及其成型方法

    公开(公告)号：US20080123261A1

    公开(公告)日：2008-05-29

    申请号：US11820980

    申请日：2007-06-21

    Applicant: Akihito Maegawa ,  Shinyu Nagashima

    Inventor： Akihito Maegawa ,  Shinyu Nagashima

    IPC: G06F1/16 ,  B29C45/14

    CPC classification number: H05K3/202 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0027 ,  H05K1/056 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10651

    Abstract: A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).

    Abstract translation: 传感器单元（1）具有金属板（10），树脂模制部分（20）和油温传感器（2）。 由树脂成型部（20）配置由金属构成的母线（4）。 由于汇流条（4）在将其暴露端（4A）紧紧地保持在一对成形模上时被插入成型，所以露出端（4A）和放置表面10A之间的距离保持恒定。 此外，油温传感器（2）的门标（5D）容纳在放置面（10）的凹部（10B）中，并且接合槽（9）和接合突起（26A）接合。 因此，可以将油温传感器（2）保持在适当的姿势。 此外，通过铆接暴露的端部（4A）和油温传感器（2）的端子（8），可以将油温传感器（2）保持在放置表面（10A）上。

    Plasma display device
    66.
    发明申请
    Plasma display device 审中-公开
    等离子显示装置

    公开(公告)号：US20080094790A1

    公开(公告)日：2008-04-24

    申请号：US11907582

    申请日：2007-10-15

    Applicant: Keun-Young Song

    Inventor： Keun-Young Song

    IPC: H05K5/00

    CPC classification number: H05K7/20963 ,  H05K1/0254 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10401

    Abstract: A plasma display device includes a plasma display panel (PDP), a chassis base on the PDP, a plurality of printed circuit board assemblies (PBAs) on the chassis base and electrically connected to the PDP, at least one of the PBAs including a single-sided board with a plurality of insert-holes for electrical connection, and at least one circuit element with a plurality of leads adapted to be respectively inserted into the plurality of insert-holes of the single-sided board, wherein the single-sided board includes a plurality of slots between the insert-holes.

    Abstract translation: 等离子体显示装置包括等离子体显示面板（PDP），PDP上的底座，底座上的多个印刷电路板组件（PBA），电连接到PDP，至少一个PBA包括单个 具有多个用于电连接的插入孔的至少一个电路元件，以及至少一个电路元件，其具有适于分别插入到单面板的多个插入孔中的多个引线，其中单面板 在插入孔之间包括多个槽。

    Circuit board and method of manufacturing the same
    67.
    发明申请
    Circuit board and method of manufacturing the same 失效
    电路板及其制造方法

    公开(公告)号：US20080078572A1

    公开(公告)日：2008-04-03

    申请号：US11896204

    申请日：2007-08-30

    Applicant: Yasuto Watanabe ,  Hiroyuki Fujita ,  Kunio Watanabe

    Inventor： Yasuto Watanabe ,  Hiroyuki Fujita ,  Kunio Watanabe

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/36

    CPC classification number: H05K3/4046 ,  H05K3/0047 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/09845 ,  H05K2201/10401 ,  H05K2201/10409 ,  H05K2201/10962 ,  Y10T29/49126 ,  Y10T29/49165

    Abstract: A circuit board and a method of manufacturing the same are provided. The circuit board includes: a multilayer board in which a plurality of conductive layers with desired patterns formed therein, and a plurality of insulating layers are stacked; a plurality of through holes penetrating the multilayer board; cylindrical recesses each formed around a through hole corresponding thereto, having a diameter larger than that of the through hole, having a depth from an outermost surface of the insulating layer to a surface of the conductive layer for electrical connection, and partially exposing the surface of the predetermined conductive layer; and a plurality of conductive terminals fitted into the through holes.

    Abstract translation: 提供一种电路板及其制造方法。 电路板包括：多层板，其中形成有所需图案的多个导电层，并且堆叠多个绝缘层; 贯穿多层基板的多个通孔; 圆柱形凹部各自围绕与其对应的通孔形成，其直径大于通孔的直径，具有从绝缘层的最外表面到用于电连接的导电层的表面的深度，并且部分地暴露 所述预定导电层; 以及配置在通孔中的多个导电端子。

    Circuit board threadplate
    68.
    发明授权
    Circuit board threadplate 失效
    电路板螺纹板

    公开(公告)号：US07345247B2

    公开(公告)日：2008-03-18

    申请号：US10264366

    申请日：2002-10-04

    Applicant: John A. Ireland

    Inventor： John A. Ireland

    IPC: H05K1/11 ,  H01R12/04

    CPC classification number: H05K3/325 ,  H05K3/341 ,  H05K3/3447 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/5313

    Abstract: A circuit board threadplate for connection of a component to a circuit board is provided wherein such threadplate may be mechanically mounted to a circuit board without the use of manual labor. Specifically, the threadplate is compatible with present Surface Mount Technology robotic placement machines. Such circuit board threadplate includes a hollow substantially cylindrical member forming an extruded neck having an elongated section and a substantially flat surface at a first end of the elongated section and a flange extending from a second end of the elongated section. The flange provides a substantially flat surface suitable for soldering onto a surface of a circuit board. Additionally, the threadplate includes a cylindrical cavity positioned inside the substantially cylindrical member, extending in a direction aligned with the substantially cylindrical member. The cylindrical cavity may have a thread pattern suitable for receiving a screw-type fastener. Finally, the threadplate includes an opening providing access to the cylindrical cavity.

    Abstract translation: 提供了用于将部件连接到电路板的电路板螺纹板，其中这种螺纹板可以机械地安装到电路板而不使用体力劳动。 具体来说，螺纹板与现有的表面贴装技术机器人放置机器兼容。 这种电路板螺纹板包括形成挤出颈部的中空的基本上圆柱形的构件，其具有在细长部分的第一端处的细长部分和基本上平坦的表面，以及从细长部分的第二端延伸的凸缘。 凸缘提供适于焊接到电路板表面上的基本上平坦的表面。 此外，螺纹板包括位于基本上圆柱形构件内部的圆柱形空腔，其沿与大致圆柱形构件对准的方向延伸。 圆柱形腔可以具有适于接收螺旋型紧固件的螺纹图案。 最后，螺纹板包括提供通向圆柱形空腔的开口。

    Circuit board
    70.
    发明授权
    Circuit board 失效
    电路板

    公开(公告)号：US06617520B1

    公开(公告)日：2003-09-09

    申请号：US09650824

    申请日：2000-08-30

    Applicant: Robert H. Martter ,  Craig C. Sundberg ,  Richard N. Giardina ,  Brian S. Fetscher ,  G. James Deutschlander

    Inventor： Robert H. Martter ,  Craig C. Sundberg ,  Richard N. Giardina ,  Brian S. Fetscher ,  G. James Deutschlander

    IPC: H05K103

    CPC classification number: H05K3/3447 ,  H05K1/053 ,  H05K2201/10287 ,  H05K2201/10401 ,  H05K2201/10916 ,  Y10T29/49165

    Abstract: A circuit device and a method for providing an interface between a circuit device comprised of a porcelain enameled metal substrate and an external electrical conductor such as a wire or a lead. An aperture is formed in the substrate at the location where the connection is desired. An eyelet is then placed in the aperture. Crimping or other means are used to form a mechanical connection to the substrate and causes the eyelet to be retained in the aperture. The wire or lead of an electronic component is then inserted into the eyelet. The wire or lead is then soldered to the eyelet providing a joint of high mechanical strength.

    Abstract translation: 一种电路器件和用于在由瓷漆包金属基底和外部电导体（例如导线或引线）组成的电路器件之间提供界面的方法。 在需要连接的位置处在基板中形成孔。 然后将孔眼放置在孔中。 使用压接或其它装置来形成与基板的机械连接，并使孔眼保持在孔中。 然后将电子元件的导线或引线插入孔眼中。 然后将导线或引线焊接到孔眼，提供高机械强度的接头。

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